• Title/Summary/Keyword: 몰딩

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The Hazard of Ignition on the Bimetal Type Thermostat Molded by Phenol Resin (페놀수지로 몰딩된 바이메탈식 서모스탯의 발화위험성)

  • Park, Y.G.;Lee, S.H.
    • Journal of Korean Institute of Fire Investigation
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    • v.11 no.1
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    • pp.63-73
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    • 2007
  • In this paper, we discussed the hazard of ignition on the bimetal type thermostat molded by phenol resin with case study and accelerated aging test. We experimented three type thermostats molded by phenol resin which are used on hot/cold water dispenser. On the case study, the thermostat was origin of 6re and dry tracking occurred around it's moveable contactor. On the accelerated aging test, the more thermostat was switched, the more damaged it become. One of the A-type thermostats that is similar type on the case study fired around moveable contactor. We therefore confirmed that the tracking around the moveable contactor of bimetal type thermostat molded by phenol resin could be origin of fire and it is available to reduce of fire that using noncombustible material for molding of bimetal type thermostat.

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A study on the Application of Inorganic Reinforced Non-Flammable Molding to Building Exterior (무기계보강 CLC 불연몰딩의 건축물 외벽적용 연구)

  • Kwon, Hae-Won;Gong, Min-Ho;Lee, Chang-Woo;Choi, Byung-Cheol
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2021.05a
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    • pp.61-62
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    • 2021
  • Exterior wall molding, which is widely applied as a design element of the exterior wall of domestic apartment, should be applied as a nonflammable or semi-nonflammable material grade according to the rules on standards for evacuation/fire protection structures of buildings. For this reason, stone and AL sheet are mainly used, but stone is expensive and design autonomy is low. Inorganic reinforced CLC nonflammable molding was applied to the exterior wall of the building through tests of nonflammable performance, noise reduction, and installation stability.

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Development of Non-flammable exterior design Molding using Cellular Light-weight Concrete (CLC를 활용한 공동주택 불연성능 외벽몰딩 개발)

  • Kwon, Hae-Won;Gong, Min-Ho;Lee, Chang-Yong;Jeong, Gab-Cheol
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.06a
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    • pp.54-55
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    • 2020
  • Recently, "The rules on the standards of evacuation and fire protection of buildings" require that non-burnable materials such as non-combustible and semi-non-combustible materials be used as the materials applied to the building's exterior walls, but styrofoam, which is a combustible material, has been applied a lot and became a social issue. In this study, we developed a non-combustible outer wall molding to secure construction and economic feasibility and free expression using CLC(CLC: Cellular Light-weight Concrete).

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스티로폴 재활용 제품 해외 수출 현장을 가다

  • Korea Foam-Styrene Recycling Association
    • 환경사랑
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    • s.42
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    • pp.6-7
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    • 2005
  • 매년 9월 애틀랜타에서 개최되는 세계 최대의 그림 및 액자제품 박람회(Decor-Expo Atlanta)에 참가한 한국의 스티로폴 재활용 액자몰딩 수출업체들은 세계 1위의 미국 액자소비시장에서 기술력과 수출경쟁력으로 호응을 얻고 있다. 한국프레임공업협동조합의 주관으로 (주)신일프레임, (주)유진케미칼 등 14개 스티로폴 재활용 액자몰딩 수출업체 30여명의 임직원들이 이번 전시회에 직접 참가하여 수출상담액 1천만 달러, 수출계약액 2백만 달러의 성과를 올렸다.

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Design of Cooling System of Over-molding Mold for Socket Component of Automobile Wiper (자동차 와이퍼 소켓 부품 제작용 오버몰딩 금형의 냉각 시스템 설계)

  • Lee, Dong-Gi;Park, Min-Woo;Ahn, Dong-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.12
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    • pp.1635-1640
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    • 2011
  • The objective of this study is to design of a cooling system of the over-molding mold for a socket component of an automobile wiper by performing numerical analyses. Hot spots in which the temperature distributions are higher than those of other region, were estimated by an initial over-molding analysis for the initial design of the mold. On the basis of the initial over-molding analysis, two types of cooling system designs with a linear cooling channel and a volumetric heat sink, were considered to improve the cooling characteristics of hot spots. To obtain an appropriate cooling system design, the effects of the diameter and the position of the linear cooling channels on the cooling characteristics and the product qualities were quantitatively examined. In addition, the effects of the design of the volumetric heat sink on the cooling characteristics and deformation distributions in the molded product were investigated. The results of the over-molding analysis of the two types of cooling systems showed that the multi-sliced over-molding mold with a volumetric heat sink can improve both the product quality and the cooling characteristics of the mold.

Micromolding Technique for Controllable Anisotropic Polymeric Particles with Convex Roof (볼록한 지붕을 갖는 이방성 고분자 입자의 곡률반경 제어를 위한 마이크로몰딩 기술)

  • Jeong, Jae-Min;Son, Jung-Woo;Choi, Chang-Hyung;Lee, Chang-Soo
    • Clean Technology
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    • v.18 no.3
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    • pp.295-300
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    • 2012
  • Synthesis of well-defined particle with tunable size, shape, and functionalities is strongly emphasized for various applications such as chemistry, biology, material science, chemical engineering, medicine, and biotechnology. This study presents micromolding method for the fabrication of anisotropic particles with elegant control of curvature of covex roof. For the demostration of rapid fabrication of the particles, we have applied polydimethylsiloxane (PDMS) micromold as structure guiding template and wetting fluid to control curvature of roof of the particles. Based on this approach, we can control the radius of curvature from $20{\mu}m$ to $70{\mu}m$ with different aspect ratio of mold. In addition, wetting fluids with different wetting properties can also modulate the height and radius of curvature of the particles. We envision that this methodology is promising tool for precise control of particle shape in 3-dimensional space and new synthetic route for anisotropic particles with cost effective, simple, easy, and fast procedure.

Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates (박형 기판을 사용한 Package-on-Package용 상부 패키지와 하부 패키지의 Warpage 분석)

  • Park, D.H.;Shin, S.J.;Ahn, S.G.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.2
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    • pp.61-68
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    • 2015
  • Warpage analysis has been performed for top and bottom packages of thin package-on-packages processed with different epoxy molding compounds (EMCs). Warpage deviation was measured for packages molded with the same EMCs and also the warpage deviations of top and bottom substrates themselves were characterized in order to identify the major factor causing the package warpage. For the top and bottom packages processed with thin substrates, the warpage deviation of the substrates was large, which made it difficult to figure out the effect of EMC properties on the package warpage. Top packages, where the molding area of $13mm{\times}13mm$ covered the most of the substrate area ($14mm{\times}14mm$), exhibited similar warpage behavior with changing the temperature. On the other hand, bottom packages, where the molding area was only $8mm{\times}8mm$, exhibited the complex warpage behavior due to simultaneous occurrence of (+) and (-) warpages on the same package. Accordingly, the bottom packages showed dissimilar temperature-warpage behavior even being processed with the same EMCs.