Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.02a
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- Pages.73-94
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- 2004
Characterization of the interface between lead-free solder/UBM using electron microscopy
전자현미경을 이용한 무연솔더/UBM 계면반응 분석
Abstract
Keywords