Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics

국방분야 전자기기의 무연솔더 적용을 위한 신뢰성 검증방안

  • Published : 2011.08.31
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References

  1. R. Strauss, SMT Soldering Handbook, 2nd ed., Newnes, Oxford (1998) 148
  2. W. S. Hong, W. S. Kim, B. S. Song and K B. Kim, "Thermal Shock Cycles Optimization of Sn-3.0Ag-0.5Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components", Kor. J. Mater. Res., 17-3 (2007), 152-159 (in Korean) https://doi.org/10.3740/MRSK.2007.17.3.152
  3. Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
  4. Commission of the european communities, directives of the european parliament and of the council on waste electrical and electronic equipment (WEEE) (2008)
  5. D. Napp : Lead-Free Interconnect Materials for the Electronic Industry : Proceeding of the 27th International SAMPE Technical Conference (1995)
  6. Directive 2009/125/EC Of the European parliament and of the council : Official J. of the European Union, L285 (2009), 10-35
  7. State of california environmental protection agency : Chemicals known to the state to cause cancer or reproductive toxicity, Proposition 65 List of Chemicals (2011)
  8. W. S. Hong, W. S. Kim, N. C. Park, K. B. Kim, "Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints", Journal of Korean Welding and Joining Society, 25-2 (2007), 84-190 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.082
  9. J. W. Yoon, S. W. Kim, and S. B. Jung : IMC morphology, interfacial reaction and joint reliability of Pb-free SnAgCu solder on electrolytic Ni BGA substrate, J. Alloys and Compounds, 392 (2005), 247-252 https://doi.org/10.1016/j.jallcom.2004.09.045
  10. W. S. Hong : Relaibility Validation Methodology for Implementation Pb-free Solder of Electronic Devices, Project report, Korea Electronics Technology Institute (KETI), 2005 (in Korean)
  11. K. suganuma : Lead-free soldering in electronics, ISBN 0824741021, Marcel dekker Inc, USA, (2004)
  12. Y. Fukuda, M. G. Pecht, K. Fukuda, and S. Fukuda : Lead-Free Soldering in the Japanese Electronics Industry, IEEE T. on components and package Tech., 26-3 (2003), 616-624 https://doi.org/10.1109/TCAPT.2003.817658
  13. G. Henshall, R. H. Ranjit, S. Pandher, K. Sweatman, K. Howell, R. Coyle, T. Sack, P. Snugovsky, S. Tisdale and F. Hua : iNEMI(National Electronic Manufacturing Initiative) Pb-free alloy alternatives project report, state of the industry, J. of SMTA, 21-4 (2008), 109-122
  14. C. Handwerker, J. Bath, E. Benedetto, E. Bradley, R. Gedney, T. Siewert, P. Snugovsky, J. Sohn: NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures, SMTAI Conference Proceeding, (2003), 664-669
  15. NEDO Research and Development on Lead-Free Soldering, JEIDA Report No. 00-ki-17 (2000)
  16. Katsuaki Suganuma : The development and commercialization of lead-Free soldering, MRS Bulletin/NOVEMBER (2001), 880-884
  17. IDEALS : Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering, IDEALS synthesis report (Project BE95-1994) (1999)
  18. A. Arbor : NCMS lead-free solder project final report, No. 0401RE96 (1997)
  19. H. I. Cha : Problem and solution of Pb-Free Solder, K. Reliability Conference Proceeding, 2010 (in Korean)
  20. D. Cavasin : Yellow Solder: An Assessment of the Quality and Reliability of Pb-free Lead Finishes and Solder Ball Alloys Exhibiting Excessive Sn Oxidation, ECTC Proceeding, (2006), 1060-1063.
  21. R. Schueller, N. Blattau, J. Arnold, and C. Hillman : Second generation Pb-free alloys, SMTA Conference Proceedings, (2009)
  22. C.M. Oh, N. C Park, and W. S Hong : Solder joints fatigue life of BGA package with OSP and ENIG surface finish, J. Kor. Inst. Met. & Mater 46-2 (2008), 80-87 (in Korean)
  23. G. S. Wable, S. Chada, B. Neal, and R. A. Fournelle : Solidification shrinkage defects in electronic solders, JOM, 57-6 (2005), 38-42 https://doi.org/10.1007/s11837-005-0134-x
  24. Gordon Whitten : Lead-free Solder Implementation for Automotive Electronics, ECTC Proceedings, (2000), 1410-1415
  25. W. S. Hong, B. C. Kang, B. S. Song, K. B. Kim : "A study on the metallic ion migration phenomena of PCB", Kor. J. Mater. Res., 15-1 (2005), 54-60 (in Korean) https://doi.org/10.3740/MRSK.2005.15.1.054
  26. Takeshi Yanagisawa : History of ionic migration and factor for its growth, J. of the Surface Finishing Society of Japan, 5-5 (2000), 479-483
  27. H. Tanaka, F. ueta, S. Yoshihara, T. Shitakashi : Effects of reflow processing and flux residue on ionic migration of lead-free solder plating using the quartz crystal Microbalance method" Materials Transactions, 42-9, (2001), 3401-3406,
  28. H. Tanak, M. Yamashita, Hi. Hiramatsu, M. nakamura, F. ueta, S. Yoshihara, T. Shitakashi : Investigation on Ionic Migration Phenomenon of Hot Dipped Lead-free Solders Using QCM method, The Journal of Japan Institute of Electronics Packaging, 5-2 (2002), 135-139 https://doi.org/10.5104/jiep.5.135
  29. H. Qi, S. Ganesan, M. Pecht, "No-fault-found and intermittent failures in electronic products" Microelectronics Reliability 48 (2008), 663-674 https://doi.org/10.1016/j.microrel.2008.02.003
  30. JP002 : Current Tin Whiskers Theory and Mitigation Practices Guideline, JP002, JEDEC/IPC Joint Publication, (2006)
  31. Military and commercial specification unification project : Korea Electronics Technology Institute (KETI), DTAQ-07-1374-R (2007)
  32. www.jedec.org, JESD22-A106B Thermal Shock
  33. IPC-9701, Performance Test Methods and Qua I ification Requirements for Surface Mount Solder Attachments, Northbrook, IL, (2002)
  34. M. Ramirez, L. Henneken, S. Virtanen : Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder, Applied Surface Science, 257-15 (2011), 6481-6488 https://doi.org/10.1016/j.apsusc.2011.02.048
  35. Jack Fellman : A study of the lead-free hot air solder levelling process, Circuit World, 31-2 (2005), 3-9 https://doi.org/10.1108/03056120510571789
  36. www.ipc.org, IPC-TM 650, Method 2.6.13 Assessment of susceptibility to metallic dendriti growth: uncoated printed wiring
  37. www.ipc.org, IPC-TM 650, Method 2.6.14 Solder mask - resistance to electrochemical migration
  38. JIS 3197, Testing methods for soldering fluxes, Japanese Industrial Standard, Japanese Standards Association, 1999
  39. www.jedec.org, JESD22-A110D Highly accelerated temperature and humidity stress test (HAST)
  40. United States Army's Developmental Test Command : MIL-STD 810G Method department of defense test method standard for environmental engineering considerations and laboratory tests
  41. Infrastructure establishment and supporting project for lead-free soldering in electronic products, Project report, Korea Electronics Technology Institute (KETI) (2007) (in Korean)