• Title/Summary/Keyword: 산화구리

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Removal of Copper Ion with Iron-Oxide-Coated Sand (산화철 피복사에 의한 구리이온제거)

  • 곽명화;우성훈;김익성;박승조
    • Resources Recycling
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    • v.9 no.1
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    • pp.70-75
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    • 2000
  • The sand particle was coated with $Fe_3O_4$ and then $Fe_2O_3$ that adsorption capacity was more excellent than $Fe_3O_4$ was mostly found in 2nd step for preparation of iron-oxide-coated sand (IOCS). The copper removal rate was 74.9 percent by adding 30 gram per liter iron-oxide-coated sand from the solution with 5 mg/l Cu in 20 minute. Breakthrough time occurred in 23 hours and adsorption capacity 0.87$\cdot$Cu/g$\cdot$IOCS in case of breakthrough copper concentration was 1.0 mg/l in the continuous test.

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A Study on the Properties of Produced Powder by Spray Pyrolysis Process from Waste Copper Chloride Solution. (폐구리염화물용액의 분무열분해반응에 의한 생성분말의 특성에 관한 연구)

  • 박희범;최재권;한진아;유재근
    • Proceedings of the KAIS Fall Conference
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    • 2001.05a
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    • pp.47-48
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    • 2001
  • 본 연구의 목적은 폐 구리염화물 용액을 원료로 사용하여 분무열분해 공정에 의해 평균입도가 1㎛이하이며 입도분포가 균일하고 치밀한 조직을 나타내는 미립의 구리산화물 분말을 제조하는데 있다. 또한 본 연구에서는 분무열분해 공정에 의해 생성되는 분말의 특성에 영향을 미치는 반응 온도, 원료용액의 유입속도, 분위기 기체 및 공기의 유입속도, nezzle tip 크기 및 원료용액의 농도 등의 반응인자들의 영향을 검토하였다.

Chloride Ion Effects on Anodic Dissolution of Copper in Aqueous NaCl Solutions under Argon Atmosphere (아르곤 분위기의 NaCl 수용액에서 구리의 산화 용해반응에 미치는 염화이온의 영향)

  • Chon, Jung-Kyoon;Kim, Youn-Kyoo
    • Journal of the Korean Electrochemical Society
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    • v.11 no.3
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    • pp.159-164
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    • 2008
  • We investigated chloride ion effects on anodic dissolution of copper using potentiodynamic method, cyclic voltammtery, chronoamperometry and chronocoulometry. The anodic dissolution reaction of copper in NaCl solution under argon atmosphere is $Cu+2Cl^{-}{\rightleftharpoons}{CuCl_2}^{-}+e^-$ and chloride ion adsorption process in copper surface can be explained by Temkin isotherm.

Development, Test, and Analysis of Jet Vane Thrust Vector Control System (제트베인 추력방향 제어장치 개발/시험/분석)

  • 장승교;윤현걸;장석태
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1998.10a
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    • pp.31-31
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    • 1998
  • 제트베인을 이용한 추력방향 제어장치를 개발하여 평균추력 2950 lbf, 평균 압력 714 psig, 연소시간 4.8초, 노즐 출구직경 약 100mm인 추진기관에 장착하고 이를 시험하고 분석하였다. 재질에 따른 제트베인의 삭마성을 알아보기 위하여 텅스텐과 구리(W/Cu), 지르코늄산화물과 텅스텐(ZrO$_2$/W), 지르코늄 산화물과 몰리브덴(ZrO$_2$/Mo)의 3가지 재질의 베인을 사용하였다 시험된 제트베인 재질 중 지르코늄 산화물과 몰리브덴(ZrO$_2$/Mo)의 합금을 사용한 베인이 내열성 및 삭마성에서 가장 우수하였으며(삭마량 27.65% 삭마율 5.7mm/sec), 지르코늄 산화물과 텅스텐(ZrO$_2$/W), 텅스텐과 구리(W/Cu)의 순서이었다.

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Oxidation of Ascorbic Acid by Crosslinked Poly(4-vinyl pyridine)-Cu(II) Complexes 2. Effect of Crosslinker (가교 폴리(4-비닐피리딘)-구리(II) 착물에 의한 Ascorbic Acid의 산화반응 2. 가교제의 영향)

  • 이석기;서재곤;구광모;전일련;김우식
    • Polymer(Korea)
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    • v.24 no.2
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    • pp.252-258
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    • 2000
  • Various crosslinked poly(4-vinylpyridines) (CHP4VP) having different degrees of crosslinking were synthesized by radical copolymerization of 4-vinylpyridine with if N,N' -1, 6-hexamethylenebisacrylamide, and CHP4VP- Cu(II) complexes were prepared by the method of adsorption equilibrium. The catalytic activity of the complexes for the oxidation of ascorbic acid (AA) was investigated. The oxidation of AA by these complexes showed a kinetic behavior of the Michaelis-Menten type. The catalytic activity of CHP4VP-Cu(I ) catalytic system was increased with increasing the degree of crosslinking of CHP4VP, and its activity was scarcely decreased even after repeated use. However, the tendency of the catalytic activity of CHP4VP-Cu(II) complexes was decreased for the oxidation of AA when compared with that of the previously reported catalytic system containing crosslinked poly(4-vinylpyridine) prepared using N,N'-methylenebisacrylamide as a crosslinker. These results indicate that the degree of crosslinking of CHP4VP and the hydrophobicity of the crosslinker play an important role in the catalytic system of the oxidation of AA.

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Transmissivity property of condition of melting temperature and added quantity of copper of phosphate glass for ir filter (Ir-filter용 인산계 유리의 용융조건과 Cu 첨가량에 따른 투과율 특성)

  • Kim, Seong-Il;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Jin-Ho;Choi, Duck-Kyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.337-337
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    • 2009
  • 가시광선영역에서 매우 균일한 높은 투과성뿐만 아니라 근적외선영역에서 가파른 홉수성 엣지와 함께 낮은 투과율을 제공하는 산화구리(II)를 함유하는 포스페이트 유리는 컬러 비디오 카메라의 컬러 보정 필터, 발광 컬러 디스플레이용 보호판(sheild), 모노크로메이터의 미광 필터, 플라스틱 복합재 필터의 무기 성분 및 CCD(전하 결합 소자) 및 CMOS(상보성 금속 산화물 반도체) 카메라 및 검출기 분야용 필터 유리로서 사용된다. 용융온도 및 산화구리(II) 첨가량에 따른 투과율을 측정하기 위해 포스페이트 유리 시료를 $1100\sim1500^{\circ}C$ 용융한 후 $400^{\circ}C$에서 2시간 동안 어닐링 공정을 거쳐 제조하였다. 제조된 시료는 두께 0.3mm로 폴리싱하여 자외선-적외선 분광 광도기를 이용하여 광학적 특성을 측정하였다. 본 실험을 통하여 용융온도에 따라 가시광선영역 및 근적외선영역에서의 투과율 거동을 비교한 결과 $1100\sim1200^{\circ}C$에서의 우수한 투과율 특성을 나타냈다. 용융온도가 내려감에 따른 가시광선영역 (400~600nm)에서 높은 투과율 및 근적외선영역 (750~1100nm)에서 낮은 투과율과 가파른 흡수성 엣지를 나타냈다.

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Surface Complexation of Cationic Metal Adsorption Onto Amorphous Aluminum Oxide (무정형 알루미늄 산화물에 의한 양이온 중금속의 표면착화)

  • Park, Youn-Jong;Yang, Jae-Kyu;Choi, Sang-Il
    • Journal of Soil and Groundwater Environment
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    • v.13 no.1
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    • pp.101-109
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    • 2008
  • The adsorption characteristics of cationic metals such as copper, cadmium, and lead onto the amorphous aluminum oxide, AMA-L, which was mineralized from raw sanding powder at $550^{\circ}C$ were investigated. Additionally, surface complexation reaction of cationic heavy metals onto AMA-L was simulated with MINEQL + software employing a diffuse layer model. From the batch adsorption tests in a single element system, the adsorption affinity of each metal ion onto AMA-L was following order: lead > copper > cadmium. In a binary system composed with copper and cadmium, quite a similar adsorption affinity was observed in each metal ion compared to the single element system. When the surface complexation constants obtained in the single system were used in the prediction of experimental adsorption results, model predictions were well fitted with experimental results of both single and binary systems.

On Atmospheres for Firing the Thick Film Coper Conductors (Thick Film Copper Conductor 의 소결과 소성 분위기)

  • Lee, Joon
    • Applied Chemistry for Engineering
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    • v.2 no.3
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    • pp.193-198
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    • 1991
  • Thick film copper conductors are of considerable interest in thick film industries because of both the potential cost saving compared to the noble metal conductors and the favorable properties in electrical conductivity, solderability, solder leach resistance and wire bondability, However, formation of the excellent copper thick film is a lot complicated due to easily oxidizing property of copper at high temperature. In order to get favorable thick film copper conductor, hybrid microcircuit industry utilizes majorly three kinds of firing atmosphere, such as nitrogen atmosphere, reactive atmosphere and air atmosphere. The processes and the three atmospheres for firing thick film copper conductor were extensively reviewed in this article.

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