• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.117-123
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• 2015

In order to develop stretchable substrate technology for stretchable devices, locally stiffness-variant stretchable substrates were processed with two polydimethylsiloxane elastomers of different stiffnesses and their deformation behavior was characterized. Low-stiffness substrate matrix and embedded high-stiffness island of the stretchable substrate were formed by using Dragon Skin 10 of the elastic modulus of 0.09 MPa and Sylgard 184 of the elastic modulus of 2.15 MPa, respectively. A stretchable substrate was fabricated to a configuration of 6.5 cm length, 0.4 cm thickness, and 2.5 cm width. The elastic modulus of a stretchable substrate was increased from 0.09 MPa to 0.13~0.33 MPa by embedding a Sylgard 184 island of 1 cm width and 1~6 cm length into the center part of the Dragon Skin 10 substrate matrix. The elastic modulus of a stretchable substrate was improved to 0.16~0.2 MPa by embedding a Sylgard 184 island of 4 cm length and 0.5~1.5 cm width and to 0.1421~0.154 MPa by embedding a Sylgard 184 island of 2 cm length and 0.5~1.5 cm width. With increasing the tensile strain of a stretchable substrate, deformation restriction of the locally stiffness-variant Sylgard 184 island was further enhanced due to substantial increase in the strength difference between Sylgard 184 and Dragon 10 at large strain.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.42 no.1
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• pp.15-28
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• 2016

Water-in-oil emulsions including water-in-ester oil and water-in-silicone oil (W/O+S) have various advantages such as blocking moisture evaporation and forming air permeable membrane. However, their applications have been limited due to the poor stability under low viscosity condition. In this study, we investigated the effect of synergistic interaction between nonionic surfactant, micro-size particles and cationic surfactant on the stability of W/O+S formulation. The stability of W/O+S emulsions was changed as a function of cationic surfactant concentration where it increased at lower concentration and then started to decrease above a critical point. Finally, emulsion phase inversion occurred at a high concentration. The results suggest that W/O+S emulsions of low viscosity ranging from 2000 to 5000 cps can be stabilized under the conditions where a nonionic surfactant, micro-size particles and a cationic surfactant are used in the range of 1.0 ~ 4.0 wt%, 2.5 wt% and 0.1 ~ 0.5 wt%, respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.165-165
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• 2017

지난 수 십 년 동안, 전 세계적으로 자원의 소비가 급격히 증가하게 되면서 최근 자원 고갈은 물론 환경오염이 커다란 이슈로 문제가 되고 있다. 이에 따라 재료 관련 분야에 있어서는 보다 효율적이고 친환경적인 방법으로 자원을 활용해야 된다는 필요성이 대두되었고 이와 같은 관점에서 목적하는 성분이 우수하고 환경 친화적인 표면처리 재료 개발연구가 활발하게 진행되고 있는 실정이다. 그 중 플라즈마 전해 산화(Plasma Electrolytic Oxidation, PEO)는 알루미늄, 마그네슘 등의 경금속의 경도를 향상시키고 높은 내마모성, 내식성을 갖게 하는 표면처리로써 그 관심이 증가하고 있다. 이 플라즈마 전해 산화는 일반적으로 공정비용 대비 효과적이고 환경 친화적이며 코팅 성능 면에서 우수하다고 알려져 있다. 이러한 고유한 특성으로 인해 플라즈마 전해 산화 코팅은 최근 몇 년 동안 기계, 자동차, 우주항공, 의학 및 전기 산업 등의 분야에서 그 적용이 점차 증가하고 있는 상황이다. 한편, 플라즈마 전해 산화 코팅을 하는 모재들의 경우 부동태 산화피막을 용이하게 형성할 수 있는 특성의 모재에 한정되고 있어서 그 응용확대에 한계가 있는 것이 사실이다. 따라서 본 연구에서는 플라즈마 전해 산화법을 사용하여 용융알루미늄도금 강판 상에 산화피막 형성을 시도하였다. 전원공급 장치의 양극은 전해질 속에 잠겨있는 작동전극에 연결하고 음극은 대전극 역할을 하는 스테인레스강 전해질 용기에 연결되었다. 전해질은 Sodium Aluminate 및 기타 첨가제를 함유한 것을 사용하였고 온도는 열교환기를 사용하여 $30^{\circ}C$ 이하로 유지되었다. 또한 여기서 전류밀도는 $5{\sim}10A/dm^2$, 실험 주파수는 700Hz, Duty cycle은 30 및 90%의 각 조건에서 공정처리 시간을 각각 30분 및 60분 동안 진행하였다. 이와 같은 조건에서 형성한 막들에 대해서는 주사형전자현미경(SEM)을 이용하여 코팅 막의 표면 및 단면의 모폴로지를 관찰하였음은 물론 EDS 및 XRD 측정을 통하여 원소조성분포 및 결정구조를 각각 분석하였다. 또한 이 코팅 막들에 대한 내식성은 5% 염수분무 환경 중 노출시험(Salt spray test), 3% NaCl 용액에서의 침지 시험 및 전기화학적 동전위 양극분극(Potentiodynamic Polarization) 시험을 진행하여 평가하였다. 이상의 실험결과에 의하면, 제작조건별 플라즈마 전해 산화 코팅 막의 모폴로지 및 결정구조가 상이하게 나타나는 것을 알 수 있었다. 코팅 막의 모폴로지 관찰 결과, 공정 시간에 비례하여 표면에 존재하는 원형 기공의 수는 감소하였으나 그 크기가 커지고 크레이터의 직경 또한 커진 것이 확인되었다. 이 기공은 마이크로 방전에 의해 형성된다고 알려져 있는데 공정 시간이 증가함에 따라 코팅 두께가 점차 증가하여 마이크로 방전의 빈도수가 줄어들고 그 강도는 증가하게 되어 기공 크기가 증가한 것으로 사료된다. 또한 공정시간이 긴 시편에서 표면에 크랙이 다수 존재하는 것으로 확인되었다. 이것은 방전에 의해 고온이 된 소재가 차가운 전해질과 만나게 되어 생긴 큰 온도구배로 인해 강한 열응력이 발생하여 균열을 초래한 것으로 보인다. 조성원소 분석 결과 원형 기공 주변의 크레이터 영역에는 알루미늄이 풍부하였으며 그 주변에 결절상을 갖는 구조에서는 전해질 성분의 원소가 포함되어 있는 것이 확인되었다. 이러한 코팅 막의 표면 특성은 내식성에 영향을 주게 된 원인으로 사료된다. 동전위 분극측정 결과에 의하면 플라즈마 전해 산화 공정 시간이 길어질수록 부식전류밀도가 증가하였다. 이것은 공정시간이 길어짐에 따라 강한 방전이 발생하여 기공의 크기가 증가하고 크랙이 발생하게 되면서 내식성이 저하된 것으로 판단된다. 종합적으로 재료특성 분석 및 내식성 평가를 분석한 결과, 플라즈마 전해 산화의 공정 시간이 너무 길게 되면 오히려 내식성은 저하되는 것이 확인되었다. 이상의 연구를 통하여 고내식 특성을 갖는 플라즈마 전해 산화 막의 유효성을 확인하였으며 용융알루미늄강판 상에 실시한 플라즈마 전해 산화 처리에 대한 기초적인 응용 지침을 제시할 수 있을 것으로 사료된다.

• Science of Emotion and Sensibility
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• v.25 no.4
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• pp.45-52
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• 2022

Recently, interest in and demand for sensors that recognize physical activity and their products are increasing. In particular, the development of wearable materials that are flexible, stretchable, and able to detect the user's biological signals is drawing attention. In this study, an experiment was conducted to improve the dip-coating efficiency of a single-walled carbon nanotube dispersion solution after fine holes were made in a hydrophobic material with a micro needle. In this study, dip-coating was performed with a material that was not penetrated, and comparative analysis was performed. The electrical conductivity of the sensor was measured when the sensor was stretched using a strain universal testing machine (Dacell Co. Ltd., Seoul, Korea) and a multimeter (Keysight Technologies, Santa Rosa, CA, USA) was used to measure resistance. It was found that the electrical conductivity of a sensor that was subjected to needling was at least 16 times better than that of a sensor that was not. In addition, the gauge factor was excellent, relative to the initial resistance of the sensor, so good performance as a sensor could be confirmed. Here, the dip-coating efficiency of hydrophobic materials, which have superior physical properties to hydrophilic materials but are not suitable due to their high surface tension, can be adopted to more effectively detect body movements and manufacture sensors with excellent durability and usability.

• Journal of Sensor Science and Technology
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• v.11 no.3
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• pp.163-170
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• 2002

This paper proposes a $10\;{\mu}m$ thick oxide air-bridge structure which can be used as a substrate for RF circuits. The structure was fabricated by anodic reaction, complex oxidation and micromachining technology using TMAH etching. High quality films were obtained by combining low temperature thermal oxidation ($500^{\circ}C$, 1 hr at $H_2O/O_2$) and rapid thermal oxidation (RTO) process ($1050^{\circ}C$, 2 min). This structure is mechanically stable because of thick oxide layer up to $10\;{\mu}m$ and is expected to solve the problem of high dielectric loss of silicon substrate in RF region. The properties of the transmission line formed on the oxidized porous silicon (OPS) air-bridge were investigated and compared with those of the transmission line formed on the OPS layers. The insertion loss of coplanar waveguide (CPW) on OPS air-bridge was (about 2dB) lower than that of CPW on OPS layers. Also, the return loss of CPW on OPS air-bridge was less than about -20 dB at measured frequency region for 2.2 mm. Therefore, this technology is very promising for extending the use of CMOS circuitry to higher RF frequencies.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.83-89
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• 2015

In this paper, we propose a fabrication technique for enhanced electrical properties of piezoelectric thick films with excellent patterning property using sol-infiltration and a direct-patterning process. To achieve the needs of high-density and direct-patterning at a low sintering temperature (< $850^{\circ}C$), a photosensitive lead zirconate titanate (PZT) solution was infiltrated into a screen-printed thick film. The direct-patterned PZT films were clearly formed on a locally screen-printed thick film, using a photomask and UV light. Because UV light is scattered in the screen-printed thick film of a porous powder-based structure, there are needs to optimize the photosensitive PZT sol infiltration process for obtaining the enhanced properties of PZT thick film. By optimizing the concentration of the photosensitive PZT sol, UV irradiation time, and solvent developing time, the hybrid films prepared with 0.35 M of PZT sol, 4 min of UV irradiation and 15 sec solvent developing time, showed a very dense with a large grain size at a low sintering temperature of $800^{\circ}C$. It also illustrated enhanced electrical properties (remnant polarization, $P_r$, and coercive field, $E_c$). The $P_r$ value was over four times higher than those of the screen-printed films. These films integrated on silicon wafer substrate could give a potential of applications in micro-sensors and -actuators.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.55-61
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• 2015

Stretchable electrode materials are focused to apply to flexible device such as e-skin and wearable computer. Used as a flexible electrode, increase in electrical resistance should be minimalized under physical strain as bend, stretch and twist. Carbon black is one of candidates, for it has many advantages of low cost, simple processing, and especially reduction in resistivity with stretching. However electrical conductivity of carbon black is relatively low to be used for electrodes. Instead graphene is one of the promising electronic materials which have great electrical conductivity and flexibility. So it is expected that graphene added carbon black may be proper to be used for stretchable electrode. In this study, under stretching electrical property of graphene added carbon black composite electrode was investigated. Mechanical stretching induced cracks in electrode which means breakage of conductive path. However stretching induced aligned graphene enhanced connectivity of carbon fillers and maintained conductive network. Above all, electronic structure of carbon electrode was changed to conduct electrons effectively under stretching by adding graphene. In conclusion, an addition of graphene gives potential of carbon black composite as a stretchable electrode.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.31-36
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• 2018

This research scrutinizes the reason of failure after pressure cooker test (PCT) for DRAM device. We use the physical inspecting tools, such as microscope, SEM and TEM, and finally find the discolor phenomenon, corrosion of Al and delamination of inter-metal dielectric (IMD) in the failed devices after PCT. Furthermore, we discover the abnormal $Al_XO_Y$ layer on Al through the careful additional measurements. To find the reason, we evaluate the effect of package ball size and pinhole in passivation layer. Unfortunately, those aren't related to the problems. We also estimate halide effect of Al. The halogens such like Cl are contained within EMC material. Those result in the slight improving of PCT characteristics but do not perfectly solve the problems. We make a hypothesis of Galvanic corrosion. We can find the residue of Ti at the edge of pad open area. We can see the improving the PCT characteristics by the time split of repair etch. The possible mechanism of the PCT failure can be deduced as such following sequence of reactions. The remained Ti reacts on the pad Al by Galvanic corrosion. The ionized Al is easily react with the $H_2O$ supplied under PCT environment, and finally transfers to the abnormal $Al_XO_Y$ layer.

• Applied Chemistry for Engineering
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• v.22 no.4
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• pp.416-422
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• 2011

In this study, the effect of cosurfactant on the phase equilibrium and dynamic behavior was studied in systems containing NP7 nonionic surfactant solutions and nonpolar hydrocarbon oils. All cosurfactants used during this study such as n-pentanol, n-octanol and n-decanol acted as a hydrophobic additive and thus promoted the transition from an oil in water (O/W) microemulsion (${\mu}E$) in equilibrium with an excess oil phase to a three-phase region containing excess water, excess oil, and a middle-phase microemulsion and further to a water in oil (W/O) ${\mu}E$ in equilibrium with the excess water phase. The transition temperature was found to decrease with both increases in the chain length and amount of addition of a cosurfactant. Dynamic behavior studies under O/W ${\mu}E$ conditions showed that an oil drop size decreased with time due to the solubilization into micelles. On the other hand, both the spontaneous emulsification of water into the oil phase and the expansion of oil drop were observed under W/O ${\mu}E$ conditions because of the diffusion of surfactant and water into the oil phase. Under conditions of a three-phase region including a middle-phase ${\mu}E$, both the rapid solubilization and emulsification of the oil into aqueous solutions were found mainly due to the existence of ultra-low interfacial tension. Dynamic interfacial tension measurements have been found to be in a good agreement with dynamic behavior results.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.