• Journal of the Korean Ceramic Society
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• v.40 no.4
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• pp.354-359
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• 2003

The microwave dielectric characteristics of (1-x)(Al$\_$$\frac{1}{2}$/Ta$\_$$\frac{1}{2}$/)O$_2$-x(Mg$\_$1/3/Ta$\_$2/3/)O$_2$ (0$\leq$x$\leq$1.0) ceramics were investigated by crystalstructure, variations of ionic polarizability, and microstructures. As x increased, (1-x)(Al$\_$$\frac{1}{2}$/Ta$\_$$\frac{1}{2}$/)O$_2$-x(Mg$\_$1/3/Ta$\_$2/3/)O$_2$ transformed to tetragonal structure. Because the ionic radius of (Mg$\_$1/3/Ta$\_$2/3/)$\^$4+/was slightly bigger than one of (Al$\_$$\frac{1}{2}$/Ta$\_$$\frac{1}{2}$/)$\^$4+/, the cell parameters increased with increase of (Mg$\_$1/3/Ta$\_$2/3/)O$_2$concentration and coincided with prediction of the molecular additivity rule. As x increased, the compositions revealed ordered phase and were of single phase above 60 mol%. The increase of the ordered phase and grain size enhanced the Q and when ordering was completed at x over 0.6, the grain size was major factor for the increase in the a. Though the grain size increased, however, the porosity deteriorated the q. Therefore, the a depended on the order/disorder, the porosity, and the grain size in regular order.

• Korean Journal of Mineralogy and Petrology
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• v.36 no.3
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• pp.185-197
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• 2023

The Gubong Au-Ag deposit consists of eight lens-shaped quartz veins. These veins have filled fractures along fault zones within Precambrian metasedimentary rock. This has been one of the largest deposits in Korea, and is geologically a mix of orogenic-type and intrusion-related types. Korea Mining Promotion Corporation drilled into a quartz vein (referred to as the No. 6 vein) with a width of 0.9 m and a grade of 27.9 g/t Au at a depth of -728 ML by drilling (No. 90-12) in the southern site of the deposit, To further investigate the potential redevelopment of the No. 6 vein, another drilling (No. 04-1) was carried out in 2004. In 2004, samples (wallrock, wallrock alteration and quartz vein) were collected from the No. 04-1 drilling core site to study the occurrence and chemical composition of Ti-bearing minerals (ilmenite, rutile). Rutile from mineralized zone at a depth of -275 ML occur minerals including K-feldspar, biotite, quartz, calcite, chlorite, pyrite in wallrock alteration zone. Ilmenite and rutile from ore vein (No. 6 vein) at a depth of -779 ML occur minerals including white mica, chlorite, apatite, zircon, quartz, calcite, pyrrhotite, pyrite in wallrock alteration zone and quartz vein. Based on mineral assemblage, rutile was formed by hydrothermal alteration (chloritization) of Ti-rich biotite in the wallrock. Chemical composition of ilmenite has maximum values of 0.09 wt.% (HfO₂), 0.39 wt.% (V₂O₃) and 0.54 wt.% (BaO). Comparing the chemical composition of rutile at a depth -275 ML and -779 ML, Rutile at a depth of -779 ML is higher contents (WO₃, FeO and BaO) than rutile at a depth of -275 ML. The substitutions of rutile at a depth of -275 ML and -779 ML are as followed : rutile at a depth of -275 ML Ba²⁺ + Al³⁺ + Hf⁴⁺ + (Nb⁵⁺, Ta⁵⁺) ↔ 3Ti⁴⁺ + Fe²⁺, 2V⁴⁺ + (W⁵⁺, Ta⁵⁺, Nb⁵⁺) ↔ 2Ti⁴⁺ + Al³⁺ + (Fe²⁺, Ba²⁺), Al³⁺ + V⁴⁺+ (Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + 2Fe²⁺, rutile at a depth of -779 ML 2 (Fe²⁺, Ba²⁺) + Al³⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + (V⁴⁺, Hf⁴⁺), Fe²⁺ + Al³⁺ + Hf ⁴⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + V⁴⁺ + Ba²⁺, respectively. Based on these data and chemical composition of rutiles from orogenic-type deposits, rutiles from Gubong deposit was formed in a relatively oxidizing environment than the rutile from orogenictype deposits (Unsan deposit, Kori Kollo deposit, Big Bell deposit, Meguma gold-bearing quartz vein).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.2
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• pp.108-112
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• 2003

The calculated and measured dielectric constants of (1-x)(A $l_{1}$2/ T $a_{1}$2/) $O_2$-x(M $g_{1}$3/ T $a_{2}$3/) $O_2$ (0$\leq$x$\leq$1.0) solid solutions were investigated by variations of ionic polarizability and crystal structure. (A $l_{1}$2/ T $a_{1}$2/) $O_2$ and (M $g_{1}$3/ T $a_{2}$3/) $O_2$ were orthorhombic and tetragonal trirutile structure, respectively. When (A $l_{1}$2/ T $a_{1}$2/) $O_2$ was substituted by (M $g_{1}$3/ T $a_{2}$3/) $O_2$, the phase transformed to tetragonal structure over 60 mole. Because the total ionic radius of [(Mg+2Ta)/3]$^{4+}$ was slightly bigger than one of [(Al+Ta)/2]$^{4+}$, the lattice parameters increased with an increase of (M $g_{1}$3/ T $a_{2}$3/) $O_2$ substitution. The measured dielectric constant increased with an increase of (M $g_{1}$3/ T $a_{2}$3/) $O_2$ substitution and coincided with dielectric mixing rule and the calculated dielectric constant with the molecular additivity rule. There were some differences between the measured and the calculated dielectric constant. The reason of the lowered dielectric constant comparing with the calculated one was compressed stress due to the electronic structure of tantalum.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.5
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• pp.185-190
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• 2002

Capacitor material utilized in the downsizing passive devices and dynamic random access memory(DRAM) requires the physical and electrical properties at given area such as capacitor thickness reduction, relative dielectric constant increase, low leakage current and thermal stability. Common capacitor materials, $SiO_2$, $Si_3N_4$, $SiO_2$/$Si_3N_4$,TaN and et al., used until recently have reached their physical limits in their application to several hundred angstrom scale capacitor. $Ta_2O_{5}$ is known to be a good alternative to the existing materials for the capacitor application because of its high dielectric constant (25 ~35), low leakage current and high breakdown strength. Despite the numerous investigations of $Ta_2O_{5}$ material, there have little been established the clear understanding of the annealing effect on capacitance characteristic and conduction mechanism, design and fabrication for $Ta_2O_{5}$ film capacitor. This study presents the structure-property relationship of reactive-sputtered $Ta_2O_{5}$ MIM capacitor structure processed by annealing in a vacuum. X-ray diffraction patterns skewed the existence of amorphous phase in as-deposited condition and the formation of preferentially oriented-$Ta_2O_{5}$ in 670, $700^{\circ}C$ annealing. On 670, $700^{\circ}C$ annealing under the vacuum, the leakage current decrease and the enhanced temperature-capacitance characteristic stability. and the leakage current behavior is stable irrespective of applied electric field. The results states that keeping $Ta_2O_{5}$ annealed at vacuum gives rise to improvement of electrical characteristics in the capacitor by reducing oxygen-vacancy and the broken bond between Ta and O.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.164-170
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• 2012

Nanotubular structure formation on the Ti-6Al-4V and Ti-Ta alloy surfaces by electrochemical methods has been studied using the anodizing method. A nanotube layer was formed on Ti alloys in 1.0 M $H_3PO_4$ electrolyte with small additions of $F^-$ ions. The nanotube nucleation and growth of the ${\alpha}$-phase and ${\beta}$-phase appeared differently, and showed different morphology for Cp-Ti, Ti-6Al-4V and Ti-Ta alloys. In the ${\alpha}$-phase of Cp-Ti and martensite ${\alpha}^{\prime}$ and in the ${\alpha}^{{\prime}{\prime}}$ and ${\beta}$-phase of the Ti-Ta alloy, the nanotube showed a clearly highly ordered $TiO_2$ layer. In the case of the Ti-Ta alloy, the pore size of the nanotube was smaller than that of the Cp-Ti due to the ${\beta}$-stabilizing Ta element. In the case of the Ti-6Al-4V alloy, the ${\alpha}$-phase showed a stable porous structure; the ${\beta}$-phase was dissolved entirely. The nanotube with two-size scale and high order showed itself on Ti-Ta alloys with increasing Ta content.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.219-219
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• 2003

HVOF(High Velocity Oxygen Fuel)법을 사용한 MCrAlY(M=Ni, Co, Fe)계 열차폐 코팅(thermal barrier coating)은 열기관 내부의 극심한 환경 부하에 대해 구조물 표면에 열적, 화학적 장벽을 형성함으로써 구조물의 내구성을 향상시킨다 이와 동시에 열차폐 효과는 구조물의 온도상승 없이 내부 가동 온도를 높일 수 있게 함으로써 열효율을 상승시키고 연료 효율을 높여 가동비용 절감을 이룰 수 있는 동시에 고 연소를 통한 오염원의 배출을 감소시킬 수 있다. 본 연구에서는 $H_2O$$_2$=5:1 분위기 하에서 HVOF법을 사용하여 Hastelloy-X 기판위에 125$\mu\textrm{m}$의 두께로 다음 5종류의 (Ni, Co, Cr)계 MCrAlY 코팅을 용사시켰다. 준비된 (Ni, Co)-Cr-Al-(Y, Ta, Re), (Ni, Co)-Cr-Al-(Y, Re), (Ni, Co)-Cr-Al-(Y, Ta), (Ni, Co)-Cr-Al-Y, (Ni,Co)-Cr-Al-Ir 코팅시편에 대한 산화성질을 조사하기 위해 대기 중 1000, 1100, 120$0^{\circ}C$에서 50, 100, 150, 200시간 등온실험(Isothermal oxidation)을 실시하였고, XRD, SEM/EDS, EPMA를 이용하여 생성된 산화막과 코팅 시편의 조직 변화를 조사하였다. 산화온도와 산화시간이 증가할수록 산화막의 박리가 많이 발생하였으며, 분석 결과 미세하게 분포된 a-Al$_2$O$_3$ 입자, NiCr$_2$O$_4$스피넬 상, 미세한 Cr$_2$O$_3$가 관찰되었고, 코팅 조성 변화에 따라 형성되는 이들 산화물의 존재비가 달라졌으며, 산화온도가 높아질수록 산화속도가 가속화되었다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.8
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• pp.340-346
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• 2002

Capacitor material utilized in the downsizing passive devices and integration of passive devices requires the physical and electrical properties at given area such as capacitor thickness reduction, relative dielectric constant increase, low leakage current and thermal stability. common capacitor materials, $Al_2O_3$, $SiO_2$, $Si_3N_4$, $SiO_2$/$Si_3N_4$, TaN and et al., used until recently have reached their physical limits in their application to integration of passive devices. $Ta_2O_{5}$ is known to be a good alternative to the existing materials for the capacitor application because of its high dielectric constant (25~35), low leakage current and high breakdown strength. Despite the numerous investigations of $Ta_2O_{5}$ material, there have little been established the clear understanding of the annealing effect on capacitance characteristic and conduction mechanism. This study presents the dielectric properties $Ta_2O_{5}$ MIM capacitor structure Processed by $O_2$ RTA oxidation. X-ray diffraction patterns showed the existence of amorphous phase in $600^{\circ}C$ annealing under the $O_2$ RTA and the formation of preferentially oriented-$Ta_2O_{5}$ in 650, $700^{\circ}C$ annealing and the AES depth profile showed $O_2$ RTA oxidation effect gives rise to the $O_2$ deficientd into the new layer. The leakage current density respectively, at 3~1l$\times$$10_{-2}$(kV/cm) were $10_{-3}$~$10_{-6}$(A/$\textrm{cm}^2$). In addition, behavior is stable irrespective of applied electric field. the frequency vs capacitance characteristic enhanced stability more then $Ta_2O_{5}$ thin films obtained by $O_2$ reactive sputtering. The capacitance vs voltage measurement that, Vfb(flat-band voltage) was increase dependance on the $O_2$ RTA oxidation temperature.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.66-67
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• 2002

Magnetic tunnel junction에서는 spin의 tunneling이 가장 기본적인 현상이기 때문에 tunnel junction의 특성은 tunnel barrier의 성질에 크게 의존한다. Tunnel barrier로는 지금까지 $Al_2$O$_3$가 주로 사용되고 있다. 하지만 $Al_2$O$_3$의 경우는 barrier height가 2-3 eV로 높기 때문에 저 저항의 tunnel junction을 형성하기 위해서는 Al의 두께가 1nm 이하로 낮아져야 한다. 따라서 이를 극복하기 위해서 $Al_2$O$_3$ 보다 낮은 barrier height를 갖는 절연막을 tunnel barrier로 사용하고자 하는 연구가 많이 진행되고 있다 (예를 들면 TaOx [1], ZrOx [2], GaOx [3], and HfOx [4]). (중략)

• Journal of Sensor Science and Technology
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• v.4 no.3
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• pp.80-88
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• 1995

This paper presents the fabrication of a metal-insulator-metal(MIM) antifuse structure consisting of insulators sandwiched between top electrode, Al, and bottom electrode, TiW and additionally studies on antifuse properties depending on the condition of insulator. The intermetallic insulators, prepared by means of sputter, comprised of silicon oxide and tantalum oxide. In such an antifuse structure, silicon oxide layer is utilized to decrease the leakage current and tantalum oxide layer, of which the dielectric strength is lower than that of silicon oxide, is also utilized to lower the breakdown voltage near 10V. Finally sufficient low leakage current, below 1nA, and low programming voltage, about 9V, could be obtained in antifuse device comprising $Al/Ta_{2}O_{5}(10nm)/SiO_{2}(10nm)/TiW$ structure and OFF resistance of 3$3.65M{\Omega}$ and ON resistance of $7.26{\Omega}$ could be also obtained. This $Ta_{2}O_{5}/SiO_{2}$ based antifuse structures will be promising for highly reliable programmable device.

• Journal of Technologic Dentistry
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• v.26 no.1
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• pp.97-104
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• 2004

A new Ti-10Ta-10Nb alloy has designed and examined some possibility of forming more passive oxide film by oxidation treatment which is closely related to corrosion resistance and biocompatibility. Ti-6Al-4V and Ti-10Ta-10Nb alloys were prepared by consumable vacuum arc melting and homogenized at 1050$^{\circ}C$ for 24hours. Alloy specimens were oxidized at the temperature range of 400 to 750$^{\circ}C$ for 30minutes, and the oxide films on Ti alloys were analysed by optical microscope, SEM, XPS and TGA. Cytotoxicity test was performed in MTT assay treated L929 fibroblast cell culture by indirect method. It is found out that the oxide film on Ti-10Ta-10Nb alloy is denser and thinner compared to Ti-6Al-4V alloy. The weight gain during the oxidation was increased rapidly at the temperature above 650$^{\circ}C$ for Ti-6Al-4V alloy and above 700$^{\circ}C$ for Ti-10Ta-10Nb alloy respectively. It was analysed that the passive film of the Ti alloys consisted of TiO2 through X-ray photoelectron spectroscopy (XPS) analysis. It is found out by cytotoxicity test that moderate oxidation treatment lowers cell toxicity, and Ti-10Ta-10Nb alloy showed better result compared to Ti-6Al-4V alloy.