• Korean Journal of Metals and Materials
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• v.46 no.6
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• pp.390-401
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• 2008

The objective of this study is to evaluate various machining characteristics of AlN-hBN machinable ceramics in micro end-milling process for its further application. First, AlN based machinable ceramics with hBN contents in the range of 10 to 20vol% were prepared by hot-pressing. Material properties of the composites, such as relative density, Vickers hardness, flexural strength, Young's modulus and fracture toughness were measured and compared. Then, micro end-milling experiments were performed to fabricate micro channels using prepared system. During the process, cutting forces, vibrations and AE signals were measured and analyzed using applied sensor system. Machined micro channel shapes and surface roughness were measured using 3D non-contact type surface profiler. From the experimental results, it can be observed that the cutting forces, vibrations and AE signal amplitudes decreased with increasing hBN contents. Also, measured surface roughness and profiles were improved with increasing hBN contents. As a result of this study, optimum machining conditions can be determined to fabricate desired products with AlN-hBN machinable ceramics based on the experimental results of this research.

• Design & Manufacturing
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• v.17 no.2
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• pp.22-26
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• 2023

As Light-Emitting Diodes(LEDs) continue to advance in performance, their application in automotive lamps is increasing. Automotive LEDs utilize light guides not only for aesthetics but also to control light quantity and direction. Light guides employ patterns of a few hundred micrometers(㎛) to regulate the light, and the surface roughness(Ra) of these patterns can reach tens of nanometers(nm). Given that these light guides are produced through injection molding, mold processing technology with high surface quality micro-patterns is required. This study serves as a preliminary investigation into the development of high surface quality micro-pattern processing technology. It examines the surface roughness of the workpiece based on the cutting direction of the pattern and the cutting fluid type when cutting micro-patterns on STAVAX steel using cubic Boron Nitride(cBN) tools. The experiments involved machining a step-shaped micro-pattern with a height of 60 ㎛ and a pitch of 400 ㎛ in a 22×22 mm area under identical cutting conditions, with only the cutting direction and cutting fluid type being varied. The machining results of four cases were compared, encompassing two cases of cutting direction(parallel to the pattern, orthogonal to the pattern) and two cases of cutting fluid type (flood, mist). Consequently, the Ra value was found to be the highest(Ra 128.33 nm) when machining with the flood type in parallel to the pattern, while it was the lowest(Ra 95.22 nm) when machining with the mist type orthogonal to the pattern. These findings confirm that there is a difference of up to 25.8 % in the Ra value depending on the cutting direction and cutting fluid type.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.63-68
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• 2010

CNT and permalloy composite plating was investigated. CNTs were pretreated prior to electroplating to disassemble the tangled CNT lumps. The ball milling as a physical pretreatment and the acid treatment as a chemical pretreatment were used. 10M nitric acid and 10 M sulfuric acid were used for the chemical pretreatment. Sulfuric acid was more effective than nitric acid to disassemble CNT lumps. To disperse CNT in the solution, surfactants were used. SDS, Triton X-100 and PAA were used for this purpose. More CNTs were incorporated in permalloy coating when PAA was used as a surfactant. The surface morphologies were observed with FESEM after electroplating CNT and permalloy. The current densities were varied from 10 to $80\;mA/cm^2$ and the concentration of PAA was fixed at 2 g/L. The optimum current density without surface cracks was $20\;mA/cm^2$. The crystallinity of the deposit was analyzed with XRD and the surface hardness was analyzed with Vicker's hardness tester. The corrosion behavior was analyzed with polarization plot. The physical properties of permalloy were not improved with CNT composite plating.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.26.2-26.2
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• 2010

최근에는 차세대 조명용 후보광원인 고출력 백색 LED를 개발하기 위한 경쟁이 치열하며, 이를 위해 업체가 고심하고 있는 가장 큰 문제 중의 하나가 칩에서 발생하는 열을 어떻게 관리하는가 하는 방열의 문제이다. 따라서, LED의 가장 큰 특징인 장수명을 손해보지 않기 위해서는 칩에서 발생되고 있는 열을 외부에 확산시키기 위한 기술 개발이 필수적이다. 다양한 방열소재 중 W-Cu 복합재는 W의 낮은 열팽창계수와 Cu의 높은 열전도도로 인해 방열소재로써 유망한 소재로 주목받고 있으나, 우수한 열적 특성을 발현하기 위해서는 고치밀화를 갖는 W-Cu 복합재 제조가 우선적으로 필요하다. W-Cu 복합체는 일반적으로 액상소결법을 통해 균일한 미세조직을 얻을 수 있으나, 열팽창계수를 낮추기 위해 Cu 함량이 적어지게 되면 치밀화가 어려우며 이를 해결하기 위해 나노입자를 갖는 분말을 이용하고자 하는 연구가 많이 진행되고 있다. 본 연구에서는 W과 Cu 산화물을 이용하는 것이 구성성분끼리의 편석이 발생하지 않으며, 소결성도 우수하여 양산화에 가장 접근한 방법으로 알려져 있다. 그러나, 지금까지의 얻어진 W-Cu 복합체의 경우, 분말상태에서의 얻어진 나노입자가 승온시에 마이크로 크기로 과도한 입자성장이 일어나기 때문에 소결 후에도 나노크기를 유지하기 어려울 뿐만 아니라, 구성상끼리의 응집체가 형성된다. 본 연구에서는 액상소결후에 W 입자가 Cu 기지내에 균일하게 분산되는 동시에 나노크기의 입자를 가지는 고분산 W-Cu 소결체를 얻고자 하였다. 이를 위해 금속산화물 분말의 분쇄를 위해 효과적인 방법으로 알려진 습식상태에서의 고에너지 볼밀링을 통하여 혼합된 텅스텐과 구리 산화물 분말의 수소환원공정을 통해 얻어진 100nm 이하의 입자를 가지는 W-20wt%Cu 나노복합분말을 출발분말로 사용하였다. W-20wt%Cu 나노복합분말의 성형체를 $1050^{\circ}C-1250^{\circ}C$의 온도범위에서 소결거동을 조사하였다. 그 결과, $1100^{\circ}C$ 온도에서 이론밀도에 가까운 소결밀도를 나타내었으며, 이는 기존에 비해 $100^{\circ}C$ 정도 치밀화 온도를 낮추는 결과이다. 소결체의 미세구조 관찰결과, 소결 후 약 200nm의 텅스텐 입자가 Cu내에 균일하게 분산되어 있었다. 제조된 W-Cu 시편에 대해서는 LED 응용성을 조사하기 위해 열전도도와 열팽창계수 등을 평가하였다.