• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.28-35
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• 2024

Corrosion inside electronic packages significantly impacts the system performance and reliability, necessitating non-destructive diagnostic techniques for system health management. This study aims to present a non-destructive method for assessing corrosion in copper interconnects using the Smith chart, a tool that integrates the magnitude and phase of complex impedance for visualization. For the experiment, specimens simulating copper transmission lines were subjected to temperature and humidity cycles according to the MIL-STD-810G standard to induce corrosion. The corrosion level of the specimen was quantitatively assessed and labeled based on color changes in the R channel. S-parameters and Smith charts with progressing corrosion stages showed unique patterns corresponding to five levels of corrosion, confirming the effectiveness of the Smith chart as a tool for corrosion assessment. Furthermore, by employing data augmentation, 4,444 Smith charts representing various corrosion levels were obtained, and artificial intelligence models were trained to output the corrosion stages of copper interconnects based on the input Smith charts. Among image classification-specialized CNN and Transformer models, the ConvNeXt model achieved the highest diagnostic performance with an accuracy of 89.4%. When diagnosing the corrosion using the Smith chart, it is possible to perform a non-destructive evaluation using electronic signals. Additionally, by integrating and visualizing signal magnitude and phase information, it is expected to perform an intuitive and noise-robust diagnosis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.1119-1127
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• 2010

In this paper, the design and nonlinear simulation of a multistable electromagnetic microactuator, which provides four stable equilibrium positions within its operating range, have been discussed. Quadstable actuator motion has been made possible by using both X- and Y-directional bistable structures with snapping curved beams. Two pairs of the curved beams are attached to an inner frame in both X- and Y-directions to realize independent bistable behavior in each direction. For the actuation of the actuator at the micrometer scale, an electromagnetic actuation method in which Lorentz force is taken into consideration was used. By using this method, micrometer-stroke quadstability in a plane parallel to a substrate was possible. The feasibility of designing an actuator that can realize quadstable motion by using the electromagnetic actuation method has been thoroughly clarified by performing nonlinear static and dynamic analyses and electrothermal coupled-field analysis of the multistable microactuator.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.88-91
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• 2005

Although the MEMS element is made through a very precise manufacturing process, usually there is the difference between the modeling design and the actual product. So tuning is required. Through the frequency tuning(changing the characteristics of device), we can calibrate the fabrication error and uncertainty. I'll propose the method of changing the natural frequency through the imposing the axial force on the anchor part to separate the sensing part and the tuning part. When the shape of section is the form of rectangular, the degree of the natural frequencies' change under axial force appears D be different. Applying a tuning force of 30 $\mu$N, the natural frequencies' difference can be reduced by 5 percent.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.7-13
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• 1995

마이크로솔더링에 의한 전자기기는, 사회기능의 중추가 되는 컴퓨터, 통신 기기, 항공기 인공위성 등의 제어계를 구성하므로, 그 접속부에 대한 높은 신뢰성의 요구는 그 무엇보다 중요하다. 전자기기에 있어서의 솔더 접속부는 집과 기판의 전기 적.기계적 접속의 역할을 하고 있으며, 따라서 개개의 접속부의 파단은 전체의 불량 으로 연결된다. 실제 전자콤포넌트와 그 시스템의 단선 등의 사고에 있어서 자주 발생 하는 사고중의 하나가 솔더접속부의 단선에 의한 것이며, 그 단선중에서도 가장 보편 적이며 또한 대단히 심각한 문제로서 주목을 받고 있는 것이 솔더접속부의 열피로파단 이다. 전자기기를 사용할 때, 스위치의 on-off에 의한 power cycle과 환경의 온도변화 에 기인하는 반복열 사이클은 솔더접속부의 피로를 일으키게 되고, 결국에는 사용중에 파단을 초래하게 된다. 이러한 온도변화의 범위는 약 -55.deg. - 150.deg.C로 예상할 수 있으며, 여기서 최고온도인 150.deg.C는 Pb-Sn 공정합금의 경우 0.9Tm.p.이상의 고온에 해당한다. 이 피로는 등온적으로 또는 열사이클중에 발생하기도 한다. 솔더접 속부의 열피로수명은 대부분의 공업재료에서 나타나는 저사이클피로거동과 유사하게 발생하며, 솔더 접속부에 인가되는 열변형/응력(thermal strain/stress)의 크기에 크게 의존하는 것으로 알려져 있다. 솔더는 서로 다른 열팽창계수를 갖는 칩과 회로 기관의 두종류의 재료를 접속하기 때문에, 상기한 바와 같은 반복열사이클에 의하여 발생하는 열변형/응력이 접속부의 피로.파단을 야기시킨다. 이러한 솔더접속부에 대한 주기적인 응력/변형의 인가는 접속부에 내.외적으로 현저한 변화를 야기시키게 되고, 열피로로 연결되며 결국에는 시스템의 전기적 단선을 초래하게 된다. 또한 열피로파단 현상는 변형/응력의 크기 뿐 만아니라 솔더합금자체의 야금학적인 물성에도 크게 의존 하며, 내적.외적인 열변화에 의한 야금학적인 특성변화도 크게 영향을 미친다. 솔더 접속부의 신뢰성에 대한 연구는, 그 중요성에 비추어 볼 때, 지금까지 수많은 연구가 행하여져 왔다. 그러나 신뢰성과 관련된 열피로파단현상에 대한 야금학적인 면에서의 연구는 비교적 적은 편이다. 따라서 본 해설에서는 전자기기의 마이크로 솔더접속부 에서 발생하는 열피로파단현상에 대한 야금학적인 면에 중점을 두어 서술하고자 한다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.3
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• pp.47-56
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• 2005

This paper presents a performance improvement result with the aid of closed feedback controller loop to a micro gyroscope. The dynamic model of a micro gyroscope is derived and a conventional proportional and derivative controller is designed via frequency domain analysis. The proposed control loop is implemented using several analog devices and applied to the SNU-Bosch MEMS gyroscope to check its performance improvement in real environment. The experiments demonstrated the performance improvement with the proposed feedback control loop. The bandwidth, linearity, and bias stability are improved to 78 Hz, 0.504 %, and 0.043 deg/sec, respectively, from 35 Hz, 2.07 %, and 0.066 deg/sec of open loop system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.10
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• pp.1-7
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• 2020

In this study, a multichannel gas-liquid microextraction system is designed by integrating the automatic elution of extraction line and multichannel gas-purging liquid phase microextraction. The system uses an injection pump and inert gas to push the extraction solvent to a sample bottle of a gas-phase color autosampler and then implements multichannel gas-liquid microextraction and gas chromatography-mass spectrometry. The system also employs a three-way integrated micro-high-temperature heater, syringe pump, and microflow controller to realize the simultaneous processing of multiple groups of samples, thus improving the sample pretreatment speed and reproducibility and reducing human error. Autoinjection experiments were implemented with polycyclic aromatic hydrocarbon standard samples. The experiments show that the average recovery rate of the system exceeds 70%, and the relative standard among the channels is less than 15%.