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A Study on Fabrication of Monolithic Lightweight Composite Electronics Housing for Space Application

우주용 일체형 경량 복합재료 전자장비 하우징 제작에 관한 연구

  • Received : 2013.09.09
  • Accepted : 2013.11.19
  • Published : 2013.12.01

Abstract

This paper dealt with the fabrication and performance evaluation of the electronics housing made of lightweight composite materials, aiming at the enhancement of satellite mass savings by replacing conventional aluminum alloy widely used for satellite avionics with lightweight composite material. For this purpose, a fabrication process was designed to overcome low machinability of CFRP and to minimize the post-treatment. The composite housing with grid-stiffened and monolithic frame was made using co-curing method. Its performance was also evaluated regarding endurance, stiffness, thermal conductivity, electrical grounding, EMI protection and radiation shielding. The composite housing can provide the considerable mass savings over the aluminum housing with same dimension.

기존 위성 전자장비 하우징에 널리 사용되는 알루미늄 합금 소재를 경량 복합재료로 대체함으로써 위성 경량화를 크게 개선하고자, 경량 복합재료로 구성된 전자장비 하우징을 제작하고 성능 검증에 대하여 다루었다. 이를 위해 복합재료의 낮은 가공성을 극복하기 위하여 후처리를 최소화할 수 있는 복합재료 하우징 제작공정을 설계하고, 격자 구조로 강화된 일체형 하우징 본체를 동시경화 방법에 의해 제작하였다. 또한 제작된 전자장비 하우징의 내구성, 강성, 열전도도, 전기전도도, EMI차폐 및 방사차폐에 대한 성능 평가 결과를 분석하였다. 아울러 본 연구에서 제작한 복합재료 하우징은, 동일한 형상의 알루미늄 하우징 대비 상당한 질량절감을 가능하게 함을 제시하였다.

Keywords

References

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