• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.194-194
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• 2010

Charge trap flash (CTF) 구조를 가진 플래시 메모리 소자는 기존의 플래시 메모리 소자에 비해 쓰고 지우는 속도가 빠르고, 데이터의 저장 기간이 길며, 쓰고 지우는 동작에 의한 전계 스트레스에 잘 견디는 장점을 가지고 있다. 이러한 장점에도 불구하고 CTF 플래시 메모리에서도 수십 나노 이하로 소자의 셀 사이즈가 감소함에 따라 단 채널 효과, 펀치스루 현상 및 셀 사이의 간섭현상이 발생함에 따라 이러한 문제들을 해결해야 한다. 인접한 셀 사이에 발생하는 간섭 현상에 대해선 플로팅 게이트를 사용한 플래시 메모리 소자에 대하여 많은 연구가 진행되었으나, CTF 플래시 메모리 소자에서 나타나는 셀 사이의 간섭현상에 대한 연구는 만히 진행되어 있지 않다. 본 연구에서는 CTF 플래시 메모리 소자의 셀 사이의 간격이 작아짐에 따라 발생하는 인접한 셀 간의 간섭 현상에 대해 관찰하였다. CTF 플래시 메모리 소자의 셀 사이의 간격에 따른 비교를 위하여 각 소자의 셀을 구성하는 터널링 산화막, 질화막 및 블로킹 산화막의 두께를 동일하게 하였다. 각 셀 사이의 간격이 감소함에 따라 발생하는 소자의 전기적 특성을 TCAD 시뮬레이션 툴인 Sentaurus를 사용하여 계산하였다. 인접한 셀의 상태에 따라 발생하는 간섭 효과를 확인하기 위해 word line (WL)과 bit line (BL) 방향에 있는 주변 셀의 프로그램 상태에 따른 선택한 셀의 문턱전압이 변화 정도를 관찰하였다. 시뮬레이션 결과는 셀 사이의 간섭효과가 WL 방향에 의한 간섭 현상보다 BL 방향에 의한 간섭 현상보다 크다. 시뮬레이션한 전류-전압 특성 결과는 CTF 플래시 메모리 소자가 비례 축소할 때 인접하는 셀 사이에 간격이 15 nm 이하로 줄어들 경우에 간섭 현상이 급격히 증가하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.1-7
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• 2004

We performed two-dimensional (20) computer-based modeling and simulation of FinFET by solving the coupled Poisson-Schrodinger equations quantum-mechanically in a self-consistent manner. The simulation results are carefully investigated for FinFET with gate length(Lg) varying from 10 to 80nm and with a Si-fin thickness($T_{fin}$) varying from 10 to 40nm. Current-voltage (I-V) characteristics are compared with the experimental data. Device optimization has been performed in order to suppress the short-channel effects (SCEs) including the sub-threshold swing, threshold voltage roll-off, drain induced barrier lowering (DIBL). The quantum-mechanical simulation is compared with the classical appmach in order to understand the influence of the electron confinement effect. Simulation results indicated that the FinFET is a promising structure to suppress the SCEs and the quantum-mechanical simulation is essential for applying nano-scale device structure.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.887-890
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• 2005

The double gate(DG) MOSFET is a promising candidate to further extend the CMOS scaling and provide better control of short channel effect(SCE). DGMOSFETs, having ultra thin updoped Si channel for SCEs control, are being validated for sub-20nm scaling, A channel effects such as the subthreshold swing(SS), and the threshold voltage roll-off(${\Delta}V_{th}$). The propsed model includes the effects of thermionic emission and quantum tunneling of carriers through the source-drain barrier. The proposed model is used to design contours for gate length, channel thickness, and gate oxide thickness.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.1
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• pp.82-89
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• 2017

In this work, InGaZnO thin film transistors with Ni, Al and ITO source and drain electrode materials were fabricated to analyze a hot carrier induced device degradation according to the electrode materials. From the electrical measurement results with electrode materials, Ni device shows the best electrical performances in terms of mobility, subthreshold swing, and $I_{ON}/I_{OFF}$. From the measurement results on the device degradation with source and drain electrode materials, Al device shows the worst device degradation. The threshold voltage shifts with different channel widths and stress drain voltages were measured to analyze a hot carrier induced device degradation mechanism. Hot carrier induced device degradation became more significant with increase of channel widths and stress drain voltages. From the results, we found that a hot carrier induced device degradation in InGaZnO thin film transistors was occurred with a combination of large channel electric field and Joule heating effects.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.05a
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• pp.527-528
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• 2017

Current-voltage characteristics of source-overlapped gate tunnel field-effect transistor (SOG-TFET) with different channel doping concentration are proposed. Due to the gaussian doping in which the channel region near the source is highly doped and that far from the source is lightly doped, the ambipolar current was reduced, compared with the uniformly-doped SOG-TFET. On-current is almost similar in P-P-N and P-I-N structure but subthreshold swing (SS) of P-P-N TFET enhanced 5 times higher than those of P-I-N TFET. off-current and ambiploar current of the proposed SOG-TFET decrease 10 times and 100 times than those of the uniformly-doped SOG-TFET.

• Journal of IKEEE
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• v.20 no.3
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• pp.220-225
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• 2016

In this paer, low on-resistance and high-power trench gate MOSFET (Metal-Oxide-Silicon Field Effect Transistor) incorporating current sensing FET (Field Effect Transistor) is proposed and evaluated. The trench gate power MOSFET was fabricated with $0.6{\mu}m$ trench width and $3.0{\mu}m$ cell pitch. Compared with the main switching MOSFET, the on-chip current sensing FET has the same device structure and geometry. In order to improve cell density and device reliability, self-aligned trench etching and hydrogen annealing techniques were performed. Moreover, maintaining low threshold voltage and simultaneously improving gate oxide relialility, the stacked gate oxide structure combining thermal and CVD (chemical vapor deposition) oxides was adopted. The on-resistance and breakdown voltage of the high density trench gate device were evaluated $24m{\Omega}$ and 100 V, respectively. The measured current sensing ratio and it's variation depending on the gate voltage were approximately 70:1 and less than 5.6 %.

• 전자공학회논문지 IE
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• v.48 no.4
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• pp.13-18
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• 2011

In this paper, we have examined electrical characteristics of LDO regulator according to the process variation using a 1 ${\mu}m$ 20 V high voltage CMOS process. The electrical analysis of LDO regulator have been performed with three kind of SPICE parameter sets (Typ : typical, FF : fast, SS : slow) by process variation which cause change of SPICE parameter such as threshold voltage and effective channel length of MOS devices. From simulation results, we confirmed that in case of SS type SPICE parameter set, the LDO regulator has 3.6 mV/V line regulation, 0.4 mV/mA load regulation and 0.86 ${\mu}s$ output voltage settling time. And in case of Typ type SPICE parameter set, the LDO regulatorhas 4.2 mV/V line regulation, 0.44 mV/mA load regulation and 0.62 ${\mu}s$ output voltage settling time. Finally, in the FF type SPICE parameter set, the LDO regulator has 7.0 mV/V line regulation, 0.56 mV/mA load regulation and 0.27 ${\mu}s$ output voltage settling time.

• ETRI Journal
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• v.14 no.1
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• pp.40-51
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• 1992

$0.25{\mu} m$ 급 pMOSFET소자를 구현하기 위해, $P^+$ 폴리실리콘을 적용한 pMOS를 제작하였으며, $p^+$ 폴리실리콘 게이트 소자에서 심각하게 문제가 되고 있는 붕소이온 침투현상을 조사하고 붕소이온 침투가 일어나지 않는 최적열처리온도를 조사하였다. 소자제조 공정중 게이트 공정만 전자선 (EBML300)을 이용하여 직접묘사하고 그 이외의 공정은 stepper(gline) 을 사용하는 Mix & Match 방법을 사용하였다. 또한 붕소이온 침투현상을 억제하기 위한 한가지 예로서, 실리콘산화막과 실리콘질화막을 적층한 ONO(Oxide/Nitride/Oxide) 구조를 게이트 유전체로 적용한 소자를 제작하여 그 가능성을 조사하였다. 그 결과 $850^{\circ}C$의 온도와 $N_2$ 분위기에서 30분동안 열처리 하였을 경우, 붕소이온의 침투현상이 일어나지 않음을 SIMS(Secondary Ion Mass Spectrometer) 분석 및 C-V(Capacitance-Voltage) 측정으로 확인할 수 있었으며 그 이상의 온도에서는 붕소이온이 침투되어 flat band전압(Vfb)을 변화시킴을 알았다. 6nm의 얇은 게이트 산화막 및 $0.1{\mu} m$ 이하의 LDD(Lightly Doped Drain) $p^-$의 얇은 접합을 형성함으로써 소자의 채널길이가 $0.2 {\mu} m$까지 짧은 채널효과가 거의 없는 소자제작이 가능하였으며, 전류구동능력은 $0.26\muA$/$\mu$m(L=0.2$\mu$m, V$_DS$=2.5V)이었고, subthreshold 기울기는 89-85mV/dec.를 얻었다. 붕소이온의 침투현상을 억제하기 위한 한가지 방법으로 ONO 유전체를 소자에 적용한 결과, $900^{\circ}C$에서 30분의 열처리조건에서도 붕소이온 침투현상이 일어나지 않음으로 미루어 , $SiO_2$ 게이트 유전체보다 ONO 게이트 유전체가 boron 침투에 대해서 좋은 장벽 역활을 함을 알았다. ONO 게이트 유전체를 적용한 소자의 경우, subthreshold특성은 84mV/dec로서 좋은 turn on,off 특성을 얻었으나, ONO 게이트 유전체는 막자체의 누설전류와 실리콘과 유전체 계면의 고정전하량인 Qss의 양이 공정조건에 따라 변화가 심해서 문턱전압 조절이 어려워 소자적용시 문제가 된다. 최근 바닥 산화막(bottom oxide) 두께가 최적화된 ONO 게이트 유전체에 대하 연구가 활발히 진행됨을 미루어, 바닥 산화막 최적화가 된다면 더 좋은 결과가 예상된다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.12
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• pp.2899-2904
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• 2015

This paper introduces about the effect on $I_{DS}-V_{GS}$ characteristic of transistor that interface trap charge is created by damage due to heat in a 3D sequential inverter. A interface trap charge distribution in oxide layer in a 3D sequential inverter is extracted using two-dimensional device simulator. The variation of threshold voltage of top transistor according to the gate voltage variation of bottom transistor is also described in terms of Inter Layer Dielectric (ILD) length of 3D sequential inverter, considering the extracted interface trap charge distribution. The extracted interface trap density distribution shows that the bottom $HfO_2$ layer and both the bottom and top $SiO_2$ layer were relatively more affected by heat than the top $HfO_2$ layer with latest process. The threshold voltage variations of the shorter length of ILD in 3D sequential inverter under 50nm is higher than those over 50nm. The $V_{th}$ variation considering the interface trap charge distribution changes less than that excluding it.

• Journal of IKEEE
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• v.27 no.4
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• pp.386-390
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• 2023

In this study, we examined the quasi-nonvolatile memory characteristics of silicon nanosheet (SiNS) feedback field-effect transistors (FBFETs) fabricated using a complementary metal-oxide-semiconductor process. The SiNS channel layers fabricated by photoresist overexposure method had a width of approximately 180 nm and a height of 70 nm. The SiNS FBFETs operated in a positive feedback loop mechanism and exhibited an extremely low subthreshold swing of 1.1 mV/dec and a high ON/OFF current ratio of 2.4×10⁷. Moreover, SiNS FBFETs represented long retention time of 50 seconds, indicating the quasi-nonvolatile memory characteristics.