• Journal of the Korean Ceramic Society
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• v.30 no.10
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• pp.785-790
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• 1993

Sialon ceramics are presently seen as promising materials with high hardness, strength, fracture toughness and corrosion resistance for friction and wear applications. The objective of present work is to improve of mechanical properties and wear resistance of $\alpha$-Sialon(x=0.4) by addition of SiC whisker. $\alpha$-sialon(x=0.4)/SiC whisker composites were obtained by hot-isostatic pressing at 173$0^{\circ}C$ for 1 hour under 1757Kg/$\textrm{cm}^2$ N2 pressure after pressureless sintering the mixture of Si3N4, Y2O3, AlN at 1780~180$0^{\circ}C$ for 3~5 hours in N2 atmosphere. As the amount of SiC whisker content increased, relative density and hardness were decreased, however fracture toughness, bending strength and tribological properties were improved. Tribological properties of $\alpha$-Sialon/15 vol% SiC whisker composite were improved in spite of its low mechanical properties.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1526-1528
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• 2003

본 연구에서는 P-type Si wafer에 1000[$^{\circ}C$]의 조건에서 열산화방식으로 성장시킨 산화막($SiO_2$) 두께 3000[${\AA}$] 그 위에 APCVD방법으로 형성시킨 질화막($Si_3N_4$)의 두께 500[${\AA}$], 1500[${\AA}$]인 시료에 대하여 전기적 특징 중 유전정접 특성에 관하여 조사하였다. [1] 또한 각각의 두께에 대하여 측정 온도범위 상온${\sim}150[^{\circ}C]$ 와 인가전압 범위 1[V]${\sim}$20[V]에서 유전정접의 주파수 의존성과 온도 의존특성을 조사하고 특히 정전용량 변화에 따른 유전특성에 대하여 조사하고 변환기 소자재료 개발을 위한 기초물성을 실험한 결과를 보고한다.

• Journal of the Korean Society of Safety
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• v.13 no.4
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• pp.131-136
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• 1998

The creep behavior and failure mechanism of the 30 vol% hot-pressed $SiC_t/Si_3N_4$ ceramic composite was experimentally investigated at $1200^{\circ}C$ and at various stress levels in air. The creep threshold stress for zero creep rate after 100 hr was found to be approximately 60 MPa. The stress exponent was estimated to be n~1, which suggests that fiber-reinforcement reduced the stress sensitivity of the HPSN matrix with the stress exponent of 2. The tertiary stage leading to creep rupture was found at 250 MPa but was very short. The microstructure of the crept specimen showed random fiber fracture and no matrix cracking. Interfacial debonding was absent.

• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.218-221
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• 1989

Buried Bragg reflectors which are immune to the contamination of the surface of an optical waveguide chip are fabricated on Si3N4-SiO2 rib optical waveguides on Si. The effective refractive indices and the bandwidths of the fabricated buried Bragg reflector waveguides are determined by transmission measurement. We show that the measured values of the effective refractive indices are consistent with the calculated values as the width of the waveguide rib varies. Propagation losses of the guided modes due to the leakage into the si substrate are also calculated.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.585-589
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• 2001

Many experimental results have revealed that the development of cavitaition during tensile deformation is limited by the Presence of liquid phases. However, the presence of liquid phases does not always lead to high-strain-rate superplasticity, because too much liquid causes intergranular decohesion at grain boundaries/interfaces in metal-matrix composites. Thus, it is important to examine the nature of interfaces of superplastic composites in order to understand the origin of superplastic flow related to liquid grain boundaries during high-strain-rate superplastic deformation. This study shows that a large elongation is obtained at the temperature, that is close to the onset temperature for partial melting in the superplastic composites, but the elongation significantly decreases at slightly higher temperatures, which are close to the end temperature fur partial melting. This indicates that there is an optimum amount of the liquid phase for obtaining high-strain-rate superplasticity in these materials.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.96-99
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• 2006

In this research, a wafer-level transfer method of cantilever away on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.625-626
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• 2013

• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.152-157
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• 2004

Ti-Al-N ($Ti_{75}$ $Al_{25}$ N) and Ti-Al-Si-N ($Ti_{69}$ $Al_{23}$ $Si_{8}$N) coatings synthesized by a DC magnetron sputtering technique were studied comparatively with respect to phase characterization and high-temperature oxidation behavior. $Ti_{69}$ $Al_{23}$ $Si_{ 8}$N coating had a nanocomposite microstructure consisting of nanosized(Ti,Al,Si)N crystallites and amorphous $Si_3$$N_4$, with smooth surface morphology. Ti-Al-N coating of which surface $Al_2$$O_3$ layer formed during oxidation suppressed further oxidation. It was sufficiently stable against oxidation up to about $700^{\circ}C$. Ti-Al-Si-N coating showed better oxidation resistance because both surface Ab03 and near-surface $SiO_2$ layers suppressed further oxidation. XRD, GDOES, XPS, and scratch tests were performed.

• Journal of the Korean Ceramic Society
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• v.25 no.5
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• pp.561-569
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• 1988

Mixtures of very small amounts of additive, carbon and silica(about 0.46${\mu}{\textrm}{m}$) which synthesized by the hydrolysis of ethyl silicate, the molar ratio of SiO2/C was fixed to 1/10, was nitrided at 145$0^{\circ}C$. It was considered that the optimum amount of additive to promote the nitridation reaction was below 2.0wt%. By the addition of additive, the nitridation reaction was promoted and formation of $\beta$-Si3N4 was promoted at 145$0^{\circ}C$ for 1hour, but, the nitridation reaction was decreased and the ratio of $\alpha$/$\beta$ of Si3N4, was increased at 145$0^{\circ}C$ for 5 hours. The crystal phase was $\alpha$ phase and the nitridation reaction was promoted and the particle size of silicon nitride was become smaller by the addition of $\alpha$-Si3N4, but silicon nitride of whisker-like form was produced by the addition of transition elements. There was a difference in the lattice constants of $\alpha$-Si3N4, but no difference in its of $\beta$-Si3N4 according to kinds of added substance and reaction time.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1338-1342
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• 2005

We have synthesized an $Eu^{2+}$-activated $Sr_3MgSi_2O_8$ blue phosphor and $Ba_2SiO_4$ green phosphor and $Ba^{2+}$ co-doped $Sr_3SiO_5$ red phosphor investigated an attempt to develop white LEDs by combining it with a GaN blue LED $chip(\lambda_{em}=405 nm)$. Three distinct emission bands from the GaN-based LED and the $(Sr_3MgSi_2O_8:Eu\; +\; Ba_2SiO_4:Eu\; +\; Ba^{2+}\; co-doped\; Sr_3SiO_5:Eu)$ phosphor are clearly observed at 460nm, 520 nm and at around 600 nm, respectively. These three emission bands combine to give a spectrum that appears white to the naked eye. Our results show that GaN (405 nm chip)-based $(Sr_3MgSi_2O_8:Eu\; +\; Ba_2SiO_4:Eu\; +\; Ba^{2+}\; co-doped\; Sr_3SiO_5:Eu) exhibits a better luminous efficiency than that of the industrially available product InGaN (460 nm chip)-based YAG:Ce.