• Resources Recycling
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• v.18 no.4
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• pp.14-23
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• 2009

In terms of resources recycling and resolving waste disposal problems, it is very important to recover precious metals like Au, Ag and Pd and valuable metals like Cu, Sn and Ni from the scraps of waste electrical and electronic equipment(WEEE) that consists of detective electrical and electronic parts discarded during manufacturing electrical and electronic equipments and waste electrical and electronic parts generated during disassembling them. In general, the scraps of WEEE are composed of various metals and alloys as well as refractory oxides and plastic components. Precious and valuable metals from the scraps of WEEE can be recovered by gas-phase-volatilization, hydrometallurgical, or pyrometallurgical processes. However, the gas-phase-volatilization and hydrometallurgical processes have been suggested but not yet commercialized. At the present time, most of the commercial plants for recovering precious and valuable metals from the scraps of WEEE adopt pyrometallurgical processes. Therefore, in this paper, the technical and environmental aspects on the important pyrometallurgical processes through literature survey are reviewed, and the scale-up result of a new pyrometallurgical process for recovering the precious and valuable metals contained in the scraps of WEEE using waste copper slag is presented.

• Analytical Science and Technology
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• v.7 no.3
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• pp.371-378
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• 1994

The detection range of this galvanic oxygen sensor for oxygen concentration was 0.0% to 20.0%. By using gold or silver as cathode, reproducible response time and sensitivity to change of oxygen concentration were observed. The anode was Pb-Sn-Ca alloy. Oxygen selective permeable membrane was hydrophobic and porous Teflon film. The effect of the membranes varying in thickness have been studied on the temperature($10{\sim}50^{\circ}C$) and relative humidity(R. H 0~99%). Lead acetate buffer solution as the electrolyte has shown a high output voltage and longer life.

• Resources Recycling
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• v.11 no.1
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• pp.9-18
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• 2002

Printed wiring boards(PWBs) of the obsolete computers are composed of various organic and inorganic compounds as well as metals and alloys. As convinced that the valuable metals obtained from the PWBs are effectively utilized as secondary resources when recovered by economical methods, in this study, an investigation for characterizing the physical separation techniques is conducted. For the recovery of them, the sockets and chips dismantled from PWBs by scraping and residual resin boards are subjected to the appropriate separation processes according to the physical properties of each part. In the case of crushed socket scraps size ranged from -2.36 mm to +1.18 mm, approximately 97 wt% of the product obtained by magnetic separation consists of metallic compounds. In the case of chip scraps, 97% of Fe-Ni alloy and 95% of Cu metal are recovered by the combined process of air classification and dry magnetic separation in the size range from -2.36 mm to +0.15 mm. Ball milling is adopted in order to improve the removal efficiency of the thin-printed metallic materials on the residual resin boards and approximately 77% of Cu metal is recovered by zigzag separation after ball milling.

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.4
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• pp.417-432
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• 2001

The pcf metal primers on the bond strength and durability of 4-META/MMA-TBB resins adhered to an Au-Ag-Pd alloy. For this study, the specimens were divided into 8 groups as follows: Thermocyle 0 : (1) control group : sandblast, (2) Group I : sandblast + Cesead Opaque Primer; (3) Group II : sandblast + Metal Primer; (4) Group III : sandblast + V-Primer; Thermocyle 10,000 (5) control sandblast: (6) Group I : sandblast + Cesead Opaque Primer: (7) Group II : sandblast + Metal Primer; (8) Group III sandblast + V-Primer. The shear bond strength was determined using an Instron were observed with the use of scanning electron microscope. Finally, the strengths of bonded joints were evaluated with regard to their adherence energy using a wedge test. The results obtained were as follows ; (1) The shear bond strength of 4-META/MMA-TBB resin to the Au-Ag-Pd alloy was significantly improved in all the groups treated with the primers (p<0.05). (2) Regardless of the adhesive primers used, a significant difference was observed in the bond strength of the thermocycle 0 groups and 10,000 groups (p<0.05). (3) Both before and after thermocycling, the strongest bond strength between the resin an the alloy was obtained after treatment with a metal primer containing MEPS (p<0.05). (4) In the wedge test, the adherence energies of the control group and Group III decreased more rapidly than those of Group I and II during the 2nd day of storage in water.