The optimization of processing condition of dissimilar material bonding using the 60 kHz ultrasonic transducer (60 kHz 초음파 공구 혼을 이용한 이종재료접합의 공정조건 최적화)
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- Journal of the Korea Academia-Industrial cooperation Society
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- v.14 no.3
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- pp.991-996
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- 2013