A Study on the Physical Separation Characteristics of Valuable Metals from the Waste Printed Wiring Boards

물리적 처리에 의한 폐 컴퓨터 기판으로부터 유가금속의 분리선별 특성 연구

  • 현종영 (한국지질자원연구원 자원활용연구부) ;
  • 채용배 (한국지질자원연구원 자원활용연구부) ;
  • 정수복 (한국지질자원연구원 자원활용연구부)
  • Published : 2002.02.01

Abstract

Printed wiring boards(PWBs) of the obsolete computers are composed of various organic and inorganic compounds as well as metals and alloys. As convinced that the valuable metals obtained from the PWBs are effectively utilized as secondary resources when recovered by economical methods, in this study, an investigation for characterizing the physical separation techniques is conducted. For the recovery of them, the sockets and chips dismantled from PWBs by scraping and residual resin boards are subjected to the appropriate separation processes according to the physical properties of each part. In the case of crushed socket scraps size ranged from -2.36 mm to +1.18 mm, approximately 97 wt% of the product obtained by magnetic separation consists of metallic compounds. In the case of chip scraps, 97% of Fe-Ni alloy and 95% of Cu metal are recovered by the combined process of air classification and dry magnetic separation in the size range from -2.36 mm to +0.15 mm. Ball milling is adopted in order to improve the removal efficiency of the thin-printed metallic materials on the residual resin boards and approximately 77% of Cu metal is recovered by zigzag separation after ball milling.

폐 컴퓨터 기판(Printed Wiring Boards, PWBs)은 다양한 종류의 금속 및 합금류, 각종의 유기 및 무기화합물 등으로 구성되어 있다. 따라서 폐 기판에 포함된 유가물을 경제적인 방법으로 분리 회수하면 2차 자원으로써 활용가치가 매우 클 것으로 판단되어, 물리적인 선별기술에 의하여 유가금속을 분리 회수하는 데에 따른 특성 연구를 행하였다. 본 연구에는 폐 컴퓨터 기판에 탑재된 소켓류와 칩류를 탈리한 다음 소켓류, 칩류 및 보드류로 분리하여 각각의 산출물의 특성에 따른 적절한 물리적 분리선별 기술을 적용하였다. 소켓류를 파쇄하여 입자크기를 -2.36 mm/+1.18 mm 범위로 조절한 다음 건식 자력선별을 실시하였을 때, 자성산물의 약 97 wt%가 금속류였다. 칩류의 경우에는 -2.36 mm1+0.15 nun의 크기로 분쇄하고 공기분급 및 건 식 자력선별을 행하여 Fe-Ni 97%, Cu 95%를 각각 회수할 수 있었다. 보드류의 경우에는 금속류가 얇게 프린트 된 상태이기 때문에 가능한 단체분리 효과를 향상시키기 위하여 ball mill로 분쇄하였으며, 공기 분급기에 의한 정밀 분급을 행하여 Cu 77%를 회수할 수 있었다.

Keywords

References

  1. Elaine Y. L. Sun, : 'The Recovery of Metals from Electronic Scrap', JOM, 43(4), pp 53-61 (1991)
  2. J. E. Hoffmann : 'Recovery Precious Metals from Electronic Scrap', JOM, 44(7), pp 43-48 (1992)
  3. Schikora Amo : 'Mechanical removal of electronic components from printed circuit boards', DE patent, DE4205405 (1992)
  4. Hong C. Zhang and Tsai-Chi Kuo : 'Disassembly Model for Recycling-Personal Computer', Technical Papers of the North American Manufacturing of SME 1996, 1996. 5.21, pp139-144
  5. Peter Kopacek, Gernot Kronreif : 'Semi-Automated Robotized Disassembling of Personal Computers' Proceedings of the 1996 IEEE Conference on Emerging Technologies and Factory Automation-Volume 2, v. 2, 1996. 11. 18, pp567-572
  6. Clegg, A. J. and Williams, D. J. : 'The Strategic Implications of Recycling and Design for Disassembly in the Electronics Industry', Proceedings of the IEEE International Symposium on Electronics and the Environment, 1994, pp. 6-12
  7. Feldmann, K. and Scheller, H. : 'The Printed Circuit Board A Challenge for Automated Disassembly and for the Design of Recyclable Interconnect Devices', CONCEPT Conference on Clean Electronic Products and Technology, 1995, IEE Conference Publication n. 415, pp.186-190
  8. J. G. Day : US. Patent 4,427,442 (1984)
  9. J. Kaltenbaeck etc.. Metall (Berlin), v. 39(11). (1985)
  10. R. Verbeeck, F. Lauwersand and G. Vermeylen : 'The Recycling and Recovery of Precious Metals integrated in Mho's Smelter', Platium Group Metals Seminar, 1985, pp3-12, Washington D.C. (1986)
  11. T. Storbrock Verein Deutscher Ingenieure Nachhchten, v. 38(9), (1984)
  12. A. Bernardes, I. Bohlinger and D. Rodriguez et al., 'Recovery of Printed Circuit Boards by Melting with Oxidising/Reducing top Blowing Process', EPD Congress by B. Mishra, The Mineral, Metals & Material Society, pp 363-375, (1997)
  13. 富岡桓着 : 'ごみが資源なら日本は資源大國,分別とエナルギ回收に新技術', 1997. 8, pp 51-52, 日經メカニカル
  14. 西場貞夫: JP patent, 特開平 10-296225 (1998)
  15. 金子朋子외: JP patent, 特開平9-103761 (1997)
  16. 椎野微외 : JP patent, 特開평 10-141819 (1998)