• 대한방사선기술학회지:방사선기술과학
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• 제42권4호
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• pp.271-277
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• 2019

CareDose 4D which is the Siemens's Automatic Exposure Control (AEC) can adjust the level of radiation dose distribution which is based on organ characteristic unlike other manufacturer's AEC. Currently, a wide scan range containing different organs is sometimes examined at once (defined as one scan). The purpose of this study was to figure out which organ characteristic option is suitable when one scan method is utilized. Two types of anthropomorphic phantoms were scanned in the same range which were from frontal bone to carina level according to three different organ characteristics such as Thorax, Abdomen, and Neck. All scans and image reconstruction parameters were equally applied and radiation dose were compared. Radiation dose with Thorax organ characteristic was lower than that with Neck. Also, that with Abdomen oran characteristic was lower than Thorax. There were significant differences in radiation dose according to different organ characteristics at the same parameters (P<0.05). Usage of Neck organ characteristic had a result of the highest radiation dose to all phantom. On the other hand, utilization of Abdomen organ characteristic showed the lowest radiation dose. As a result, it is desirable to set appropriate organ characteristic according to examined body part when you checkup patients. Also, when you implement one scan method, selection of Abdomen-based organ characteristic has reduced more radiation dose compared with two different organ characteristic.

• 전자공학회논문지D
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• 제36D권12호
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• pp.37-42
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• 1999

본 논문에서는 차세대 집적회로의 핵심공정으로 부각되고 있는 CMP를 이용한 Cu Damascene 공정을 연구하였다. E-beam lithography, $SiO_2$ CVD 및 RIE, Ti/Cu CVD등의 제반 단위 공정을 연구하였으며, 연구된 단위공정으로 2창의 Cu금속 배선을 제작하였다. CMP 단위공정 연구결과, hend 압력 4 PSI, table 및 head 속도 25rpm, 진동폭 10mm, 슬러리 공급량 40ml/min에서 연마율 4,635 ${\AA}$/min, Cu:$SiO_2$의 선택율 150:1, 평탄도 4.0%를 얻었다. E-beam 및 $SiO_2$ vialine 공정연구결과, 100 ${\mu}C/cm^2$ 도즈와 6분 30초의 현상 및 1분 10초의 에칭시간으로 약 0.18 ${\mu}m\;SiO_2$ via-line을 형성하였다. 연구된 단위공정으로 sub-0.2 ${\mu}$의 Cu 금속라인을 제작하였으며, Cu void 및 Cu의 peeling으로 인한 다층공정시의 문제점과 재현성 향상 방법에 대해 논의하였다.