• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.9 s.112
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• pp.883-889
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• 2006

In this paper, parasitic resonance modes generated in a conductor backed coplanar wave guide(CBCPW) and stripline band pass filter(BPF) and the oscillation phenomena of a 40 GHz power amplifier module(PAM) are analyzed and several methods to suppress them are presented for low-temperature co-fired ceramic(LTCC) based millimeter-wave RF System-in-Package(SiP) applications. Parasitic rectangular wave guide(RWG) modes of the CBCPW structure are completely suppressed in the operation frequency band by decreasing the distance between its vias and by increasing the mode frequency. In the stripline structure, RWG resonance modes are clearly eliminated by removing some vias facing each other and by placing them diagonally. In the case of the 40 GHz PAM, in order to reduce a cross talk due to radiation that is generated from interconnection discontinuities, high isolation structures such as embedded DC bas lines and CPW signal lines are used and then the oscillated PAM is improved.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.2A
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• pp.214-217
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• 2004

In this paper, a Ka-band LTCC (low temperature co-fired ceramic) narrow bandpass filter (BPF) is firstly presented. This BPF shows very narrow 3dB fractional bandwidth of 4.5 ％ centered at 28.7㎓. The advantages of multi-layered LTCC technology such as high integration and vertical stacking capabilities were employed to design three-dimensional interdigital end-coupled embedded microstrip narrow BPF. The difficulties in controlling the precise distance between two adjacent resonators in LTCC end-coupled BPF were overcome by locating the resonators on different layers. The measured insertion loss is 3dB at 28.7㎓, pass band is from 27.9 ㎓ to 29.2 ㎓, and the return loss in the pass band is less than 10 dB.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.245-245
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• 2010

최근에 반도체 소자 및 마이크로머신, 바이오센서 등에 사용되는 미세 부품에 대한 연구 개발이 활발히 진행되고 있다. 미세 부품을 제작하기 위한 MEMS 공정은 대표적으로 화학용액을 이용한 습식식각, 플라즈마를 이용한 건식식각 등이 주를 이룬다. Micro blaster는 경도가 강하고 화학적 내성을 가지며 용융점이 높아 반도체 MEMS 공정에 어려움이 있는 기판을 다양한 형태로 식각 할 수 있는 기계적인 식각 공정 기술이라 할 수 있다. Micro blaster의 식각 공정은 고속의 날카로운 입자가 공작물을 타격할 때 입자의 아래에는 고압축응력이 발생하게 되고, 이 고압축 응력에 의하여 소성변형과 탄성변형이 발생된다. 이러한 변형이 발전되어 재료의 파괴 초기값보다 크게 되면 크랙이 발생되고, 점점 더 발전하게 되면 재료의 제거가 일어나는 단계로 이루어진다. 본 연구에서는 micro blaster 장비를 반도체 MEMS 공정에 적용하기 위한 식각 특성에 관하여 확인하였다. Micro blaster 장비와 식각에 사용한 파우더는 COMCO INC. 제품을 사용하였다. Micro blaster를 $Al_2O_3$ 파우더의 입자 크기, 분사 압력, 기판의 종류, 노즐과 기판과의 간격, 반복 횟수, 노즐 이동 속도 등의 공정 조건에 따른 식각 특성에 관하여 분석하였다. 특히 실제 반도체 MEMS 공정에 적용 가능한지 여부를 확인하기 위하여 바이오 PCR-chip을 제작하였다. 먼저 glass 기판과 Si wafer 기판에서의 식각률을 비교 분석하였고, 이 식각률을 바탕으로 바이오 PCR-chip에 사용하게 될 미세 홀과 미세 채널, 그리고 미세 챔버를 형성 하였다. 패턴을 형성하기 위하여 TOK Ordyl 사의 DFR(dry film photoresist:BF-410)을 passivation 막으로 사용하였다. Micro blaster에 사용되는 파우더의 직경이 수${\mu}m$ 이상이기 때문에 $10\;{\mu}m$ 이하의 미세 채널과 미세홀을 형성하기 어려웠지만 현재 반도체 MEMS 공정 기술로 제작 연구되어지고 있는 바이오 PCR-chip을 직접 제작하여 micro blaster를 이용한 반도체 MEMS 공정 기술에 적용 가능함을 확인하였다.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.79-85
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• 2023

A novel low-temperature co-fired ceramic (LTCC) dielectric, composed of (1-4x)Bi_1.5Zn_1.0Nb_1.5O₇-3xBi₂Zn_2/3Nb_4/3O₇-2xLiZnNbO₄ (x=0.03-0.21), was synthesized through reactive liquid phase sintering of Bi_1.5Zn_1.0Nb_1.5O₇-xLi₂CO₃ ceramic at temperatures ranging from 850℃ to 920℃ for 4 hours. During sintering, Li₂CO₃ reacted with Bi_1.5Zn_1.0Nb_1.5O₇, resulting in the formation of Bi₂Zn_2/3Nb_4/3O₇, and LiZnNbO₄. The resulting sintered body exhibited a relative sintering density exceeding 96% of the theoretical density. By altering the initial Li₂CO₃ content (x) and consequently modulating the volume fraction of Bi_1.5Zn_1.0Nb_1.5O₇, Bi₂Zn_2/3Nb_4/3O₇, and LiZnNbO₄ in the final sintered body, a sample with high dielectric constant (ε_r), low dielectric loss (tan δ), and the temperature coefficient of dielectric constant (TCε) characterized by NP0 specification (TCε ≤ ±30 ppm/℃) was achieved. As the Li₂CO₃ content increased from x=0.03 mol to x=0.15 mol, the volume fraction of Bi₂Zn_2/3Nb_4/3O₇ and LiZnNbO₄ in the composite increased, while the volume fraction of Bi_1.5Zn_1.0Nb_1.5O₇ decreased. Consequently, the dielectric constant (εr) of the composite materials varied from 148.38 to 126.99, the dielectric loss (tan δ) shifted from 5.29×10^-4 to 3.31×10^-4, and the temperature coefficient of dielectric constant (TCε) transitioned from -340.35 ppm/℃ to 299.67 ppm/℃. A dielectric exhibiting NP0 characteristics was achieved at x=0.09 for Li₂CO₃, with a dielectric constant (ε_r) of 143.06, a dielectric loss (tan δ) value of 4.31×10^-4, and a temperature coefficient of dielectric constant (TCε) value of -9.98 ppm/℃. Chemical compatibility experiment with Ag electrode revealed that the developed composite material exhibited no reactivity with the Ag electrode during the co-firing process.

• Korean Chemical Engineering Research
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• v.59 no.3
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• pp.399-409
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• 2021

In order to utilize dolomite as a calcium/magnesium compound material, it was prepared highly reactive calcined dolomite(CaO·MgO) using a microwave kiln (950 ℃, 60 min). The experiment was performed according to the standard of the hydration test (ASTM C 110) and hydration reactivity was analyzed as medium reactivity (max 74.1 ℃, 5 min). Experiments were performed with calcined dolomite and salt (MgCl₂·6H₂O) (a) 1:1, (b) 1:1.5, and (c) 1:2 wt% based on the hydration reaction of calcined dolomite. The result of X-ray diffraction analysis confirmed that MgO of calcined dolomite increased to Mg(OH)₂ as the salt addition ratio increased. After the separating reaction, calcium was stirred at 80 ℃, 24 hr that produced CaCl₂ of white crystal. XRD results, it was confirmed calcium chloride hydrate (CaCl₂·(H₂O)x) and CaO of calcined dolomite and salt additional reaction was separated into CaCl₂. And it was synthesized with Ca(OH)₂ 99 wt% by NaOH adding reaction to the CaCl₂ solution, and the synthesized Ca(OH)₂ was manufactured CaO through the heat treatment process. In order to prepare calcium carbonate, CaCO₃ was synthesized by adding Na₂CO₃ to CaCl₂ solution, and the shape was analyzed in cubic form with a purity of 99 wt%.

• Economic and Environmental Geology
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• v.54 no.2
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• pp.233-245
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• 2021

Many studies on the microstructures in rocks have been conducted using experimental methods with various equipment as well as natural rock studies to see the development of microstructures and understand their mechanisms. Grain boundary migration of mineral aggregates in rocks could cause grain growth or grain size changes during metamorphism or deformation as one of the main recrystallization mechanisms. This study suggests improved ways regarding the analog material experiments with reformed equipment to see sequential observations of these grain boundary migration. It can be more efficient than the existing techniques and carry out an appropriate microstructure analysis. This reformed equipment was implemented to enable optical manipulation by mounting polarizing plates capable of rotating operation on a stereoscopic microscope and a deformation rig capable of experimenting with analog materials. The equipment can automatically control the temperature and strain rate of the deformation rig by microcontrollers and programming and can take digital photomicrographs with constant time intervals during the experiment to observe any microstructure changes. The composite images synthesized using images by rotated polarizing plates enable us to see more accurate grain boundaries. As a rock analog material, norcamphor(C7H10O) was used, which has similar birefringence to quartz. Static grain growth and simple shear deformation experiments were performed using the norcamphor to verify the effectiveness of the equipment. The static grain growth experiments showed the characteristics of typical grain growth behavior. The number of grains decreases and the average grain size increases over time. These case experiments also showed a clear difference between the growth curves with three temperature conditions. The result of the simple shear deformation experiment under the medium temperature-low strain rate showed no significant change in the average grain size but presented the increased elongation of grain shapes in the direction of about 53° regarding the direction perpendicular to the shearing direction as the shear strain increases over time. These microstructures are interpreted as both the plastic deformation and the internal recovery process in grains are balanced by the deformation under the given experimental conditions. These experiments using the reformed equipment represent the ability to sequentially observe changing the microstructure during experiments as desired in the tests with the analog material during the entire process.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.