• Title/Summary/Keyword: 계면전단강도실험

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Experimental Study on the Reological Properties of Carbon Nano Materials as Cement Composites (탄소계 나노소재를 적용한 시멘트 페이스트 복합체의 유변학적 특성에 대한 연구)

  • Kim, Won-Woo;Moon, Jae-Heum;Yang, Keun-Hyeok
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.10 no.3
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    • pp.227-234
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    • 2022
  • In this study, the rheological properties of cement paste composites applied with carbon-based nano-materials were experimental analyzed. Flow table and rheological properties, compressive strength were measured in the cement paste using graphene oxide asqueous solution and carbon nanotube aqueous solution. When carbon nano-materials was mixed in an aqueous solution, flow decreased and plastic viscosity and shear stress were increased. In particular, graphene oxide rapidly increased the plastic viscosity and shear stress. In the case of carbon nanotube aqueous solution, when less than 0.2 % was mixed, the increase rate was low compared to graphene oxide. This is because the specific surface area of graphene, which is in the form of a plate, is large. The compressive strength showed a small amount in strength increase when graphene mix, and CNT had a strength about 112 % of OPC. Carbon-based nanomaterials, is considered that CNT are suitable more to be used construction materials. However, extra studies on the surfactant to be used for mixing proportion and dispersion will be needed.

Comparison of shear bond strength between various temporary prostheses resin blocks fabricated by subtractive and additive manufacturing methods bonded to self-curing reline resin (절삭 및 적층 가공법으로 제작한 임시 보철물 레진 블록과 재이 장용 자가중합 레진의 전단결합강도 비교)

  • Hyo-Min Ryu;Jin-Han Lee
    • The Journal of Korean Academy of Prosthodontics
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    • v.61 no.3
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    • pp.189-197
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    • 2023
  • Purpose. This study aimed to compare and evaluate the shear bond strength between various temporary prostheses resin blocks fabricated by subtractive and additive manufacturing methods bonded to self-curing reline resin. Materials and methods. The experimental groups were divided into 4 groups according to the manufacturing methods of the resin block specimens and each specimen was fabricated by subtractive manufacturing (SM), additive manufacturing stereolithography apparatus manufacturing (AMS), additive manufacturing digital light processing manufacturing (AMD) and conventional self-curing (CON). To bond the resin block specimens and self-curing resin, the reline resin was injected and polymerized into the same location of each resin block using a silicone mold. The shear bond strength was measured using a universal testing machine, and the surface of the adhesive interface was examined by scanning electron microscopy. To compare between groups, one-way ANOVA was done followed by Tukey post hoc test (α = 0.05). Results. The shear bond strength showed higher values in the order of CON, SM, AMS, and AMD group. There were significant differences between CON and AMS groups, as well as between CON and AMD groups. but there were no significant differences between CON and SM groups (P > .05). There were significant differences between SM and AMD groups, but there were no significant differences between SM and AMS groups. The AMS group was significantly different from the AMD group (P < .001). The most frequent failure mode was mixed failures in CON and AMS groups, and adhesive failures in SM and AMD groups. Conclusion. The shear bond strength of SM group showed lower but not significant bond strength compared to the CON group. The additive manufacturing method groups (AMS and AMD) showed significantly lower bond strength than the CON group, with the AMD group the lowest. There was also a significant difference between the AMD and SM group.

Evaluation of the Change in Adhesion Strength of GFRP and CFRP with Carbon Nanotube Contents in Epoxy Adhesive with Moisture Change during Curing (에폭시 접착제의 탄소나노튜브 함량과 경화시 습도 변화에 따른 GFRP 및 CFRP의 접착강도 변화 평가)

  • Park, Hee-Woong;Kim, Jong-Hyun;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.23 no.1
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    • pp.1-7
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    • 2022
  • As the wind blades become larger, they tend to be made by mixing glass fiber and carbon fiber, and it is important to increase the properties of the adhesive which adheres the two materials. The physical properties of the adhesive vary depending on the content of the additive and curing conditions. In this study, the change in adhesion strength with the difference between the CNT (Carbon Nanotube) content of the epoxy adhesive and the humidity during curing was evaluated. GFRP and CFRP specimens were prepared and adhered using an epoxy adhesive, and to examine changes in characteristics with carbon nanotube contents and with the humidity during curing of the epoxy adhesive, adhesion strength was evaluated by dividing the difference between carbon nanotube content and humidity. To find out the change with the CNT contents, the intelaminar shear strength (ILSS) test was performed by dividing the contents of the CNT into 0, 0.1, 0.3, 0.5, and 1 wt%, and to confirm the change with the humidity conditions, the adhesive was cured by dividing the humidity by 20, 50, and 80%. From the result of the experiment, the adhesive force decreased when the content was excessively large, although the adhesive property was enhanced by adding CNT to the epoxy adhesive. In addition, it was confirmed that the adhesion characteristics were not changed as the humidity increased.

THE EXPRESSION OF OSTEONECTIN AND OSTEOCALCIN IN THE EXPERIMENTAL TOOTH MOVEMENT IN RAT (백서의 실험적 치아이동시 osteonectin 및 osteocalcin의 발현)

  • Bae, Sung-Real;Kim, Sang-Cheol
    • The korean journal of orthodontics
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    • v.28 no.5 s.70
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    • pp.699-716
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    • 1998
  • This study was designed to evaluate the expression of non-collagenous protein in periodontal tissue during the experimental movement of rat incisors, by LSAB(labelled streptavidine biotin) immunohistochemical staining for osteonectin and osteocalcin. Twenty seven Sprague-Dawley rats were divided into a control group(3 rats) and 6 experimental groups(24 rats) where 75g of force was applied from helical springs across the maxillary incisors. Rats of experimental groups were sacrificed at 12 hours, 1, 4, 7, 14 and 28 days after force application, respectively. And the tissues of a control group and experimental groups were studied immunohistochemically and histologically. The results were as follows : 1. Until 28 days after force application, periodontal fibers had been strectched on tension side and compressed in pressure side of all the experimental groups, and the arrangement of periodontal fibers had not been recovered yet. 2. The expression of osteonectin in control group was rare in dentin, cementum and osteocyte, and was mild in odontoblasts and matrix of alveolar bone. 3. The expression of osteocalcin in control group was negative in gingiva, osteoblasts, osteocyte and cementum, and was rare in predentin, capillaries in pulp and periodontal ligament and the matrix of alveolar bone. 4. There was no difference in the expression of osteocalcin or osteonectin in dentin, cementum, pulp, odontoblasts, between of control and of experimental groups. 5. The expression of osteonectin in intermaxillary suture got the peak in 7-day and was declined after 14-day. The expression of osteocalcin remained in a same degree since it became mild in 14-day. 6. The expression of osteonectin in pressure side of periodontal ligament of experimental group was rare, which was similar to control group. But in tension side, it was increased until 14-day aftrer which it was declined. 7. The expression of osteocalcin in periodntal ligament was rare in 12-hour to 14-day, but became severe in 28-day, which was greater in tension side than in pressure side, and in the periodontal fiber next to alveolar bone than to tooth surface. 8. The expression of osteocalcin in alveolar bone was rare until 14-day in pressure side, but became moderate in 28-day. The expression of osteonectin was increased from 7-day by time dependency, which was greater in tension side than in pressure side.

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Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity (유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측)

  • Um, Hui-Jin;Hwang, Yeon-Taek;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.37-42
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    • 2022
  • Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

A Study on Mechanical Interfacial Properties of Copper-plated Carbon Fibers/Epoxy Resin Composites (구리도금된 탄소섬유/에폭시 수지 복합재료의 기계적 계면 특성에 관한 연구)

  • Hong, Myung-Sun;Bae, Kyong-Min;Choi, Woong-Ki;Lee, Hae-Seong;Park, Soo-Jin;An, Kay-Hyeok;Kim, Byung-Joo
    • Applied Chemistry for Engineering
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    • v.23 no.3
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    • pp.313-319
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    • 2012
  • In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

Flip Chip Solder Joint Reliability of Sn-3.5Ag Solder Using Ultrasonic Bonding - Study of the interface between Si-wafer and Sn-3.5Ag solder (초음파를 이용한 Sn-3.5Ag 플립칩 접합부의 신뢰성 평가 - Si웨이퍼와 Sn-3.5Ag 솔더의 접합 계면 특성 연구)

  • Kim Jung-Mo;Kim Sook-Hwan;Jung Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.23-29
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    • 2006
  • Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

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Synthesis and characterization of PPG-based urethane-modified epoxy resin for enhancing impact resistance of epoxy composite resin (에폭시 복합수지의 내충격성을 향상을 위한 PPG 기반 우레탄 변성 에폭시 합성 및 특성 분석)

  • Hwang, Chiwon;Jeon, Jaehee;Ahn, Dowon;Yu, Youngchang;Lee, Wonjoo
    • Journal of Adhesion and Interface
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    • v.23 no.2
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    • pp.44-52
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    • 2022
  • Epoxy resin has the disadvantage of being easily destroyed by instantaneous impact due to its high crosslinking density despite its high glass transition temperature (Tg) and excellent properties. To compensate for this, in this study, polyol was synthesized by ring opening polymerization of propylene glycol (PPG) diamine, Jeffamine D 2000 and propylene carbonate, and urethane modified epoxy was synthesized using this. The properties of the synthesized urethane modified epoxy were confirmed by FT-IR, H-NMR. To confirm the degree of improvement in impact resistance as an adhesive, a urethane modified epoxy adhesive was prepared by mixing a digylcidyl ether bisphenol A (DGEBA) with curing agent and curing accelerator. Properties test of urethane modified epoxy were shear strength, tensile strength and impact strength. As a result, excellent results were obtained in all test when the ratio of DGEBA : urethane modified epoxy was 8:2.

Bending and Bonding Strength Performances of Larix Block-glued Glulam (낙엽송 블록접착집성재의 접착 및 휨 강도 성능)

  • Lee, In-Hwan;Hong, Soon-Il
    • Journal of the Korean Wood Science and Technology
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    • v.44 no.3
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    • pp.315-322
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    • 2016
  • Block-glued glulam is a structural material that can be used as a construction member of a large-section wooden building, which is produced by edgewise bonding of two or more glulam beam elements. The edgewise bonding performance of the block-glued glulam was examined through delamination test and block shear strength test. According to the test results, the block-glued glulam that was manufactured with 1.5 MPa of compressive pressure after applying $500g/m^2$ of Resorcinol adhesive showed the best edgewise bonding performance. The block-glued glulam produced in a good edgewise bonding condition was compared with a control glulam with the same section modulus for bending strength performance. The modulus of elasticity (MOE) in bending was similar to that of the control glulam. The modulus of rupture (MOR) of the block-glued glulam was higher by 27% than that of the control glulam. No interfacial failure or cohesive failure were observed in the edgewise bonding layer.

IS AN OXYGEN INHIBITION LAYER ESSENTIAL FOR THE INTERFACIAL BONDING BETWEEN RESIN COMPOSITE LAYERS? (Layering시 복합레진 층간의 계면 결합에서 oxygen inhibition layer가 필수적인가?)

  • Kim, Sun-Young;Cho, Byeong-Hoon;Baek, Seung-Ho;Lee, In-Bog
    • Restorative Dentistry and Endodontics
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    • v.33 no.4
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    • pp.405-412
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    • 2008
  • This study was aimed to investigate whether an oxygen inhibition layer (OIL) is essential for the interfacial bonding between resin composite layers or not. A composite (Z-250, 3M ESPE) was filled in two layers using two aluminum plate molds with a hole of 3.7 mm diameter. The surface of first layer of cured composite was prepared by one of five methods as followings, thereafter second layer of composite was filled and cured: Group 1 - OIL is allowed to remain on the surface of cured composite; Group 2 - OIL was removed by rubbing with acetone-soaked cotton; Group 3 - formation of the OIL was inhibited using a Mylar strip; Group 4 - OIL was covered with glycerin and light-cured; Group 5 (control) - composite was bulk-filled in a layer. The interfacial shear bond strength between two layers was tested and the fracture modes were observed. To investigate the propagation of polymerization reaction from active area having a photo-initiator to inactive area without the initiator, a flowable composite (Aelite Flow) or an adhesive resin (Adhesive of ScotchBond Multipurpose) was placed over an experimental composite (Exp_Com) which does not include a photoinitiator and light-cured. After sectioning the specimen, the cured thickness of the Exp_Com was measured. The bond strength of group 2, 3 and 4 did not show statistically significant difference with group 1. Groups 3 and 4 were not statistically significant different with control group 5. The cured thicknesses of Exp_Com under the flowable resin and adhesive resin were 20.95 (0.90) urn and 42.13 (2.09), respectively.