• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.217-220
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• 2014

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

• Resources Recycling
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• v.14 no.1
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• pp.17-25
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• 2005

In order to recover valuable metals from the waste electronic scrap, bioleaching of Cu, Zn, Al, Co, Ni, Sn and Pb was carried out using Thiobacillus ferrooxidans as a leaching microorganism in a shaking flask. In a preliminary study, to obtain the data on the leaching of Cu, Zn, Al, Co and Ni, the metal leaching was accomplished using metal powers instead of electronic scrap. The leaching percentaga of Cu, Zn, Co, Al and Ni powers was reduced with the increase of metal power concentration in solution. Below the metal concentration of 0.5 g/L, more than 85% of Cu, Co and Zn powers was leached out. At the electronic scrap concentration of 100 g/L, Thiobacillus ferrooxidans were able to leach more than 90% of the available Cu and Co while Al, Zn and Ni were able to leach less than 40%. Pb and Sn were not detected in the leachate. Pb was precipitated as PbSO$_4$, whereas Sn precipitated probably as SnO.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1487-1489
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• 1994

$(Zr_{0.65}Sn_{0.35})Ti_{1.04}O_4$ system which has a dielectric constant, low dielectric loss and temperature coefficient was investigated. Temperature coefficient varied from positive to negative with increasing of NiO. For the NiO content 1.0wt%. i.e $(Zr_{0.65}Sn_{0.35})Ti_{1.04}O_4$, the ceramic showed very good dielectric properties such as ${\epsilon}$=37.8, $Q{\times}f_o=49.000$ and ${\tau}_r= 4{\pm}1ppm/^{\circ}C$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.218-221
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• 2004

Dry sliding wear behavior of electro-pressure sintered Co, $Co-20\;wt.\%$ CuSn and $Co-20\;wt.\%$ WC composites were investigated. Wear tests of the materials were carried out using a pin-on-disk wear tester at various loads of 10N-100N under a constant sliding speed condition of 0.38m/s against glass ($83\%\;SiO_2$) beads. Sliding distances were varied with a range of $100m{\sim}600m$. A scanning electron microscopy was used to examine morphologies of worn surfaces, cross-sections, and wear debris. The $Co-20\;wt.\%$ WC composite had the highest and the $Co-20\;wt.\%$ CuSn composite showed the lowest wear resistance among the tested materials. All specimens exhibited low friction coefficients ranging from 0.12 to 0.4 at the applied load of 100N.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.956-960
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• 2010

CuO doped $WO_3-SnO_2$ thick film gas sensors were fabricated by screen printing method on alumina substrates and heat-treated at $350^{\circ}C$ in air. The effects of mixing ratio of $WO_3$ with $SnO_2$ on the structural and morphological properties of $WO_3-SnO_2$ were investigated X-ray diffraction and Scanning Electron Microscope. The structural properties of the $WO_3-SnO_2$:CuO thick film by XRD showed that the monoclinic of $WO_3$ and the tetragonal of $SnO_2$ phase were mixed. Nano CuO was coated on the $WO_3-SnO_2$ surface and then the surface of $WO_3$ was coated with $SnO_2$ particles with $1\sim1.5{\mu}m$ in diameters, as confirmed form the SEM image. The sensitivity of the $WO_3-SnO_2$:CuO sensor to 2000 ppm $CO_2$ gas and 50 ppm $H_2S$ gas for the various ratio of $WO_3$ and $SnO_2$ was investigated. The 4 wt% CuO doped $WO_3-SnO_2$(75:25) tkick films showed the highest sensitivity to $CO_2$ gas and $H_2S$ gas.

• Journal of Sensor Science and Technology
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• v.17 no.4
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• pp.281-288
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• 2008

Polyacrylonitrile(PAN)/metal oxide(MO) nanocomposite mats with a thickness of 0.12 mm were electrospun by adding 0 to 10 wt% of MO nanoparticles ($Fe_2O_3$, ZnO, $SnO_2$, $Sb_2O_3-SnO_2$) into PAN. Pt electrode was patterned on $Al_2O_3$ substrate by DC sputtering and then the PAN(/MO) mats on the Pt patterned $Al_2O_3$ were electrically wired to investigate the $CO_2$ gas sensing properties. As the MO content rose, the fiber diameter decreased due to the presence of lumps caused by the presence of MOs in the fiber. The PAN/2% ZnO mat revealed a faster response time of 93 s and a relatively short recovery of 54 s with a ${\Delta}R$ of 0.031 M${\Omega}$ at a $CO_2$ concentration of 200 ppm. The difference in sensitivity was not observed significantly for the PAN/MO fiber mats in the $CO_2$ concentration range of 100 to 500 ppm. It can be concluded that an appropriate amount of MO nanoparticles in the PAN backbone leads to improvement of the $CO_2$ gas sensing properties.

• Journal of Sensor Science and Technology
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• v.22 no.4
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• pp.302-307
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• 2013

The Sb-doped $SnO_2$ nanowire network sensors were prepared by thermal evaporation of the mixtures between tin and antimony powders. Pure $SnO_2$ nanowire networks showed high sensor resistance in air ($99M{\Omega}$), similar gas responses to 4 diffferent gases (5 ppm $C_2H_5OH$, CO, $H_2$, and trimethylamine), and very sluggish recovery speed (90% recovery time > 800 s). In contrast, 2 wt% Sb-doped $SnO_2$ showed the selective detection toward $C_2H_5OH$ and trimethylamine, relatively low resistance ($176k{\Omega}$) for facile measurement, and ultrafast recovery speed (90% recovery times: 6 - 18 s). The change of gas sensing charactersitics by Sb doping was discussed in relation to gas sensing mechanism.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.175-175
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• 2016

Sn도금액은 강산에서는 $Sn^{2+}$, 강알칼리에서는 $Sn^{4+}$석출이 안정하다. 중성영역은 도금액에 $Sn^{2+}$침전을 방지하기 위하여 착화제가 필요하다. 기록에 남아 있는 가장 오래된 Sn도금은 1856년 Gore가 4가의 주석산염을 사용한 알칼리성용액이다. 그 후 50~60년 사이에 2가의 염화주석($SnCl_2$)과 KOH에 Cyan 등의 착화제를 첨가한 도금액이 발표되었다. 최초의 실용적인 알칼리주석용액은 1931년 Oplinger의 4가 주석산 염으로서, $CH_3COONa$를 완충제로 사용하였고, $Sn^{2+}$을 산화시키기 위하여 과산화물이나 과 붕산염을 첨가하였다. 알칼리성 Sn용액은 Natrium용액과 Kalium용액이 있지만, Kalium염이 용해성이 좋고, Sn농도를 높여 전류밀도를 높일 수 있다. 알칼리성용액은 도금속도가 산성용액의 1/2로 되고, 음극효율도 80~90% 정도 낮아, 두꺼운 피막이나 생산성을 중시하는 부품에는 적합하지 않다. 초기의 산성용액은 Sn의 정련목적으로 사용되었고, Pb정련에 사용된 Fluor규산용액에 Gelatine을 첨가하였다. Mathers는 Cresol산을 첨가하여 미량의 Cresol포화용액을 사용하여 고속으로 두껍게 석출시킬 수 있었다. 독일의 Schloetter도 다양한 방향족 술폰산으로써 반 광택피막을 실현하였다. 산성Sn도금액은 첨가제에 어떠한 유기화합물을 사용하는가는 도금장치나 석출상태로써 결정할 수 있다. Hothersall과 Bradshaw는 Cresol술폰산을 첨가하여 도금액 안정성 향상을 발견했다. Cresol술폰산은 $Sn^{2+}$의 안정제이며, Gelatine은 분산제기능을 한다. 붕 불화용액은 Sn농도를 높일 수 있고, $2{\sim}12A/dm^2$의 고 전류밀도의 도금이 가능하다. 1937년 Schloetter가 개발하여 미국의 제철회사에서 사용되었다. Sn-Ni도금은 Ni도금보다도 뛰어난 내식성이 있기 때문에 자전거, 자동차부품에 사용되고 있다. 실용도금액은 1951년 Parkinson이 발표한 HBF/HCL용액이다. $SnCl_2$산성용액에서 표준전위는 -0.136V인데 비하여, Ni이온의 표준전위는 -0.25V이다. HF용액에서는 불화물이온이 $Sn^{2+}$의 석출전위를 (-)방향으로 이동시켜서 합금석출이 가능하다. Sn-Co도금은 Cr도금의 색조에 가깝고, 장식목적으로 사용된다. Cr도금 대체용으로 사용된다. 내마모성이나 내식성은 Cr도금보다도 떨어지기 때문에 장식목적에 한정된다. 1953년 Parkinson은 Sn-Ni도금연구에서 동일한 용액조성으로부터 Co 30%를 석출시켰다. Sn-Zn도금은 방식도금으로서 자동차부품에 많이 사용되고 있다. Sn과 Zn의 표준전위는 서로 멀리 떨어져 있기 때문에 산성용액에서는 공석될 수 없다. 1980년대에 들면서, 방식Cd(Cadmium)도금의 독성 때문에 Sn-Zn도금을 재인식 하게 되었다. 1957년 Vaid 등이 No Cyan도금액을 발표했다. 그 후 러시아의 연구자가 안정한 도금액을 연구하였고, Srivastava와 Muckergee가 1976년에 종합하였다.

• Applied Chemistry for Engineering
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• v.5 no.2
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• pp.327-336
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• 1994

The synergistic effects in mechanical mixture catalysts of Mo-V-O and metal oxide were investigated for the selective oxidation of acrolein. The metal oxides used are $SnO_2$, ${\alpha}-Sb_2O_4$, $WO_3$, ${\alpha}-Al_2O_3$, CuO, $MnO_2$, $Cu_2O$, MgO, CoO, and ZnO. Mechanical mixtures of Mo-V-O plus $SnO_2$ or ${\alpha}-Sb_2O_4$ had resulted in higher conversion of acrolein and higher yield of acrylic acid than Mo-V-O. The origin of the synergy is attributed to the cooperation of Mo-V-O and $SnO_2$ or ${\alpha}-Sb_2O_4$, in which $SnO_2$ or ${\alpha}-Sb_2O_4$ forms dissociated oxygens at their oxygen vacancies and transports them to Mo-V-O. $Cu_2O$, MgO, CuO, and $MnO_2$, increased conversion of acrolein but decreased yield of acrylic acid. CoO and ZnO inhibited the catalytic performance of Mo-V-O. The different role of these metal oxides is explained in terms of their oxidation-reduction properties.