Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package

단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정

  • Lee, Se-IL (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Kim, Woo-Young (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Jeong, Young-Gi (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Yang, Jong-Kyung (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Park, Dae-Hee (Department of Electrical & Information Engineering, Wonkwang University)
  • Received : 2010.09.27
  • Accepted : 2010.11.03
  • Published : 2010.12.01
Download PDF
⟨ Previous Next ⟩

Abstract

The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

Keywords

References

  1. H. Lee, J. Park, M. Kim, H. Kim, and J. Kim, J. KIEEME, 22, 1033, (2009).
  2. S. Lee, S. Lee, J. Yang, J. Lee, and D. Park, Trans. KIEE, 59, 609, (2010).
  3. J. Hu, L. Yang, and M. Shin, J. Phys. d:Appl. Phys. 41, (2008).
  4. M. Shin and J. Kim, Introduction to LED Packaging Technology , Bookshill, 283, (2009).
  5. E. F. Schubert, Light Emitting Diodes, 2nd cd. (Cambridge University Press, Cambridge, 2006), p. 97.
  6. J. Hu, L. Yang, W. Hwang, and M. Shin, J. Cry. Gro, 288, 157, (2006). https://doi.org/10.1016/j.jcrysgro.2005.12.049
  7. J. Hu, L. Yang, and M. Shin, Mic. J, 38, 157, (2007).
  8. J. Park, H. Kim, J. Kim, W. Chun, and S. Song, KIIEE. Spring Conference, (Y. P. resort, 2009), p. 252.
  9. X. Luo, W. Xiong, and S. Liu, ICEPT-HDP 1, (2008).
  10. L. Wang, P. Gu, and S. Jin, OPTICS LETTERS, 34, 301, (2009). https://doi.org/10.1364/OL.34.000301
  11. EIA/JESD51-1, (1995).

Cited by

  1. Thermal Dissipation Characteristics of Multi-Chip LED Packages vol.25, pp.12, 2011, https://doi.org/10.5207/JIEIE.2011.25.12.034
  2. Comparison of the Thermal Performance of the Multichip LED Packages vol.2, pp.11, 2012, https://doi.org/10.1109/TCPMT.2012.2200483