• Journal of Adhesion and Interface
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• v.2 no.3
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• pp.16-24
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• 2001

The curing behavior of a phenolic resin (F/p: 1.3, 1.9, 2.5 for resol resin, F/P: 0.5, 0.7, 0.9 for novolac resin) has been studied by FT-IR spectroscopy. In this study is to synthesis of resol and novolac type phenolic resin with different F/P molar ratios and to compare the level of cure at different curing temperature conditions ($130^{\circ}C$, $160^{\circ}C$, $180^{\circ}C$ for resol resin, $160^{\circ}C$, $170^{\circ}C$, $180^{\circ}C$ for novolac resin) for 3, 5, 7, 10, 20, and 60 (min.), respectively. The conversion (${\alpha}$) was determined by the ratio of the peak area with time to the peak area of non-baked phenolic QH ($3300cm^{-1}$) at spectra. It is concluded that the initial curing rate of resol and novolac resin was increased as the molar ratio of formaldehyde/phenol increased and as the curing temperature of resin increased. According to the analysis was by the homogenous first-order model, the initial curing rate of resol and novolac resin was increased as the molar ratio of formaIdehyde/phenol increased at specific curing temperature.

• Polymer(Korea)
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• v.37 no.2
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• pp.240-248
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• 2013

The curing behaviors of diglycidyl ether of bisphenol A (DGEBA) with mercaptan hardener were studied by the comparison with amine-adduct type hardener. Curing behaviors were evaluated by DSC at dynamic and isothermal conditions. In the DSC, the dynamic experiments were based on the method of Kissinger's equation, and the isothermal experiments were fitted to the Kamal's kinetic model. Activation energy of epoxy/amine-adduct type hardener was ca. 40 kcal/mol. As the functional group of mercaptan hardener, -SH increased, on epoxy/mercaptan hardeners, the activation energies decreased from 28 to 19 kcal/mol. Epoxy/amine-adduct type hardener was initiated at $90^{\circ}C$ or higher. However, epoxy/mercaptan hardeners reduced the initiation temperatures below $80^{\circ}C$ and shortened the durations of curing reaction within 10 min. We found out that the reaction kinetics of epoxy with mercaptan hardener followed the autocatalytic reaction models, and the maximum reaction rates were shown at the conversions of 20~40%.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• The Journal of Natural Sciences
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• v.8 no.2
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• pp.21-26
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• 1996

Commercially available Chines oriental lacquer was treated to get two fractions, hexane soluble fraction and hexane insoluble fraction. Hexane soluble fraction was subjected to thermal curing process. Films obtained from the lacquer under normal conditions and obtained from thermal curing were compared. The compounds in hexane soluble fraction were copolymerized with 1,6-diisocyanohexane, and toluendiisocyanate(TDI). Films obtained by thermal curing were highly brittle and hydrophobic while the films obtained under normal conditions were hydrophilic. Curing reaction did not occur when oxygen was not available.Some of the major component in the lacquer was isolated by HPLC and UV spectrum of each compound was recorded.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.73-75
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• 2001

본 연구에서는 무용제 타입의 알킬(alkyl)기를 가진 친수성 4차 암모늄염인 대전방지제(Ultramer 5530)를 합성, 유/무광 수용성 수지와 배합하여 PVC 바닥재에 열경화 코팅을 행하였다. 대전방지 코팅액은 Ultramer 5530을 광택조절이 가능한 유/무광 수용성 수지에 무게 기준으로 5-20 wt%(이하 ‘part’로 표기)범위로 첨가, 배합하여 제조하였다. 대전방지 코팅 처리전 PVC 바닥재의 표면저항은 10/sup 12/Ω이었으나 코팅 후 표면저항은 유광 수지의 경우 최대 10/sup 8/Ω, 무광 수지의 경우 최대 10/sup 6/Ω까지 감소하였다. 유/무광 수지 모두 경화조건에 관계없이 일반적으로 Ultramer 5530의 첨가량이 증가할수록 코팅된 PVC 바닥재의 표면저항은 현저히 감소하였다. 경화온도 l00℃에서 1분간 경화한 콜이도막은 Ultramer 5530의 첨가량이 증가함에 따라 전기저항이 현저하게 감소하였으나 경도 및 부착률 등의 코팅도막 물성이 현저히 저하됨을 알 수 있었다. 이러한 물성 저하는 경화온도를 80℃로 낮추고 경화시간을 20분으로 늘리면 해결할 수 있었다. 본 연구결과, PVC 바닥재의 표면에 형성된 코팅도막의 물성은 Ultramer 5530의 첨가량을 8 part로 하고 120℃에서 1분간 열경화를 시켰을 때 가장 좋았다.

• Journal of the Korean Society of Propulsion Engineers
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• v.24 no.5
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• pp.84-90
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• 2020

The adhesion strength of two konds of solid propellants(primary propellant/secondary propellant) was studied by coating agent of adhesion composition composed of organic solvent, curing agent, and cure catalyst. The coating agent using FeAA, cure catalyst, resulted propellant breaking at more 0.14 wt% and interface breaking at less 0.10 wt%. The TPB cure catalyst of confirmed the result of the interface breaking immediately after curing of the secondary propellant. In addition, the coating agent using TPB was found to increase the adhesion strength between the primary propellant and the secondary propellant over time.

• Journal of the Korea Institute of Building Construction
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• v.15 no.1
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• pp.25-33
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• 2015

In this study, initial crack index was evaluated by FEM analysis to find the crack propagation from hydration heat in precast concrete. As results, as the usage of hardening accelerator increased, initial compressive strength increased and setting time was shortened. Additionally, as amounts of hardening accelerators increased, the central temperature of concrete increased and the time to reach the highest temperature was shortened. It was demonstrated that the hardening accelerators accelerated the hydration reaction of cement, and caused the increase of hydration heat within the short period of time. Furthermore, the crack index for evaluating the heat level was performed by FEM. As results, there was no problem about the cracks, despite of the growth of initial high hydration heat. This is because of the increased tensile strength that is large enough to sustain the thermally induced-stress.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.62-66
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• 2016

The curing processes of waterborne adhesives are in general undergone by using hot-air dryer. The hot-air dryer curing the adhesives with heat has a disadvantage of requiring high temperature over $100^{\circ}C$ as well as curing time as long as 20 min. When it comes to the heat control, high temperature open disturbs the adhesion of substrates by extremely lowering the viscosity of the adhesives. Furthermore, the humidity resulting from the drying process makes the curing condition irregularly. In this report, dehumidifying membrane dryer was used in order to keep the curing process same by removing humidity caused by the evaporation of water during the drying process, and to shorten the curing time. Here, we compared the peel strength of attached substrates in the dehumidifying membrane dryer to find out appropriate curing condition and confirm the effects of the dehumidifying membrane.

• Polymer(Korea)
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• v.28 no.3
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• pp.273-280
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• 2004

Acrylic resins (ethyl methacrylate-2-hydroxypropyl methacrylate-n-butyl acrylate-acrylic acid EHBCs) containing 80％ of solid were synthesized. Then, high-solid coatings (ethyl methacrylate-2-hydroxypropyl methacrylate-n-butyl acrylate-acrylic acid/hexamethylene diisocyanate-biuret : EHBCNs) were prepared by curing of the acrylic resin with curing agent hexamethylene diisocyanate-biuret at room temperature. The cure time of prepared coatings EHBCN-4 (EHBC-4 : $T_{g}$ = $0^{\circ}C$) and EHBCN-7 (EHBC-7 : $T_{g}$ = 3$0^{\circ}C$), measured by rigid-body pendulum method, was recorded 6.2 hours and 4.5 hours, respectively. Dynamic viscoelastic experiment revealed the glass transition temperature of EHBCN-4 and EHBCN-7 to be $14^{\circ}C$ and $39^{\circ}C$, respectively. It was found that the adhesion and flexural properties among various properties of coatings were enhanced by the incorporation of caprolactone acrylate monomer into the acrylic resins.

• Elastomers and Composites
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• v.40 no.3
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• pp.166-173
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• 2005

Effect of thermal aging on the weight loss and water absorption of epoxy adhesives was investigated in the presence of three types of different hardeners, such as D-230, G-5022, and HN-2200. Thermal and mechanical properties of the cured epoxy resins were also studied througth the glass transition temperature and shear adhesion strength measurements. Weight losses of DGEBA/D-230 and DGEBA/HN- 2200 systems were not varied. However, the weight of DGEBA/G-5022 system was significantly decreased with increasing the thermal aging time. The water absorption of the specimens was increased as the thermal aging time increased except that using G-5022. DEGBA/HN-2200 system showed higher $T_g$ value than those of other systems, due to the formation of the fine three-dimensional network structure containing aliphatic ring. Shear adhesion strength of all systems was increased with increasing the thermal aging tine, which is attributed to increased degree of cure and fine three-dimensional network structure formation. And $T_g$ values and shear adhesion strength of all specimens exposed to water was decreased as the immersion time increased.