Vacuum packaging of MEMS (Microelectromechanical System) devices using LTCC (Low Temperature Cofired Ceramic) technology (LTCC 기술을 이용한 MEMS 소자 진공 패키징)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2002.11a
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- pp.195-198
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- 2002