• Applied Chemistry for Engineering
• /
• v.28 no.6
• /
• pp.626-631
• /
• 2017

Transparent plastic substrates require an improvement in properties such as surface hardness and thermal stability for optical applications. In this study, UV-curable organic/inorganic hybrids were synthesized to improve those properties. In order to make the optimum dispersion of inorganic component into the organic matrix, an in situ synthetic method was applied based on sol-gel reaction. Dispersion of the inorganic component in the organic urethane acrylate matrix was improved by using a proper combination of sol-gel reaction and fast UV-curing resulting in the formation of the transparent coating layer. Various alkoxy silanes were employed to vary both the degree of curing and coating properties of UV-curable organic/inorganic hybrids. UV-cured organic/inorganic hybrid coatings showed an improved surface hardness and thermal resistance depending on the content of inorganic component.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.12
• /
• pp.261-267
• /
• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.41 no.12
• /
• pp.975-986
• /
• 2013

This paper dealt with the fabrication and performance evaluation of the electronics housing made of lightweight composite materials, aiming at the enhancement of satellite mass savings by replacing conventional aluminum alloy widely used for satellite avionics with lightweight composite material. For this purpose, a fabrication process was designed to overcome low machinability of CFRP and to minimize the post-treatment. The composite housing with grid-stiffened and monolithic frame was made using co-curing method. Its performance was also evaluated regarding endurance, stiffness, thermal conductivity, electrical grounding, EMI protection and radiation shielding. The composite housing can provide the considerable mass savings over the aluminum housing with same dimension.

• Composites Research
• /
• v.23 no.4
• /
• pp.21-27
• /
• 2010

In most engineering structures, fracture often takes place due to fatigue. Therefore, many studies about the effect of the various mode-mixities on fatigue characteristics have been performed. However, most of the former studies only address metal/metal interfaces or delamination of composite. In this study, the fatigue characteristics of composite/metal interfaces are investigated. The fatigue tests were performed using single leg bending(SLB)specimens that comprise composite and steel bonded to each other using co-cure bonding method. This paper focuses on fatigue characteristics depending on different mode ratios$(G_{II}/G_T$. The overall results obtained in this study show that the crack propagation rate increases with the mode II loading component.

• Polymer(Korea)
• /
• v.33 no.4
• /
• pp.290-296
• /
• 2009

The morphology and mechanical properties of epoxy/polyamide/MPD/2E4MZ-CN reactive blends with various amount of catalyst were investigated. The cure behaviors, mechanical strengths, and morphological changes of the epoxy blend systems were analyzed by using DSC, UTM, and SEM, respectively. The amount of catalyst ranged from 0 to 3 phr, and the cure reaction occurred at $170^{\circ}C$ for 30 min. The maximum peaks in heat flow during cure reactions appeared at slightly lower temperature with increasing catalyst content, indicating that the cure reactions start at lower temperature by adding catalyst and polyamide rarely hinders the cure reaction paths. The co-continuous morphology was found in epoxy/polyamide(20 phr) blends and by adding catalyst to the blends much clearer and uniform co-continuous phase was observed. The surface tension of the mechanical test specimen was increased due to the AP plasma surface treatment, and then adhesion strength was increased by over 20% by adding 2 phr of catalyst to the blends. When considering morphological tuning of the blends by means of catalyst incorporation, it is expected that the increased elongation and adhesion strength can be achieved in the structural adhesive systems.

• Composites Research
• /
• v.31 no.4
• /
• pp.139-144
• /
• 2018

Long Fiber-reinforced composites have advantages of excellent production efficiency and formability of complex shapes compared to conventional continuous fiber reinforced composite materials. However, if we need to make complicated composite shapes or to assemble parts made of different materials, a variety of joining methods are needed. In general, long fiber prepreg sheet (LFPS) contains mold release agent to facilitate demolding after thermoforming. Therefore, mechanical fastening is required in addition to the adhesive bonding to get proper joining strength. In this study, we proposed a stainless steel insert for co-cure bonding which cures LFPS and bonds the stainless steel insert through thermoforming process. The wing of the insert which is spread during the thermoforming process induces adhesion and mechanical wedging effect and serves as a hook to resist the pulling force. The burn-out method was used to confirm the unfolded state of the stainless steel insert wings inserted into the composite material. The static pull-out test was performed to quantitatively evaluate the joining strength. From these experimental results, the condition which guarantees the most appropriate joining strength was derived.

• Journal of the Korean Wood Science and Technology
• /
• v.27 no.1
• /
• pp.72-78
• /
• 1999

To accelerate the curing and to improve the bonding properties of urea-melamine-formaldehyde (UMF) resin adhesives for plywood, the effects of resin compositions and additives on gelation time and bonding strength were discussed. The gelation time of UMF resin prepared by simultaneous reaction with urea(U), melamine(M) and formaldehyde(F) at M/U molar ratio 0.2 was shortened as the molar ratio of formaldehyde to urea was increased. However, at F/U molar ratios higher than 2.5, the amounts of free fomaldehyde of resin could not satisfy with KS standard, Therefore, it was difficult to increase the amount of formaldehyde in resin composition for the purpose of fast gelation time. With increasing the molar ratio of melamine to urea(M/U) from 0.3 to 0.6 at constant F/U molar ratio 3.4, the gelation time of UMF resin was slightly decreased, while gradually increased at M/U molar ratio higher than 0.6. The gelation properties of UMF resin and bonding strength of UMF-bonded plywood could be enhanced by using ammonium chloride and p-toluene sulfonic acid as a curing-agent together with wheat flour and corngluten powder as a extender.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.16 no.6
• /
• pp.554-560
• /
• 2011

Single-frequency induction heating equipment caused by a hardening heat treatment process of the double investment in the issue and allow the heat treatment process in order to shorten the time from one process to work simultaneously on two kinds of processes that allow Simultaneous Dual Frequency(SDF) drive scheme technology are described. In this paper, we propose a dual way to drive a simultaneous dual-frequency drive scheme has been implemented. Through simulations and experiments, we can obtain the validity of the proposed inverter for dual-frequency control and power control.

• Journal of the Korean Wood Science and Technology
• /
• v.38 no.4
• /
• pp.333-340
• /
• 2010

The Korean Dendropanax lacquer, made from a natural resinous sap from Dendropanax orbifera Lev., was used as a golden and transparent varnish for the traditional artifacts (armor uits, helmets, arrowheads, etc.) to make them be brilliant golden color. The cured film of the acquer has excellent protective properties such as weatherability, water resistance, and nticorrosive. But, one of disadvantages is that takes a long time and much energy to fulfill curing the lacquer. The chemical constituents of the lacquer contained conjugated diene compounds s the photopolymerizable monomers. These monomers easily polymerized in sunlight to form olden-colored, hard-coating films in a short time. Photooxidation may be one of the most mportant reactions in the chemistry of the lacquer. Although the Korean Dendropanax Lacquer hould be dried to a thoroughly dry stage to achieve optimal film properties, curing with elevated emperatures may be required for the protracted curing time at atmospheric temperature. So we ntended to accelerate the curing rate of the lacquer by dual curing of thermal and radiation uring. The effect of thermal initiator on the thermal curing reaction was evaluated by monitoring he changes in double bond peak with FT-IR. Then the curing rate of the lacquer blended with hermal initiator and photoinitiator together was measured during dual curing using a RPT with V spot curing machine. Thermal initiator not only accelerated the curing rate but also improved he physical property. And the curing rate of the Korean Dendropanax lacquer was improved by ual curing method of thermal and UV curing. According to these results, the application area of he Korean Dendropanax lacquer could be expanded to surface coatings for electronic devices uch as mobile phones or electronics.

• Composites Research
• /
• v.13 no.4
• /
• pp.42-53
• /
• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.