• Title/Summary/Keyword: 무연 솔더

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Thermal Fatigue Life Prediction of ${\mu}BGA$ Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder (Sn-37mass%Pb 솔더 및 Sn-3.5mass%Ag 무연솔더를 이용한 ${\mu}BGA$ 솔더접합부의 열피로수명 예측)

  • 신영의;이준환;하범용;정승부;정재필
    • Journal of Welding and Joining
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    • v.19 no.4
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    • pp.406-412
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    • 2001

  • This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

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An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007

  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

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