• Journal of the Microelectronics and Packaging Society
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• v.2 no.2
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• pp.41-48
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• 1995

본 논문에서는 테이프 케스팅법으로 제조한 BaTiO3 계 쉬트형 PTCR 세라믹스의 적기적물성에 대하여 연구하였다. PTCR의 조성은 몰비로 89.9 BaTiO3-0.1Sb2O3-10 CaTiO3-0.05MnO3였고 케스팅용 슬러리의 유기물질은 결합제로 PVB 가소제로는 DBP 용제 로는 에탄올과 톨류엔 그리고 분산제로는 fish oil을 사용하였다. 케스팅하여 얻어진 그린쉬 트를 13$25^{\circ}C$와 135$0^{\circ}C$에서 1시간 소성하여 얻은 쉬트형 PTCR을 온도에 대한 저항 및 복소 임피던스를 측정하고 미세구조를 SEM으로 관찰하여 칩화를 위한 조건들을 검토하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.101-103
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• 2002

PDP등의 각종 전자부품에 사용되는 Ag paste 의 frit은 주로 PbO를 주성분으로 하는 물질이 사용되어왔다. 그러나 이러한 Pb계 재료는 환경유해한물질로 규제대상이 되고 있다. 이에 대비하여 본 연구에서는 Bi$_2$O$_3$을 주성분으로 하여 B$_2$O$_3$, SiO$_2$, A1$_2$O$_3$가 함유된 새로운 frit을 개발하였다. TMA등을 이용하여 열적 특성을 관찰하였으며, 전극용 Ag-Paste를 제조한 후 스크린프린팅하여 인쇄성과 미세구조를 관찰하였고, 전기저항 및 소성두께를 측정하였다. 또한 전이온도, 연화점, 열팽창계수등을 조사하여 기존의 Pb함유 frit과 물성을 비교하였으며 PDP용 Ag전극에 적용하는 새로운 frit으로의 가능성을 검토하였다.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.65-70
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• 2023

Nanoimprint lithography (NIL) has attracted much attention due to its process simplicity, excellent patternability, process scalability, high productivity, and low processing cost for pattern formation. However, the pattern size that can be implemented on metal materials through conventional NIL technologies is generally limited to the micro level. Here, we introduce a novel hard imprint lithography method, extreme-pressure imprint lithography (EPIL), for the direct nano-to-microscale pattern formation on the surfaces of metal substrates with various thicknesses. The EPIL process allows reliable nanoscopic patterning on diverse surfaces, such as polymers, metals, and ceramics, without the use of ultraviolet (UV) light, laser, imprint resist, or electrical pulse. Micro/nano molds fabricated by laser micromachining and conventional photolithography are utilized for the nanopatterning of Al substrates through precise plastic deformation by applying high load or pressure at room temperature. We demonstrate micro/nanoscale pattern formation on the Al substrates with various thicknesses from 20 ㎛ to 100 mm. Moreover, we also show how to obtain controllable pattern structures on the surface of metallic materials via the versatile EPIL technique. We expect that this imprint lithography-based new approach will be applied to other emerging nanofabrication methods for various device applications with complex geometries on the surface of metallic materials.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.45-52
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• 2009

The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.11-16
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• 2011

Recently, according to the rapid development of display, many display applications, such as, cellular phone, navigation, monitor and LCD TV have been changed from CRT type to LCD type. BLU(Back Light Unit) is one of main parts in LCD unit and generally, it consists of a light source, a reflective sheet, a LGP(Light Guide Plate), a diffuser sheet, and two prism sheets. The most important component of BLU is a light guide plate, which diffuses the input light to the TFT-LCD module uniformly. The LGP is usually made by injection molding process, and it has numerous optical micro patterns on the surface. In the present study the micro-patterned stamper which has cylindrical shape was fabricated by using the UV-LiGA process. And the replication characteristics have been compared among three different kinds of injection molding process; general injection molding, injection/compression molding and RHCM(Rapid Heating and Cooling Molding). Average replication ratios of CIM and ICM were 19.1% and 64.6%, respectively. On the other hand, the average replication ratio of RHCM process showed the higher value of 98.4% among these. It show that maintaining the mold surface above $T_g$ could increase the replication ratio of micro patterns substantially.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.1-5
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• 2000

Co-fired resistors for high frequency MCM-C (Multi Chip Module-Cofired) were fabricated and measured their RF properties from DC to 6 GHz. LTCC (Low Temperature Co-fired Ceramics) substrates with 8 layers were used as the substrates. Resisters and electrodes were printed on the 7th layer and connected to the top layer by via holes. Deviation from DC resistance of the resistors was resulted from the resister pastes, resistor size, and via length. From the experimental results, the suitable equivalent circuit model was adopted with resistor, transmission line, capacitor, and inductor. The characteristic impedance $Z_{o}$ of the transmission line from the equivalent circuit can explain the RF behavior of the buried resistor according to the structural variation.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.285-291
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• 2002

The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of If chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this paper, we developed the small size NC punching system which has an aligning kinematics between the rectangular shaped punch and die. The punch is driven by an ai cylinder and the sheet metal is moving on the X-Y table system which is driven by two stewing motors. The microprocessor control the whole system and communicate with the monitoring PC by RS232C serial communication protocol. The graphic user interface program in PC monitors nil control the punching system. The cross shaped joint hinge supports the punching die and positioned by two differential screws, whose are installed in perpendicular directions. The aligning between the punch and die is performed using the sheets of half thickness(0.1mm Brass) of the real process for the frame of the TFT-LCD. Using half thickness Brass, the burr formation is magnified and we can decide the aligning direction more easily then using the real thickness(0.2mm) Aluminum. In this paper, the aligning results are measured manually using the SEM photographs and we hope to make the automated aligning procedures using some kinds of image processing techniques.