Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints

무연솔더 접합 계면의 금속간화합물 생성 및 성장

  • 이창배 (성균관대학교 신소재공학과) ;
  • 이창열 (성균관대학교 신소재공학과) ;
  • 서창제 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2002.06.01
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References

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