• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.2
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• pp.45-50
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• 2005

During oxidation process, several type of defects are formed on the surface of the silicon crystal which was damaged mechanically before oxidation. As the size of abrasive particle increases multiple dislocation loops are produced favorably over oxidation-induced stacking faults, which are dominantly produced when ground with finer abrasive particle. These defects are not related with the crystal growth process like Czochralski or directional solidification. During directional solidification process, twins and stacking faults are the two major defects observed in the bulk of the silicon crystal. On the other hand, slip dislocations produced by the thermal stress are not observed. Thus, not only in single crystalline silicon crystal but also in multi-crystalline silicon, extrinsic gettering process with programmed production of surface defects might be highly applicable to silicon wafers for purification.

• Proceedings of the Korean Fiber Society Conference
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• 2003.04a
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• pp.21-24
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• 2003

SiO$_2$ 입자는 촉매, 촉매의 담체, 크로마토그래피를 위한 충진제등 여러 산업에 응용되고 있다.$^{1)}$ 본 연구 에서는 기능성을 가지는 입자를 제조하기 위해 SiO$_2$로써 기본적인 입자를 제조하고, 그 속에 소취특성을 가지는 TiO$_2$와 날염을 위한 EVA-microsphere를 포함시켜서 소취제로서, 그리고 날염 분체로서의 기능을 가진 입자들을 제조하고자 하였다. 실리카(silica)는 일반적으로 규소산화물을 지칭하는 명칭으로서, SiO$_2$뿐 아니라 결정구조상 4-6개의 산소원자로 둘러싸인 모든 형태의 규소산화물을 지칭 하는 것이고$^{2)}$ 수용액상의 물유리는 실리카 졸의 값싼 상품으로 산업분야에 널리 알려져 있다. (중략)

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.230-230
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• 2010

질화갈륨 기반의 III족-질화물 계열의 반도체 물질은 녹색-자외선 영역의 발광다이오드에 응용되어 왔으며 고효율, 고휘도 발광소자의 구현 및 성능 향상을 위해 많은 연구가 진행되었다. 일반적으로 널리 사용되어온 c축 방향으로 성장된 질화갈륨 기반 발광다이오드에서는 활성층의 에너지 밴드구조가 내부전기장에 의해 변형되어 전자와 정공의 재결합 확률이 저하된다. c축 방향으로 형성되는 내부전기장은 축방향으로의 자발적 분극화와 높은 압전 분극 현상에 기인한다. 이와 같은 분극 성장에서의 내부양자효율 저하 현상을 해결하기 위하여 내부 전기장이 존재하지 않는 a축과 m축과 같은 무분극 방향으로의 성장이 집중적으로 연구되고 있다. 현재 사파이어 기판위에서 무분극 성장된 박막은 높은 밀도의 결함이 발생하여 고품위의 발광다이오드 동작에 어려움을 겪고 있다. 최근 결함 밀도를 낮추고 높은 결정성을 갖는 무분극 질화갈륨 박막을 성장하기 위하여 2-단계 성장 방법, 나노구조층 삽입, 산화규소 마스크 패턴 등 다양한 성장 방법들이 연구되어 주목할 만한 연구 결과들이 보고되고 있다. 다양한 성장 방법들에 의해 성장된 박막들은 고유한 특성들을 보이는데, 특히 박막 성장방법에 따라 박막 내부에 형성되는 깊은 준위의 특성들은 발광다이오드의 소자 특성에도 큰 영향을 미치게 되므로 무분극 박막에서의 깊은 준위에 대한 연구가 필요하다. 본 연구에서는 금속-유기 화학기상증착 방법으로 r면의 사파이어기판 위에 a면의 질화갈륨을 성장시켰다. 고품질의 결정성을 구현하기 위해 저온 핵형성층, 3차원 성장층, 2차원 중간온도 성장층, 2차원 성장층의 4개 버퍼층을 사용하였으며, 질화규소 나노구조층을 삽입함으로써 고품 위의 a면 질화갈륨 박막을 구현하였다. 성장된 a면 질화갈륨 박막에 형성된 깊은 준위들은 접합용량과도분광법을 이용하여 분석되었으며 질화규소 삽입층의 유무에 따른 깊은 준위의 특성 차이에 대한 연구를 수행하였다.

• Journal of the Korean Chemical Society
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• v.60 no.4
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• pp.239-244
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• 2016

We investigated the structures and electronic properties of Cu_mSiO_m+1 clusters with m = 0 - 7. For these clusters, we replaced a Cu atom in the copper oxide clusters with a Si atom. The B3LYP functional and LANL2DZ basis set were used for optimization of the molecular structures of all neutral and charged clusters. The bond distances, bond angles, and Mulliken charges were calculated to study the structural properties. In addition, in order to understand the electronic properties, we examined the ionization energies, electronic affinities, and second differences in energies.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.835-842
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• 1999

Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.1
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• pp.15-21
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• 2008

SiC has an excellent resistance to oxidation and corrosion, high temperature strength and good thermal conductivity. However, it is difficult to density because of its highly covalent bonding characteristics. Hot-press sintering process was applied to fabricate fully densified SiC ceramics with carbon and boron addition as a sintering additive. The addition of carbon improved the mechanical properties of SiC because it could induce a fine and homogeneous microstructure by the suppression of abnormal growth of SiC grain. Also, the addition of carbon could control the phase transformation of SiC. The phase transformation of 6H to 4H increased with sintering temperature but the addition of carbon decreased that kind of phase transformation.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.389-396
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• 2008

The effect of thermal cycling on bond strength and residual stress at the interface between benzocyclobutene (BCB) and plasma enhanced chemical vapor deposited (PECVD) silicon dioxide ($SiO_2$) coated silicon wafers were evaluated by four point bending and wafer curvature techniques. Wafers were bonded using a pre-established baseline process. Thermal cycling was done between room temperature and a maximum peak temperature. In thermal cycling performed with 350 and $400^{\circ}C$ peak temperature, the bond strength increased substantially during the first thermal cycle. The increase in bond strength is attributed to the relaxation in residual stress by the condensation reaction of the PECVD $SiO_2$: this relaxation leads to increases in deformation energy due to residual stress and bond strength.

• Journal of the Korean Ceramic Society
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• v.13 no.1
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• pp.11-19
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• 1976

This study was focused on the improvement of production techniques of small crucibles in relation with the appropriate selection of raw materials, various batch compositions and physical and chemical characteristics of the crucibles. Various tests gave the optimum batch composition for the carbon bond graphite cructble as follows: Pyontaek graphite flake (refractory aggregate) : 40Part Silicon carbide: 15Part Tar pitch (binder) : 11Part Inorganic additives (to improve the oxidation resistance) : 15 Part Cryolite : 3 Part Ferro manganese : 2 Part Ferrosilicon : 25 Part Crucibles pressed with 400kg/$\textrm{cm}^2$ at 12$0^{\circ}C$. and fired in reducing atmosphere at 120$0^{\circ}C$ brought the most favorable results as follows: Bulk density : 2.31 Apparent density : 2.58 Porosity : 15.2% Oxidation loss at 1, 50$0^{\circ}C$. for 3 hrs : below 3.77% Water absorption : 6.01% Compressive strength : 438kg/$\textrm{cm}^2$ Tensile strength : 256kg/$\textrm{cm}^2$.

• Applied Chemistry for Engineering
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• v.18 no.3
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• pp.227-233
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• 2007

Carbon/carbon (C/C) composites as unique materials possess exceptional thermal resistance with light weight, high stiffness, and strength even at high temperature. However, one serious obstacle for application of the C/C composites is their poor oxidation resistance in high temperature oxidizing environments. SiC coating has been employed to protect the composites from oxidation. This study explored combustion characteristics of 4-directional (4D) carbon/carbon composites using liquid fuel rocket engine to investigate ablative motion of the materials. C/C composites were made of coal tar pitch as a matrix precursor, and heat-treated at $2300^{\circ}C$. Throughout repeated densification process, the density of the material reached $1.903g/cm^3$. After machining 4D C/C composites, the nozzle surface was coated by a SiC layer by pack-cementation method to improve oxidation resistance. Erosion characteristics of SiC-coated C/C composites were measured as function of the ratio of oxygen to fuel. The morphological change of the composites after combustion test was investigated using SEM and erosion mechanism also was discussed.

• Journal of the Korean Vacuum Society
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• v.14 no.2
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• pp.78-83
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• 2005

Nanometric crystalline silicon (no-Si) embedded in dielectric medium has been paid attention as an efficient light emitting center for more than a decade. In nc-Si, excitonic electron-hole pairs are considered to attribute to radiative recombination. However the surface defects surrounding no-Si is one of non-radiative decay paths competing with the radiative band edge transition, ultimately which makes the emission efficiency of no-Si very poor. In order to passivate those defects - dangling bonds in the $Si:SiO_2$ interface, hydrogen is usually utilized. The luminescence yield from no-Si is dramatically enhanced by defect termination. However due to relatively high mobility of hydrogen in a matrix, hydrogen-terminated no-Si may no longer sustain the enhancement effect on subsequent thermal processes. Therefore instead of easily reversible hydrogen, phosphorus was introduced by ion implantation, expecting to have the same enhancement effect and to be more resistive against succeeding thermal treatments. Samples were Prepared by 400 keV Si implantation with doses of $1\times10^{17}\;Si/cm^2$ and by multi-energy Phosphorus implantation to make relatively uniform phosphorus concentration in the region where implanted Si ions are distributed. Crystalline silicon was precipitated by annealing at $1,100^{\circ}C$ for 2 hours in Ar environment and subsequent annealing were performed for an hour in Ar at a few temperature stages up to $1,000^{\circ}C$ to show improved thermal resistance. Experimental data such as enhancement effect of PL yield, decay time, peak shift for the phosphorus implanted nc-Si are shown, and the possible mechanisms are discussed as well.