Lead-free Solders on the Electronics (전자부품에서의 무연솔더)

• 김미진;김문일;신규식;정재필
• • Journal of the Microelectronics and Packaging Society
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  • v.7 no.4
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  • pp.49-56
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  • 2000
• PDF

Characterization of the interface between lead-free solder/UBM using electron microscopy (전자현미경을 이용한 무연솔더/UBM 계면반응 분석)

• 양철웅
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2004.02a
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  • pp.73-94
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  • 2004
• PDF

무전해Ni(P)과 무연솔더와의반응중 금속간 화합물의 성장 및 spalling 현상에 관한 연구

• 손윤철;유진;이택영
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2004.11a
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  • pp.17-17
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  • 2004
• PDF

Development of Sn-Cu base Pb-free solder (SnCu계 무연솔더의 개발)

• 박지호;문준권;정재필;하준석;강춘식;이재옥
• • Proceedings of the KWS Conference
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  • 2002.05a
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  • pp.250-252
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  • 2002
• PDF

Research Trends of Sn-Ag Based Pb-Free Solders (Sn-Ag계 무연솔더의 연구개발동향)

• 김문일;신규식;정재필
• • Journal of Welding and Joining
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  • v.19 no.1
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  • pp.15-20
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  • 2001
• PDF

The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints (무연솔더 접합 계면의 금속간화합물 생성 및 성장)

• 이창배;이창열;서창제;정승부
• • Journal of Welding and Joining
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  • v.20 no.3
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  • pp.16-23
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  • 2002
• PDF KSCI

Ecomaterials - Pb-free-Solder (환경친화재료-무연솔더)

• Chung, Eun
• • Proceedings of the Korean Powder Metallurgy Institute Conference
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  • 1999.10a
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  • pp.5-5
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  • 1999
• PDF

SMT 공정에서 Lead-free solder(무연 솔더) 적용에 따른 비전검사기 시스템의 변경 연구

• Park, Jong-Hyeop
• • Proceedings of the IEEK Conference
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  • 2006.06a
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  • pp.431-432
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  • 2006
• PDF

무연 솔더바 신뢰성 평가

• Park, Jae-Hyeon
• • Proceedings of the Korean Reliability Society Conference
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  • 2006.05a
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  • pp.208-217
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  • 2006
• PDF

환경친화적 무연 솔더링 접합 기술 동향

• 이혁모
• • Electrical & Electronic Materials
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  • v.16 no.7
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  • pp.21-27
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  • 2003
• PDF

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