References
- D. Amir, R. Aspandiar, S. Buttars, W. W. Chin and P. Grill, "Head-and-Pillow SMT Failure Modes", Proc. SMTA International Conference, San Diego, Surface Mount Technology Association (SMTA) (2009).
- 박재현, "무연 솔더볼 접합부의 신뢰성평가 방법", RIST 연구 논문, 19(2), 101 (2005).
- 고병각, 박부희, 김강동, 장중순, "FCBGA의 솔더조인트 신 뢰성 보증을 위한 정량적인 시험법" 한국경영과학회/대학산 업공학회 춘계공동학술대회 논문집, 933, 한국경영과학회/대학산업공학회 (2005).
- A. Zribi, A. Clark, L. Zavalij, P. Borgesen and E. J. Cotts, "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/ Cu and Sn-Ag-Cu Solder/Ni Interfaces and Associated Evolution of the Solder Microstructure" J. Electron. Mater., 30(9), 1157 (2001). https://doi.org/10.1007/s11664-001-0144-6
- W. K. Choi, J. H. Kim, S. W. Jeong and H. M. Lee, "Interfacial Microstructure and Joint Strength of Sn-3.5 Ag- X(X=Cu, In, Ni) Solder Joint", J. Mater. Res., 17(1), 43 (2002). https://doi.org/10.1557/JMR.2002.0009
- W. Peng, E. Monlevade and M. E. Marques, "Effect of Thermal Aging on the Interfacial Structure of SnAgCu Solder Joints on Cu" Microelectron. Reliab., 47(12), 2161 (2007). https://doi.org/10.1016/j.microrel.2006.12.006
- C. E. Ho, Y. W. Lin, S. C. Yang, C. R. Kao and D. S. Jiang, "Effects of Limited Cu Supply on Soldering Reactions between SnAgCu and Ni" J. Electron. Mater., 35(5) (2006).
- K. L. Lin and P. C. Shih, "IMC Formation on BGA Package with Sn-Ag-Cu and Sn-Ag-Cu/Ni-Ge Solder Balls", J. Alloys Compd., 452(2), 291 (2008).
- 손정민, 장미순, 곽계달, "Al Wire와 Al Pad 사이의 IMC (Intermertallic Compound) 형성에 의한 수명예측", 대한기계 학회 추계학술대회 논문집, 1295, 대한기계학회 (2008).
- Y. C. Sohn, J. Yu, S. K. Kang, D. Y. Shih and T. Y. Lee, "Spalling of Intermetallic Compounds during the Reaction between Lead-free Solders and Electroless Ni-P Metallization", J. Mater. Res., 19(8), 2428 (2004). https://doi.org/10.1557/JMR.2004.0297
- J. W. R. Teo and Y. F. Sun, "Spalling Behavior of Interfacial Intermetallic Compounds in Pb-free Solder Joints Subjected to Temperature Cycling Loading", Acta Mater., 56, 242 (2008). https://doi.org/10.1016/j.actamat.2007.09.026
- Y. C. Sohn, J. Yu, S. K. Kang, D. Y. Shih and T. Y. Lee, "Spalling of Intermetallic Compound during the Reaction between Electroless Ni(P) and Lead-free Solders", J. Microelectron. Packag. Soc., 11(3), 37 (2004).
- G. Milad, "Is "Black Pad" Still an Issue for ENIG?", Circuit World, 36(1), 10 (2010). https://doi.org/10.1108/03056121011015040
- D. J. Lee, J. W. Chio and S. H. Cho, "Study on Surface Morphology Control of Electroless Ni-P for Reliability Improvement of Solder Joints", J. Microelectron. Packag. Soc., 15(3), 27 (2008).
- 김성걸, 김주영, 김상현, 양우찬, 정호동, 김재호, "플립칩 솔 더 접합부의 신뢰성평가를 위한 보드레벨 낙하해석", 한국공 작기계학회 춘계학술대회 논문집, 188, 한국공작기계학회 (2008).
- J. Y. Kim and J. Yu, "A Study of Kirkendall Void Formation and Impact Reliability at the Electroplated Cu/Sn-3.5Ag Solder Joint", J. Microelectron. Packag. Soc., 15(1), 33 (2008).
- 이용성, 정종설, 이재현, 신기훈, 정성균, "보드 레벨 플립칩의 4점 굽힘 시험시 파단 특성 연구", 한국공작기계학회 춘계학술대회 논문집, 121, 한국공작기계학회 (2008).
- P. F. Yang, Y. S. Lai, S. R. Jian, J. Chen and R. S. Chen, "Nanoindentation Identifications of Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Derived by Diffusion Couples", Mater. Sci. & Eng. A, 485, 305 (2008). https://doi.org/10.1016/j.msea.2007.07.093
- S. H. Huh, K. D. Kim and J. S. Jang, "The Effect of Reliability Test on Failure Mode for Flip-chip BGA C4 Bump", J. Microelectron. Packag. Soc., 18(3), 45 (2011).
- K. Suganuma and K. S. Kim, "The Root Causes of the Black Pad Phenomenon and Avoidance Tactics", JOM, 60(6), 61 (2008). https://doi.org/10.1007/s11837-008-0074-3
- S. H. Huh, K. D. Kim, K. S. Kim and J. S. Jang, "A Novel High Speed Shear Test for Lead-free Flip Chip Packages", Eelecton. Matter. Lett., in press.
- K. Yamanaka, "Electromigration and Thermomigration in Flip-chip Joints in a High Wiring Density Semiconductor Package", J. Microelectron. Packag. Soc., 18(3), 67 (2011).