• Title/Summary/Keyword: 모듈패키지

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Temperature Compensation of NDIR $CO_{2}$ Gas Sensor Implemented with ASIC Chip (ASIC 칩 내장형 비분산 적외선 이산화탄소 가스센서의 온도보상)

  • Yi, Seung-Hwan;Park, Jong-Seon
    • Journal of the Korean Institute of Gas
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    • v.11 no.1 s.34
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    • pp.40-45
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    • 2007
  • This paper describes NDIR $CO_{2}$ gas sensor that shows the characteristics of temperature compensation. It consists of novel optical cavity that has two elliptical mirrors and a thermopile that includes ASIC chip in the same metal package for the amplification of detector output voltage and temperature sensor. The newly developed sensor module shows high accuracy ($less\;than {\pm}40\;ppm$) throughout the measuring concentration of $CO_{2}$ gas from 0 ppm to 2,000 ppm. After implementing the calculation methods of gas concentration, which is based upon the experimental results, the sensor module shows high accuracy less than ${\pm}5\;ppm$ error throughout the measuring temperature range ($15^{\circ}C\;to\;35$^{\circ}C$) and gas concentrations with self-temperature compensation.

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가상 개발환경 기반의 차량용 사이버훈련 프레임워크 설계: 공격 중심으로

  • YoungBok Jo;Subin Choi;OH ByeongYun;YongHo Choi;Hojun Kim;Seonghoon Jeong;Byung Il Kwak;Mee Lan Han
    • Review of KIISC
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    • v.33 no.4
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    • pp.23-29
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    • 2023
  • 대부분의 임베디드 시스템은 기계장치와 전자기기 장치가 함께 작동되는 물리 장치로써, 이기종 네트워크, 복잡한 보안체계 등을 고려하여 가상화 기반 사이버훈련 환경이 구성되어야 한다. 또한, 차량을 대상으로 물리적인 실험환경에서 모의침투 등 사이버훈련을 수행한다는 것은 교통사고를 비롯한 안전사고 발생에 있어 위험이 존재한다. 본 논문에서는 가상 개발환경에서의 공격 기반 차량용 사이버훈련 프레임워크를 제안하고자 한다. 먼저, 공격 기반 차량용 사이버훈련 프레임워크의 작동은 자동 활성화되는 가상의 CAN 네트워크 인터페이스로 시작된다. 가상의 CAN 네트워크 인터페이스는 가상 머신에서 간단한 부트스트랩 명령어 실행을 통해 파이썬 패키지와 Ubuntu 서비스 목록 설치 명령이 자동으로 실행되면서 설치된다. 이후 내부 네트워크 시뮬레이터와 공격모듈과 관련된 UI가 자동으로 Ubuntu Systemd에 의해 백그라운드에서 실행되어 시작과 동시에 준비 상태를 유지하게 된다. 사이버훈련 UI 내 공격 모듈은 사용자에 의한 공격 선택 및 파라미터 셋팅 이후 차량의 이상 상태를 사이버훈련 UI에 다시 출력되게 된다. 본 논문에서 제안하는 가상 개발환경 기반의 차량용 사이버훈련 프레임워크는 자율주행 차량 사고의 위험이나 다른 특수한 제약 없이 사용자의 학습 경험을 확장시킬 수 있다. 또한, 기존의 가상화 기반 사이버훈련 교육 콘텐츠와는 달리 일반 사용자들이 접근하기 쉬운 형태로 확장 개발이 가능하다.

Electrical Characterization of BGA interconnection for RF packaging (Radio Frequency 회로 모듈 BGA 패키지)

  • Kim, Dong-Young;Woo, Sang-Hyun;Choi, Soon-Shin;Jee, Yong
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.96-99
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    • 2000
  • We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

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Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package (단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정)

  • Lee, Se-IL;Kim, Woo-Young;Jeong, Young-Gi;Yang, Jong-Kyung;Park, Dae-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.12
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    • pp.973-977
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    • 2010
  • The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

Module Development to Improve Problem Based Learning Ability in Department of Emergency Medical Technician Lecture - Stroke Package - (응급구조(학)과 수업에서의 문제중심학습 능력 향상을 위한 모듈개발 -뇌졸중 패키지-)

  • Pi, Hye-Young
    • The Korean Journal of Emergency Medical Services
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    • v.16 no.1
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    • pp.31-51
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    • 2012
  • Purpose: This study was to develop PBL packages geared toward fostering the problem-solving ability, self-directed learning capability and communicative competence of emergency medical technician students and to give some suggestions on the development of PBL packages of the approach based on the evaluation results of the packages by experts. Methods: First, real clinical situations that learners would be exposed to after graduation should be provided as examples when the packages are developed. Second, a variety of learning-facilitating tools should be offered to facilitate their understanding, because they don't yet gain plenty of clinical practice experiences. Third, they should be encouraged to have an energetic discussion in small group when the developed packages are applied. Conclusion: First, the packages developed in this study were just incorporated into some areas of a single course. In the future, the integration of an entire course or the development of a new course is required to attain the multiple learning objectives in the provided clinical situations. Second, this study attempted to develop the PBL packages to boost the problem-solving ability, self-directed learning capability and communicative competence of emergency medical technician students, and follow-up research should be implemented to finalize the packages based on the suggestions of the experts who evaluated them and to determine the effects of the packages.

Development of LED Lamp which using Transparent Plastic Substrates (플라스틱 기판을 이용한 LED 투명 광원 구현)

  • Hong, Dae-Woon;Lee, Song-Jae
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.5
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    • pp.1-7
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    • 2010
  • LEDs, compared to conventional light sources, have many advantages and their applications are rapidly expanding, especially in areas such as back-lights for LCD. In this paper, we propose a new LED lamp structure suitable for applications requiring a low power. In the proposed LED lamp structures, LED chips are mounted on a transparent polycarbonate plate, and thus photons are transmitted through the both sides of the plate. The copper layer deposited on the polycarbonate plate is patterned to form circuit patten and the chip mount pad, on which LED chips are mounted. We speculate that our proposed LED lamp structures may be used as a type of plate light source.

e-Goverment Software of Development Quality Evaluation Metrics (전자정부 소프트웨어 품질평가 메트릭 개발)

  • Jin, Jin-yu;Ha-Yong, Lee;Hae-Sool, Yang;Bae-Kenn, Kang;Sang-Won, Kang;Dae-Suk, Jeon;Joo-Li, Lee
    • Proceedings of the Korea Information Processing Society Conference
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    • 2008.11a
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    • pp.459-461
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    • 2008
  • 오늘날 전자정부는 초고속 정보통신망과 네트워크, 인터넷 기반기술을 이용한 정부간, 정부와 시민, 기업간 다양한 분야에 원활한 행정서비스를 제공하고 있다. 지금까지 일반 패키지 소프트웨어나 임베디드 소프트웨어 등에 관한 품질평가기술 개발 연구는 다양하게 진행해 왔지만 전자정부 소프트웨어에 대한 연구는 활발하지 못한 실정이다. 본 연구에서는 ISO/IEC 12119와 ISO/IEC 9126 및 ISO/IEC 14598을 기반으로 전자정부 소프트웨어의 품질요구사항을 체계화하고 전자정부 소프트웨어 품질평가를 위한 메트릭을 시험모듈 형식으로 구축하고 이를 적용하기 위한 시험표를 구축하였다.

Packaging Technology for the Optical Fiber Bragg Grating Multiplexed Sensors (광섬유 브래그 격자 다중화 센서 패키징 기술에 관한 연구)

  • Lee, Sang Mae
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.23-29
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    • 2017
  • The packaged optical fiber Bragg grating sensors which were networked by multiplexing the Bragg grating sensors with WDM technology were investigated in application for the structural health monitoring of the marine trestle structure transporting the ship. The optical fiber Bragg grating sensor was packaged in a cylindrical shape made of aluminum tubes. Furthermore, after the packaged optical fiber sensor was inserted in polymeric tube, the epoxy was filled inside the tube so that the sensor has resistance and durability against sea water. The packaged optical fiber sensor component was investigated under 0.2 MPa of hydraulic pressure and was found to be robust. The number and location of Bragg gratings attached at the trestle were determined where the trestle was subject to high displacement obtained by the finite element simulation. Strain of the part in the trestle being subjected to the maximum load was analyzed to be ${\sim}1000{\mu}{\varepsilon}$ and thus shift in Bragg wavelength of the sensor caused by the maximum load of the trestle was found to be ~1,200 pm. According to results of the finite element analysis, the Bragg wavelength spacings of the sensors were determined to have 3~5 nm without overlapping of grating wavelengths between sensors when the trestle was under loads and thus 50 of the grating sensors with each module consisting of 5 sensors could be networked within 150 nm optical window at 1550 nm wavelength of the Bragg wavelength interrogator. Shifts in Bragg wavelength of the 5 packaged optical fiber sensors attached at the mock trestle unit were well interrogated by the grating interrogator which used the optical fiber loop mirror, and the maximum strain rate was measured to be about $235.650{\mu}{\varepsilon}$. The modelling result of the sensor packaging and networking was in good agreements with experimental result each other.

A Study on the Critical Factors for Successful AIS Implementation (회계정보시스템의 성공적 도입을 위한 요인분석)

  • Ha, Dae-Yong;Oh, Sang-Young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.6
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    • pp.1364-1370
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    • 2006
  • Recently, Adopting Accounting Information Systems(AIS) has spread rapidly for efficient and rational making decision in the business organization. There are many types of AIS. These are from simple package to integrated packages which are including HR, Product, Sales and Distribute. In case of big enterprises, ERP systems have been implemented and attention is now being directed as to AIS module. AIS module is not easy to change its form, therefore this module need to be considered enough when it comes to the corporations. However there we few standard fer this module as a successful information systems. This study analyze critical factors of certain companies when the companies were implementing AIS and based on this analysis, this study suggest a framework for successful implementation of AIS Using Case Study. 42 AIS adopted companies are surveyed and their factors' correlations are analyzed by mean analysis and factor analysis in this study. As a result of this study, when a company adopt AIS, criteria or particularities for the adoption are more important than environment of the company. Thus, it is significant to empirically prove previous studies' factors relation and importance relations for successful AIS implementation through empirical method in this study.

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Development of Compatible Health Level 7 Parser (호환 가능한 HL7 파서의 개발)

  • Park, Hyun Sang;Kim, Hwa Sun;Cho, Hune
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.7
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    • pp.4290-4300
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    • 2014
  • The previous HL7 interface should be developed as a separate package or conversion module for each version to process HL7 messages from different versions. This study designed and developed an HL7 parser compatible among different versions based on the requirements of compatibility defined in HL7 V2.5. According to the structure of the parser, the inheritance concept in object-oriented programming was adopted so that the class object of the HL7 message from the lower version could be inherited to the class object of the upper version. Therefore, every version's HL7 messages could be processed using only the upper class' object regardless of the version. To evaluate the compatibility of the developed parser, 700 data sets about inpatients with rheumatoid arthritis were used. The 700 cases underwent the compatibility test successfully. In the near future, further research on the Inter-compatibility HL7 parser is planned.