• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• Composites Research
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• v.25 no.4
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• pp.93-97
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• 2012

Carbon nano fibers (CNFs) reinforced magnesium alloy (AZ91) matrix composites have been fabricated by liquid pressing process. In order to improve the dispersibility of CNFs and the wettability with magnesium alloy melt, CNFs were mixed with submicron sized SiC particles ($SiC_p$). Also, the mixture of CNFs and $SiC_p$ were coated with Ni by electroless plating. In liquid pressing process, AZ91 melts have been pressed hydrostatically and infiltrated into three reinforcement preforms of only CNFs, the mixture of CNFs and $SiC_p$ (CNF+$SiC_p$), and Ni coated CNFs and $SiC_p$ ((CNF+$SiC_p$)/Ni). Some CNFs agglomerates were observed in only CNFs reinforced composite. In cases of the composites reinforce with CNF+$SiC_p$ and (CNF+$SiC_p$)/Ni, CNFs were dispersed homogeneously in the matrix, which resulted in the improvement of mechanical properties. The compressive strengths of CNF+$SiC_p$ and (CNF+$SiC_p$)/Ni reinforced composites were 38% and 28% higher than that of only CNFs composite.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.3
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• pp.516-526
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• 2004

Polymerization shrinkage of photoinitiation type composite resin cause several clinical problems. The purpose of this study was to evaluate the shrinkage strain stress, linear polymerization shrinkage, compressive strength and microhardness of recently developed composite resins. The composite resins were divided into four groups according to the contents of matrix and filler type. Group I : $Denfil^{TM}$(Vericom, Korea) with conventional matrix, Group II : $Charmfil^{(R)}$(Dentkist, Korea) with microfiller and nanofller mixture, Group III : $Filtek^{TM}$ Z250(3M-ESPE, USA) TEGDMA replaced by UDMA and Bis-EMA(6) in the matrix, and Group IV : $Filtek^{TM}$ Supreme(3M-ESPE, USA) using pure nanofiller. Preparation of acrylic molds were followed by filling and curing with light gun. Strain gauges were attached to each sample and the leads were connected to a strainmeter. With strainmeter shrinkage strain stress and linear polymerization shrinkage was measured for 10 minutes. The data detected at 1 minute and 10 minutes were analysed statistically with ONE-way ANOVA test. To evaluate the mechanical properties of tested materials, compressive hardness test and microhardness test were also rendered. The results can be summarized as follows : 1. Filling materials in acrylic molds showed initial temporary expansion in the early phase of polymerization. This was followed by contraction with the rapid increase in strain stress during the first 1 minute and gradually decreased during post-gel shrinkage phase. After 1 minute, there's no statistical differences of strain stress between groups. The highest strain stress was found in group IV and followed by group III, I, II at 10 minutes-measurement(p>.05). In regression analysis of strain stress, group III showed minimal inclination and followed by group II, I, IV during 1 minute. 2. In linear polymerization shrinkage test, the composite resins in every group showed initial increase of shrinkage velocity during the first 1 minute, followed by gradually decrease of shrinkage velocity. After 1 minute, group IV and group III showed statistical difference(p<.05). After 10 minutes, there were statistical differences between group IV and group I, III(p<.05) and between group II and group III(p<.05). In regression analysis of linear polymerization shrinkage, group II showed minimal inclination and followed by group IV, III, I during 1 minute. 3. In compressive strength test, group III showed the highest strength and followed by group II, IV, I. There were statistical differences between group III and group IV, I(p<.05). 4. In microhardness test, upper surfaces showed higher value than lower surfaces in every group(p<.05).

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.515-519
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• 2014

The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.

• Korean Journal of Materials Research
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• v.18 no.12
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• pp.640-644
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• 2008

ZnO/ZnS core/shell nanocrystals (${\sim}5-7\;nm$ in diameter) with a size close to the quantum confinement regime were successfully synthesized using polyol and thermolysis. X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM) analyses reveal that they exist in a highly crystalline wurtzite structure. The ZnO/ZnS nanocrystals show significantly enhanced UV-light emission (${\sim}384\;nm$) due to effective surface passivation of the ZnO core, whereas the emission of green light (${\sim}550\;nm$) was almost negligible. They also showed slight photoluminescence (PL) red-shift, which is possibly due to further growth of the ZnO core and/or the extension of the electron wave function to the shell. The ZnO/ZnS core/shell nanocrystals demonstrate strong potential for use as low-cost UV-light emitting devices.

• Korean Journal of Materials Research
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• v.12 no.11
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• pp.856-859
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• 2002

To investigate effects of heat treatments including grain size control in substrate aluminum on nanopore arrays in anodic alumina template, aluminum was heat treated at $500^{\circ}C$ for 1h. The heat treated aluminum was anodized by two successive anodization processes in oxalic solution and the nanopore arrays in anodic alumina layer were studied using TEM and FE-SEM. The highly ordered porous alumina templates with 110 nm interpore distance and 40 nm pore diameter have been observed and the pore array of the anodic alumina has a uniform and closely-packed honeycomb structure. In the case of alumina template obtained from heat treated aluminum substrate, the well- ordered nanopore region in anodic alumina increased and became more homogeneous compared with that from non-heattreated one.

• Korean Journal of Materials Research
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• v.14 no.8
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• pp.542-546
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• 2004

We report a new fabrication process for high performance triode type CNT field emitters and their superior electrical properties. The CNT-based triode-type field emitter structure was fabricated by the conventional semiconductor processes. The keys of the fabrication process are spin-on-glass coating and trim-and-leveling of the carbon nanotubes grown in trench structures by employing a chemical mechanical polishing process. They lead to strong adhesion and a uniform distance from the carbon nanotube tips to the electrode. The measured emission property of the arrays showed a remarkably uniform and high current density. The gate leakage current could be remarkably reduced by coating of thin $SiO_{2}$ insulating layer over the gate metal. The field enhancement factor(${\beta}$) and emission area(${\alpha}$) were calculated from the F-N plot. This process can be applicable to fabrication of high power CNT vacuum transistors with good electrical performance.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.45-49
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• 2020

In this paper, we prepared miniature fuse fabricated with carbon nanotube (CNT) fiber for the use of low rated current under 1 A and high speed operation under 4ms. CNT fuses were fabricated in the form of universal modular fuse (UMF) with different diameter of CNT fibers defined by multiplying the CNT threads. Electrical properties of the CNT fuses were measured such as resistance, rated current, and operation time with current. Resistance of the CNT fuse decreased and rated current increased with the diameter of the CNT fuses, respectively. Consequently, the operation time with current increased with the diameter of the CNT fuses. The CNT fuses fabricated in this work had broad range of low rated current from 0.05 to 1.25 A by multiplying the CNT threads. Operation time was measured about 3.6ms which was applicable to the UMF.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.16-20
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• 2020

In this study, a patterning method using self-aligned nanostructures was introduced to fabricate GaN-based fin-gate HEMTs with normally-off operation, as opposed to high-cost, low-productivity e-beam lithography. The honeycomb-shaped fin-gate channel width is approximately 40~50 nm, which is manufactured with a fine width using a proposed method to obtain sufficient fringing field effect. As a result, the threshold voltage of the fabricated device is 0.6 V, and the maximum normalized drain current and transconductance of Gm are 136.4 mA/mm and 99.4 mS/mm, respectively. The fabricated devices exhibit a smaller sub-threshold swing and higher Gm peak compared to conventional planar devices, due to the fin structure of the honeycomb channel.