• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.2
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• pp.188-194
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• 2006

Since the late 1920's possibility of commercial hydroponics was testified practically. Hydroponics is used as environmentally friendly agriculture production system recently with high effectiveness. Now that existing irrigation control systems such as time control or solar radiation control cannot satisfy stable water content in root substrates, the needs for new irrigation system keep increasing. In this paper, we proposed environmentally friendly automatic irrigation management system by employing automation system based on electronic control system, which could solve problems based on manual irrigation management system. In addition, it suggested to be applied to any crops and will be able to overcome existing limit in irrigation by measuring the water content of root substrate in realtime.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.252-252
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• 2010

적외선 센서는 빛의 유무에 관계없이 주 야간 전방의 물체에서 발산하는 미약한 적외선(열선)을 감지하여 영상으로 재현하는 열상시스템은 자동차 야간 운전자 보조용 나이트 비젼, 핵심 시설의 감시 관리, 군수 등의 분야에 적용되어지고 있는 최첨단, 고부가가치를 지니고 있는 기술이다. 양자형은 센서 특성은 좋으나 냉각기(작동온도: $-196^{\circ}C$) 및 고진공 패키지인 dewar를 사용하는 반면에, 열형은 대부분 상온에서 동작되는 온도안정화를 위한 전자냉각모듈만을 구비하면 되므로 저가형으로 제작이 가능한 비냉각형 적외선 센서이다. 본 연구에서는 적외선 센서용 진공패키지 조립공정 및 패키지된 센서의 측정기술을 개발하였다. 금속 메탈패키지를 제작하였으며, 금속 진공패키지는 소자냉각용 TE Cooler와 장수명 진공유지를 위한 getter, 그리고 센서칩, 온도센서를. 장착하여 칩을 조립하였다. Cap ass'y와 base envelop의 솔더링 공정을 수행하였으며, 진공패키지의 진공유지를 위해 TMP를 이용하여 진공을 유지하고, 약 5일동안 패키지 bake-out을 수행하였다. 진공압력은 $10^{-7}\;torr$ 이하를 유지하였으며, getter를 활성화시키고, pinch-off 공정으로 조립 ass'y를 완성하였다. 진공 패키지의 기밀성은 He leak tester를 이용하여 측정하였으며, ${\sim}10^{-9}\;std.cm^3/sec$로 기밀성을 유지하였다. TE cooler를 작동한 온도안정성은 0.05 K 이하였다. 볼로미터 센서의 반응도는 $10^2\;V/W$ 이상을 나타내었으며, 탐지도는 $2{\times}10^8cm-Hz^{1/2}/W$를 나타내었다. 본 연구를 통하여 얻어진 결과는 향후 2차원 열영상용 어레이 검출기 및 웨이퍼수준의 패키징 공정에 유용하게 응용될 것으로 판단된다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.05a
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• pp.454-457
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• 2014

Arduino is for design based on open source prototyping platform, artist, designer, hobby activists, etc, i has been designed for all those who are interested in the environment construct. Arduino adventage you can easily create applications hardware, without deep knowledge about the hardware. Configuration of arduino using AVR microcontroller ATmage 168, software to action arduino using arduino program, MATLAB, Processing. Arduino is open source base, you can hardware production directly and using shield additionally, the arduino can be combined. Android is open source. Continue to expand through a combination of hardware, Arduino. It name is shield. Be given to the Arduino Uno board to the main board, the shield extends to the various aspects and help can be equipped with more features. The shield on top of the shield can be combined as a kind of shield and Ethernet shield, motor shield, the shield RFID hardware beyond a simple extension can be configured. In this paper, RFID technology Sealed for automatic recognition of the elderly by the elderly to identify and tag them SM130 13.56Mhz compatible hardware was constructed by combining tags.

• Journal of Advanced Navigation Technology
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• v.25 no.3
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• pp.223-228
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• 2021

In this paper, we proposed a slot-type antenna with microstrip feed embedded in a PCB for Zigbee communication (2.4 ~ 2.484 GHz). The proposed antenna is designed on a FR-4 substrate with dielectric constant 4.3, thickness of 1.6 mm, and size of 50×65 mm². Through simulations, trends of design parameters are analyzed and optimized, and the proposed antenna composed with three slots satisfy the frequency band. The measured impedance bandwidths (|S₁₁| ≤ -10 dB) of fabricated antenna are 900 MHz (2 ~ 2.9 GHz) in Zigbee frequency band. In addition, the radiation pattern showed omnidirectional characteristics for E and H-planes, and the gain of antenna in Zigbee frequency band was 1.782 dBi.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.1
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• pp.114-123
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• 2007

As a promising technology that enables ubiquitous computing and will lead the information technology industries of the next generation, the new field of sensor networks is one of the most active research topics today. From now on, each node, the network formation, and even the sensor network itself will interact with the generic network and evolve dynamically according to environmental changes, in a process of continual creation and extinction. In this paper, we propose a address-Internetworking scheme for interactive networking between a sensor network and the Internet based on the TCP port-numbers. The proposed scheme enables internetworking between a sensor network address scheme based on Zigbee and the Internet address scheme based on the Internet Protocol version 6 (IPv6). We implement the proposed address-Internetworking scheme using Berkeley TinyOS, Mica Motes, and IP. In addition we verify the proposed scheme by an interconnection experiment, which involves wireless sensor networks and the Internet, using IPv4/IPv6.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.83-89
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• 2020

For the past few decades, as part of efforts to protect the environment where fossil fuels, which have been a key energy resource for mankind, are becoming increasingly depleted and pollution due to industrial development, ecofriendly secondary batteries, hydrogen generating energy devices, energy storage systems, and many other new energy technologies are being developed. Among them, the lithium-ion battery (LIB) is considered to be a next-generation energy device suitable for application as a large-capacity battery and capable of industrial application due to its high energy density and long lifespan. However, considering the growing battery market such as eco-friendly electric vehicles and drones, it is expected that a large amount of battery waste will spill out from some point due to the end of life. In order to prepare for this situation, development of a process for recovering lithium and various valuable metals from waste batteries is required, and at the same time, a plan to recycle them is socially required. In this study, we introduce a nanoscale pattern transfer printing (NTP) process of Li2CO3, a representative anode material for lithium ion batteries, one of the strategic materials for recycling waste batteries. First, Li2CO3 powder was formed by pressing in a vacuum, and a 3-inch sputter target for very pure Li2CO3 thin film deposition was successfully produced through high-temperature sintering. The target was mounted on a sputtering device, and a well-ordered Li2CO3 line pattern with a width of 250 nm was successfully obtained on the Si substrate using the NTP process. In addition, based on the nTP method, the periodic Li2CO3 line patterns were formed on the surfaces of metal, glass, flexible polymer substrates, and even curved goggles. These results are expected to be applied to the thin films of various functional materials used in battery devices in the future, and is also expected to be particularly helpful in improving the performance of lithium-ion battery devices on various substrates.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.23 no.3
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• pp.27-33
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• 2023

Countries around the world are calling for stronger law enforcement to combat the production and distribution of child sexual exploitation images, such as child grooming. Given the scale and importance of this social problem, it requires extensive cooperation between law enforcement, government, industry, and government organizations. In the wake of the Nth Room Case, there have been some amendments to the Enforcement Decree of the Telecommunications Business Act regarding additional telecommunications services provided by precautionary operators in Korea. While Naver and others in Korea use Electronics and Telecommunications Research Institute's own technology to filter illegal images, Microsoft uses its own PhotoDNA technology. Microsoft's PhotoDNA is so good at comparing and identifying illegal images that major global operators such as Twitter are using it to detect and filter images. In order to meet the Korean government's testing standards, Microsoft has conducted more than 16 performance tests on "PhotoDNA for Video 2.0A," which is being applied to the Bing service, in cooperation with the Korea Communications Commission and Telecommunications Technology Association. In this paper, we analyze the cases that did not pass the standards and derive improvement measures related to adding logos. In addition, we propose to use three video datasets for the performance test of filtering against illegal videos.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.8 no.4
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• pp.243-248
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• 2015

Since phase noise is one of the most important parameters in the design of microwave oscillators, several methods have been proposed to reduce the phase noise. These methods have focused on improving the quality factor of resonators, which result in low phase noise oscillators. Dielectric resonators have been widely used for low phase noise in microwave oscillators due to their high quality factor. However this cannot be used in MMIC oscillators because they have a 3D structure. In this paper, to overcome this problem a novel resonator using open ring type DGS is proposed for improvement of phase noise characteristics that is weak point of oscillator using planar type microstrip line resonator, and oscillator for 5.8GHz band is designed using proposed DGS resonator. The open ring type DGS resonator is composed of DGS cell etched on ground plane under $50{\Omega}$ microstrip line. At the fundamental frequency of 5.8GHz, 6.1dBm output power and -82.7 dBc@100kHz phase noise have been measured for oscillator with ring type DGS resonator. The phase noise characteristics of oscillator is improved about 96.5dB compared to one using the general ${\lambda}/4$ microstrip resonator.