Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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The Effects of Fluorine Passivation on $SF_6$ Treatment for Anti-corrosion after Al(Cu 1%) Plasma Etching

Al(Cu 1%)막의 플라즈마 식각후 부식 억제를 위한 $SF_6$ 처리시 fluorine passivation 효과

  • 김창일 (중앙대학교 전자전기공학부) ;
  • 권광호 (한서대학교 전자공학과) ;
  • 백규하 (한국전자통신연구원 반도체연구단) ;
  • 윤용선 (한국전자통신연구원 반도체연구단) ;
  • 김상기 (한국전자통신연구원 반도체연구단) ;
  • 남기수 (한국전자통신연구원 반도체연구단)
  • Published : 1998.03.01
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Abstract

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, the $SF_6$ plasma treatment subsequent to the etch has been carried out. A passivation layer is formed by fluorine-related compounds on etched Al-Cu alloy surface after $SF_6$ treatment, and the layer suppresses effectively the corrosion on the surface as the RF power of $SF_6$ treatment increases. The corrosion could be suppressed successfully with $SF_6$ treatment in the RF power of 150watts.

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References

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