Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2001.05a
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- Pages.285-288
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- 2001
Aging Characteristic of Intermetallic Compounds for Appling to Lead Free Solders in $\mu$ BGA
$\mu$ BGA에 무연솔더 적용에 대한 금속간화합물의 시효처리 특성
- Published : 2001.05.01
Abstract
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