• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.6
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• pp.554-560
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• 2019

In this study, after applying the finite failure NHPP Rayleigh distribution model and NHPP Inverse Rayleigh distribution model which are widely used in the field of software reliability to the software development cost model, the attributes of development cost and optimal release time were compared and analyzed. To analyze the attributes of software development cost, software failure time data was used, parametric estimation was applied to the maximum likelihood estimation method, and nonlinear equations were calculated using the bisection method. As a result, it was confirmed that Rayleigh model is relatively superior to Inverse Rayleigh model because software development cost is relatively low and software release time is also fast. Through this study, the development cost attributes of the Rayleigh model and the Inverse Rayleigh model without the existing research examples were newly analyzed. In addition, we expect that software developers will be able to use this study as a basic guideline for exploring software reliability improvement method and development cost attributes.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of Energy Engineering
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• v.7 no.2
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• pp.172-179
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• 1998

In this paper, an alternative method which can evaluate a marginal power exceeding yearly peak load for each load bus is proposed. The proportion of the marginal power to yearly peak load for each load bus is defined as Local Marginal Power Rate (LMPR). Furthermore, the composite system is separated base on the LMPR. The bottleneck facilities could be found, while the LMPR is estimated. Then, it is possible to provide information concerning improvement in the system reliability by bottleneck facilities. The IEEE Reliability Test System (RTS) is used to demonstrate the effectiveness of the proposed algorithm.

• Journal of Korea Society of Digital Industry and Information Management
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• v.13 no.3
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• pp.43-51
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• 2017

MANET consists of only wireless nodes having limited processing capability. It processes routing and data transmission through cooperation among each other. And it is exposed to many attack threats due to the dynamic topology by movement of nodes and multi-hop communication. Therefore, the reliability of transmitted data between nodes must be improved and security of integrity must be high. In this paper, we propose a method to increase the reliability of transmitted data by providing a secure cryptography protocol. The proposed method used a hierarchical structure to provide smooth cryptographic services. The cluster authentication node issues the cluster authentication key pair and unique key to the nodes. The nodes performs the encryption through two steps of encryption using cluster public key and block encryption using unique key. Because of this, the robustness against data forgery attacks was heightened. The superior performance of the proposed method can be confirmed through comparative experiment with the existing security routing method.

• Journal of the Korea Safety Management & Science
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• v.6 no.4
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• pp.215-226
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• 2004

This study develops a improved gate assignment algorithm and decision support system using its algorithm to extract a assignment result minimizing a walking distance of passengers in airport and maximizing the utilization rate of avaliable gates in domestic airports. By operation support system, it may contribute greatly in efficient enlargement of airport operation and increase the airport reliability through quickly coping with takeoff and landing delay of flight due to weather change, preservation and repair of gate, etc. Also, passengers who use airport terminal can minimize time and walking distance for departure, arrival, and transit, and it may greatly reduce the additional operation cost for common gates through maximizing the utilization rate for exclusive usage gates for airplanes which use gates.

• Proceedings of the Safety Management and Science Conference
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• 2004.11a
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• pp.221-227
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• 2004

This study develops a improved gate assignment algorithm and decision support system using its algorithm to extract a assignment result minimizing a walking distance of passengers in airport and maximizing the utilization rate of avaliable gates in domestic airports. By operation support system, it may contribute greatly in efficient enlargement of airport operation and increase the airport reliability through quickly coping with takeoff and landing delay of flight due to weather change, preservation and repair of gate, etc. Also, passengers who use airport terminal can minimize time and walking distance for departure, arrival, and transit, and it may greatly reduce the additional operation cost for common gates through maximizing the utilization rate for exclusive usage gates for airplanes which use gates.

• Journal of the Korea Safety Management & Science
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• v.7 no.3
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• pp.47-61
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• 2005

Many researchers have proved that risk measurement of information systems is a very effective tool for improving confidence of information systems. However, information system risk in Korea still includes many subjective judgements. This study deals with applying a quantitative model to improve risk measurement of information system quality. First of all, we have come up with solutions to improve the evaluation efficiency on risk measurement. We have merged the risk guidelines of COBIT and CMM, and developed a quantified evaluation scheme that call by risk point. We have proved the validity of this model by interviews with experts and by case studies.

• Journal of the Korea Safety Management & Science
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• v.12 no.3
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• pp.231-235
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• 2010

Recently, according to the total quality management environment, the necessity of the systematic administration about the quality information is gradually enlarged as to vehicle related company. Accordingly, related companies require the operation of the information management system matched with the quality administration task level. And through the storage and share of the efficient quality information, they try to solve the customer claim about the quality and prevent the quality problem recurrence of product. This research suggests the standard business process of the auto part supplier for the efficient management of the quality information and the quick correspondence of the quality problem. In addition, by building and managing the quality information management system will be able to expect the more efficient quality management and the product reliability insurance.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.51 no.5
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• pp.175-181
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• 2002

In this paper, fault tolerant digital governor is designed to realize ceaseless controlling and to improve the reliability of control system. Designed digital governor huts duplex I/O module and triplex CPU module and also 2 out of 3 voting algorithm and self diagnostic ability. The Processor module of the system(SIDG-3000) is developed based on 32 Bit industrial microprocessor, which guaranteed high quality of the module and SRAM for data also SRAM for command are separated. The process module also includes inter process communication function and power back up function (SRAM for back-up). System reliability is estimated by using the model of Markov process. It is shown that the reliability of triplex system in mission time can be dramatically improved compared with a single control system Designed digital governor system is applied after modelling of the steam turbine generator system of Buk-Cheju Thermal Power Plant. Simulation is carried out to prove the effectiveness of the designed digital governor system