• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.538-538
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• 2008

금속계열의 박막을 평탄화하기위해서는 슬러리에 함유된 산화제에 의해 부동태층의 형성이 선행되어야 한다. 따라서 본 논문에서는 Copper 박막의 표면을 부동태층으로 형성시키고 CMP공정을 하기위해 산화제에 dipping을 시켰으며 삼화제의 종류는 $H_2O_2$, MSW2000B, $KIO_3$로 하고 dipping 시간은 30초, 60초, 90초, 3분, 10분으로 하여 시간과 산화제 종류에 따른 부동태층의 변화를 연구하였다. 부동태층의 관찰은 FESEM을 이용하여 표면과 단면을 관찰하였고 부동태층의 조성비율은 EDX를 이용하여 조사하였다. MSW 2000B의 경우는 부동태층이 덩어리 모양으로 형성되었으며 포화현상은 3분에 일어났다. 반면에 $H_2O_2$의 경우는 부동태층이 침상 모양으로 형성되었으며 포화현상은 90초에 일어났다. 산화제에 의해 부동태층을 형성시킨 후 POLI-450을 이용하여 평탄화공정을 진행하였으며 CMP공정조건은 부동태층의 연질상태임을 감안하여 헤드 스피드 20rpm, 플레이튼 스피드 10rpm, 슬러리 주입속도 90ml/min, 공정온도는 상온으로 하여 진행하였다. $H_2O_2$를 산화제로 사용하여 dipping을 하고 CMP를 하였을 경우에 균일한 박막을 확보 할 수 있었으며 CMP 공정 후 copper 박막의 균일성은 FESEM을 이용하여 관찰 하였다.

• Proceedings of the Safety Management and Science Conference
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• 2012.11a
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• pp.377-383
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• 2012

순수한 우라늄 금속은 칩이나 분말로 존재할 경우 반응면적이 넓어 자연 발화할 정도의 산화력을 지니며 산화열이 높기 때문에 운반 및 처리시 화재의 위험성이 있다. 따라서 이들을 장기보관하거나 영구처분시 안정한 형태의 전환이 우선되어야 한다. 외국의 경우 감손우라늄 폐기물을 자연에서 가장 안전한 상태인 산화우라늄의 형태로 산화 처리 후 영구처분하고 있으며, 이를 위하여 우라늄 칩의 산화거동에 관한 연구가 수행 되었다. 우라늄 칩을 안전하게 보관하려면 불활성 분위기를 형성해 주든가 또는 우라늄 칩의 표면에 부동태층을 형성시켜야 한다. 또는 우라늄 칩을 광유속에 넣어 공기나 물이 우라늄 칩에 접촉되지 않는 방법으로 보관하는 것이 바람직하다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.3
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• pp.203-207
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, the $SF_6$ plasma treatment subsequent to the etch has been carried out. A passivation layer is formed by fluorine-related compounds on etched Al-Cu alloy surface after $SF_6$ treatment, and the layer suppresses effectively the corrosion on the surface as the RF power of $SF_6$ treatment increases. The corrosion could be suppressed successfully with $SF_6$ treatment in the RF power of 150watts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.540-540
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• 2008

본 논문에서는 KOH 전해액을 이용하여 Cu 막의 부동태층의 형성을 I-V를 통해 평가하였으며, 이를 토대로 최적화된 전압과 시간을 알 수 있었다. 또한, SEM, EDS, XRD를 통해 표면 품질 및 성분 분석을 비교 분석하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.7
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• pp.517-521
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS(X-ray pheotoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, $CHF_3$ plasma treatment subsequent to the etch has been carried put. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after $CHF_3$ treatment, and the layer suppresses effectively the corrosion on the surface as the $CHF_3$treatment in the pressure of 300m Torr.

• Resources Recycling
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• v.3 no.2
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• pp.17-23
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• 1994

The dissolution of gold and silver from concentrate was studied with acidic thiourea solution. The results showed that the gold and silver extraction was severely affected by concentration of thiourea and oxidant, pulp density, etc. Especially, oxidant such as ferric ions enhanced the leching rate of gold and silver. High concentration of ferric ions, however, dissolved the sulfide ore to form electrochemically passive layer on the surface of ore particles, which caused the precious metal not to be leached out from the ore. The use of $SO_2$could not effectively enhance the recovery of precious metal but reduce to some extent the consumption of thiourea. The leaching of gold and silver was achieved with recovery more than 90% and 80%, respectively, under the following conditions; Thiourea conc. :0.4M Oxidant : None $H_2SO_4$ conc. : 0.5M Pulp density : <10% Leaching time :4 Hrs Potential :250mV The Thiourea was consumed about 10% in comparison with its initial concentration.

• Resources Recycling
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• v.31 no.3
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• pp.61-72
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• 2022

We investigated the electrochemical behavior of Sn (93.0 %)-Ag (4.06 %)-Cu (0.89 %) during electrolysis of Pb-free solder waste to recover tin and silver. A thin strip of the solder waste produced by high-temperature melting and casting was used as a working electrode to perform electrochemical analysis. During anodic polarization, the current peak of an active region decreased with an increase in the concentration of sulfuric acid used as an electrolyte. This resulted in the electro-dissolution of the working electrode in the electrolyte (1.0 molL^-1 sulfuric acid) for a constant current study. The study revealed that the thickening of an anode slime layer at the working surface continuously increased the electrode potential of the working electrode. At 10 mAcm^-2, the dissolution reaction continued for 25 h. By contrast, at 50 mAcm^-2, a sharp increase in the electrode potential stopped the dissolution in 2.5 h. During dissolution, silver enrichment in the anode slime reached 94.3% in the 1 molL^-1 sulfuric acid electrolyte containing a 0.3 molL^-1 chlorine ion, which was 12.7% higher than that without chlorine addition. Moreover, the chlorine enhanced the stability of the dissolved tin ions in the electrolyte as well as the current efficiency of tin electro-deposition at the counter electrode.