• The Optical Journal
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• s.98
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• pp.68-74
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• 2005

최근 실리콘 웨이퍼 등 취성 재료에 있어 표면 거칠기나 마이크로 크랙 등 표면 품질과 함께 형상 정밀도에 대한 요구가 높아지고 있다. 본 고에서는 경취 재료의 초정밀 가공으로서 광학 유리재를 대상으로 하여 다이아몬드 절삭에 의한 임계 절입 깊이를 실험적으로 조사한 결과와 메탈 본드 다이아몬드 지석을 이용한 초정밀 경면 절삭 기술에 대해 소개한다.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.227-231
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• 2002

GPR은 건물의 크랙, 지중 매설물과 같은 정보를 수집하기 위해 좁은 펄스를 사용하므로 넓은 대역의 주파수 특성을 가진다. 본 논문에서는 광대역 특성을 가지는 안테나를 마이크로스트립을 이용하여 보우타이 형태로 설계하였다. 설계 기판으로는 $\varepsilon$$_{r}$=4.0, t=1.6 mm의 FR-4 유전체 기판을 사용하였다. 제작된 안테나는 S$_{11}$<-10 ㏈에서 10.62%의 대역폭을 가지고, 5.778GHz에서 -33.3 ㏈의 S$_{11}$과 1.04의 VSWR 값을 나타내었다.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.217-224
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• 2011

of materials and simplification of process. Micro-blasting is one of the promising method for recycling of waste wafer due to their simple and low cost process. Therefore, in this paper, we make recycling wafer through the micro-blaster. A surface etched by micro-blaster forms particles, cracks and pyramid structure. A pyramid structure formed by micro-blaster has a advantage of reflectivity decrease. However, lifetime of minority carrier is decreased by particles and cracks. In order to solve this problems, we carried out the DRE(Damage Romove Etching). There are two ways to DRE process ; wet etching, dry etching. After the DRE process, we measured reflectivity and lifetime of minority carrier. Through these results, we confirmed that a wafer recycled can be used in solar cell.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.9
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• pp.715-721
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• 2016

In this paper, the classification rate of micro-cracks in silicon wafers was improved using a SVM. In case I, we investigated how feature data of micro-cracks and SVM parameters affect a classification rate. As a result, weighting vector and bias did not affect the classification rate, which was improved in case of high cost and sigmoid kernel function. Case II was performed using a more high quality image than that in case I. It was identified that learning data and input data had a large effect on the classification rate. Finally, images from cases I and II and another illumination system were used in case III. In spite of different condition images, good classification rates was achieved. Critical points for micro-crack classification improvement are SVM parameters, kernel function, clustered feature data, and experimental conditions. In the future, excellent results could be obtained through SVM parameter tuning and clustered feature data.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.85-90
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• 2011

With regard to reliability of solder joint, the significant failures include open defects that occurs from alignment problem, Head in Pillow by PCB's warpage, the crack of solder by CTE mismatch, and the crack of IMC layer by mechanical impact. Especially as PCB down-sizing and surface finish is under progress, brittle failure of IMC layer between solder bump and PCB pad becomes a big issue. Therefore, it requires enhancing the level of difficulty in the existing assessment method and improving the measurement through the study on the mechanism of IMC formation, growth and brittle failure. Under this circumstance, this study is intended to suggest the direction of research for improving the reliability on the crack such as improvement of IMC brittle fracture.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Korean Geosynthetics Society
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• v.17 no.4
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• pp.169-177
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• 2018

Glass fiber reinforced polyester (GFRP) composites are widely used as structural materials in harsh environment such as underground pipes, tanks and boat hulls, which requires long-term water resistance. Especially, these materials might be damaged due to delamination between gelcoat and composites through an osmotic process when they are immersed in water. In this study, GFRP laminates were prepared by surface treatment of UPE (unsaturated polyester) gelcoat by vacuum infusion process to improve the durability of composite materials used in underground pipes. The composite surface coated with gelcoat was examined for surface defects, cracking, and hardness change characteristics in water-immersion environments (different temperatures of $60^{\circ}C$, $75^{\circ}C$, and $85^{\circ}C$). The penetration depth of cracks was investigated by micro CT imaging according to water immersion temperature. It was confirmed that cracks developed into the composites material at $75^{\circ}C$ and $85^{\circ}C$ causing loss of durability of the materials. The point at which the initial crack initiated was defined as the failure time and the life expectancy at $23^{\circ}C$ was measured using the Arrhenius equation. The results from this study is expected to be applied to reliability evaluation of various industrial fields where gelcoat is applied such as civil engineering, construction, and marine industry.

• Journal of the Mineralogical Society of Korea
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• v.28 no.3
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• pp.233-244
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• 2015

In order to study the phase transformation of pyrite and to determine the maximum Fe leaching factors, pyrite samples were an electric furnace and microwave oven and then ammonia leaching was carried out. The rim structure of hematite was observed in the sample exposed in an electric furnace, whereas a rim structure consisting of hematite and pyrrhotite were found in the microwave treated sample. Numerous interconnected cracks were only formed in the microwave treated sample due to the arcing effect, and these cracks were not found in the electric furnace treated sample. Under XRD analysis, pyrite and hematite were observed in the electric furnace treated sample, whereas pyrite, hematite and pyrrhotite were found in the microwave treated sample. The results of the pyrite sample leaching experiments showed that the Fe leaching was maximized with the particle size of -325 mesh, sulfuric acid of 2.0 M, ammonium sulfate of 1.0 M, and hydrogen peroxide of 1.0 M. The electric furnace and microwave treated samples were tested under the maximum leaching conditions, the Fe leaching rate was much greater in the microwave treated sample than in the electric furnace treated sample and the maximum Fe leaching time was also faster in the microwave treated sample than in the electric furnace treated sample. Accordingly, it is expected that the microwave heating can enhance (or improve) Fe leaching in industrial minerals as well as pyrite decomposition in gold ores.

• Composites Research
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• v.23 no.5
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• pp.30-38
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• 2010

Observing of GMT-Sheet in molding conditions, we have investigated unexpected phenomenons of moldings surface. In microscope investigation, we observe that there exist deficiencies on the surface of GMT-Sheet moldings, such as the spherulite, fiber projection, crack, fiber exposure, micro-weldline, pinhole and winding. They are caused to arise unevenness and phenomenons influence polish on surface. Especially, the major cause of the unevenness, effected to surface roughness, is a shrinking of matrix in the process of holding pressure and cooling temperature. The higher holding pressure load in a molding process and the lower demolding temperature in an annealing experiment, the better GMT-Sheet moldings improved its appearance.