• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5721-5727
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• 2015

Paint must be resistant to the wear and tear of the atmosphere and should maintain its color and finish for a long time. The solvents of paints were organic solvent and water, common artificial source of VOCs(Volatile organic Solvent) include organic solvent. Using of organic solvent paint was decreased in the interior parts of automotive, exterior parts were still used organic solvent paint. Adhesive strength of water-paint was poor to compare with organic solvent paint and peeled off from the base materials, it was big quality problem. In this study, adhesive characteristics of water-paint and silane mixture was investigated. To improve adhesive strength of water-paint, it was necessary to mixing of adhesive material. Adhesive strength was measured using UTM(Universal Test Instrument) by ASTM D1002 and Peeling off condition was by ASTM D3359. Optimal mixing condition of water-paint and silane adhesive were $25^{\circ}C$, 500rpm, 20min., concentration of silane adhesive was 5 wt%.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.5
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• pp.449-455
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• 2015

Built-In-Test(hereafter: BIT) is necessary functionality for aircraft flight safety and it requires a high failure detection capacity of more than 95 % in the case of avionics equipment. The BIT coverage analysis is needed to make sure that BIT meets its fault diagnosis capability. FMECA is used a lot of for the BIT coverage analysis. However, in this paper, the BIT coverage analysis based on electronic components is introduced to minimize the analytical error. Further, by applying the failure mode of the electronic components and excluding electronic components that do not affect flight safety, the BIT coverage analysis can be more accurate. Finally, BIT demo was performed and it was confirmed that the performance of the actual BIT matches the analysis of BIT performance.

• Transactions of Materials Processing
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• v.14 no.5 s.77
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• pp.452-459
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• 2005

Gas assisted injection molding (GAIM) is an innovative low-pressure injection molding technique that can provide numerous benefits such as reduced part warpage, excellent surface quality without sink marks, low injection pressure and greater design flexibility. However, adoptions of GAIM may cause unexpected defects since it requires many subtle design factors such as resin shot size, delay time and gas injection pressure, which wouldn't be considered in conventional injection molding process. Therefore, experiences applying GAIM should be collected and examined in order to establish design rules of the new technique. The purpose of this paper is to summarize developing cases of three automotive interior parts such as instrument panel, map pocket folding and center facia side panel so that possibilities and limitations of GAIM were examined. As a result, it is necessary to consider characteristics of GAIM at the initial stage of part design in order to obtain various advantages of the GAIM process without occurring severe defects, which would increase time and cost required to the part development.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2012.03a
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• pp.103-103
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• 2012

크루즈 페리 선박의 인테리어 섬유 내장부품은 고도의 난연성과 내구성, 그리고 높은 수준의 감성과 심미적 기능을 만족하는 고기능성 소재로 구성된 섬유 복합체이다. 이는 화재, 전복 등 돌발 사고에 대하여 탑승자를 보호하고, 쾌적한 실내 분위기를 제공함으로서 안전운행을 유도하며, 높은 수준의 감성과 심미적 기능을 부여함으로서 품위와 가치를 증가시키는 기능이 있다. 난연기능이 부가된 난연사의 경우 복합가공 즉, 방오, 항균, 소취 기능을 추가 부여하게 되면 난연 기능이 급격히 저하되는 결정적인 단점이 있다. 이로 인해 가혹한 난연 성능이 요구되는 선박용 인테리어 섬유제품의 경우 그 규격을 만족하기란 쉽지 않기 때문에 원사제조에서부터 염색공정, 가공공정에 걸쳐 각 단위 공정별로 복합적으로 난연, 방오, 항균소취 기능들의 추가 보완이 필요한 실정이다. 또한 최근 사용자 입장에서는 용도에 따라 여러 가지 기능이 복합된 원단을 요구하는 사례가 많아지고 있는 실정이며, 많은 후가공 공정시 난연가공과 더불어 복합적으로 추가 가공시 난연성 저하 등의 문제가 있다. 본 연구에서는 선박용 인테리어 섬유제품의 Spec.을 만족시키기 위해 난연 직물의 염색 후가공에 적용되는 염조제 성능을 조사하고 고견뢰 및 균염을 만족하는 난연 내광 등의 복합기능성을 확보하기 위한 기초기술을 검토하였다.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.340-343
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• 2011

Explosive bolts are reliable and efficient mechanical fastening devices having the special feature of a built-in release. The disadvantage of explosive bolt lies in that it is based on the high explosive effect of a pyrotechnic charge. The aim of the present work is to propose a pyrotechnically releasable mechanical linking device for two mechanical elements that does not suffer from such drawbacks. The pyro-lock using the pressure cartridge has the release characteristic without fragmentation and minimum pyro-shock. The present work is focused on the design, the interpretation of structure, the separation mechanism, separation force, and the results of various tests.

• Composites Research
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• v.30 no.6
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• pp.399-405
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• 2017

We manufactured the long fiber-reinforced thermoplastic prototype of under cover using in-line compounding technology, and investigated the formability, mechanical properties and durability of the prototype of under cover. We manufactured the injection mold for the prototype through injection molding analysis and consideration of weight reduction. We investigated the formability of the prototype by evaluating the residual length and dispersion of fiber, and also tested the mechanical properties such as flexural strength, stiffness and impact strength. We investigated the durability of the prototype by the Key-Life Test(KLT) method which is generally used for the automotive interior parts.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.305-305
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• 2008

LTCC는 고주파영역에서 손실이 낮고 적층구조의 모듈제작이 가능하여 고주파용 모듈제작에 응용이 가능하다. 최근 수동소자가 내장된 ASM이나 FEM 등의 모듈은 그 집적도가 높고 기판의 두께가 감소함에 따라 소재의 고강도 특성이 요구되고 있다. 이와 같은 경향에 따라 Anorthite계 결정화 유리로 알려진 300MPa 이상의 고강도를 나타내는 CaO-Al2O3-SiO2계 소재가 선행 연구 과정을 통하여 개발되었다. 본 실험에서는 기 개발된 조성의 고강도 소재를 이용하여 RF부품에 적용하기 위한 테스트 쿠폰을 제작하였다. 고강도 소재를 이용하여 green sheet를 제조하고 수동소자인 R, L, C 등을 기판 내에 내장화 하기위해 LTCC 공정을 이용하여 각 층에 다양한 선폭 및 크기의 패턴을 인쇄한 뒤 적층하여 $900^{\circ}C$에서 소결하였다. 이 과정에서 공정에 대한 적용성이 각 공정별로 평가되었으며 완성된 테스트 쿠폰을 이용하여 소재의 전기적인 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.644-647
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• 2004

RF 시스템에서 발룬(Balun)은 회로기판과 집적회로 사이의 임피던스 매칭에 사용되는 소자로서, 전력의 균등한 분배와 함께 180도 위상차를 만드는 역할을 하는 주요 회로부품이다. 시스템의 요구사양에 따라 balanced 임피던스가 $50\Omega$인 소자뿐만 아니라, 25 또는 100, $200\Omega$인 소자들도 많이 사용되는데, 대부분의 계측기가 $50\Omega$을 I/O 임피던스로 설정하고 있어, balanced 임피던스가 $50\Omega$이 아닌 경우 특성을 측정하기 위해서는 별도의 지그설계가 필요하다. 본 연구에서는 중심주파수가 900MHz이고, balanced 임피던스가 $100\Omega$이며, LTCC 모듈 내에 내장되는 임베디드 발룬의 최적 평가를 위한 PCB 측정지그의 구조에 대하여 설계 및 시뮬레이션을 실시하고, 이에 따라 제작된 지그를 시뮬레이션 결과와 비교하였다. 지그를 구성하는 마이크로스트림의 임피던스를 조절함으로써 유효한 측정주파수범위를 넓힐 수 있었으며, 제작된 지그는 설계치에 거의 근접한 전송특성을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.