• E2M - 전기 전자와 첨단 소재
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• 제16권9호
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• pp.65.1-65
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• 2003

The interface of zirconium oxide thin films on silicon is analyzed in detail for their potential applications in the microelectronics. The formation of an interfacial layer of ZrSi$\sub$x/O$\sub$y. with graded Zr concentration is observed by the x-ray photoelectron spectroscopy and secondary ion mass spectrometry analysis. The as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y//Si sample is thermally stable up to 880$^{\circ}C$, but is less stable compared to the ZrO$_2$/SiO$_2$/Si samples. Post-deposition annealing in oxygen or ammonia improved the thermal stability of as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y/Si to 925$^{\circ}C$, likely due to the oxidation/nitridation of the interface. The as-deposited film had an equivalent oxide thickness of∼13 nm with a dielectric constant of ∼21 and a leakage current of 3.2${\times}$10e-3 A/$\textrm{cm}^2$ at 1.5V. Upon oxygen or ammonia annealing, the formation of SiO$\sub$x/ and SiH$\sub$x/N$\sub$y/O$\sub$z/ at the interface reduced the overall dielectric constants.

• 한국전기전자재료학회논문지
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• 제21권6호
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• pp.544-551
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• 2008

We have studied the dielectric characteristics of low-k interlayer dielectric materials fabricated by PECVD for various precursor's flow rates. BTMSM precursor was introduced with the flow rates from 42 sccm to 60 sccm by 2 sccm step in the constant flow rate of 60 sccm $O_2$. The absorption intensities of Si-O-$CH_x$ bonding group and Si-$CH_x$ bonding group changed synchronously for the variation of precursor flow rate, but the intensity of Si-O-Si(C) responded asynchronously with the $CH_x$ combined bonds. The heat treatment reduced the FTIR absorption intensity of Si-O-$CH_x$ bonding group and Si-$CH_x$ bonding group but increased the intensity of Si-O-Si(C). The nanopore and free space formed by the increasement of caged link mode and cross link mode of Si-O-Si(C) group implied the origin of low-k SiOCH films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.243.2-243.2
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• 2013

본 실험에서 $SiO_2$, $SiN_x$ 게이트 절연막에 따른 ITZO 산화물 반도체 트랜지스터를 제작하여, 온도변화에 따라 전달 특성 변화를 측정하여 열에 대한 소자의 안정성을 비교, 분석하였다. 온도가 증가함에 따라 carrier가 증가하는 온도 의존성을 보이며, 이로 인해 Ioff가 증가하였다. multiple-trapping 모델을 적용하여, 이동도 증가와 문턱 전압이 감소를 확인하였다. 또한 M-N rule을 적용하여 $SiO_2$, $SiN_x$ 게이트 절연막을 가진 ITZO 산화물 박막 트랜지스터의 활성화 에너지를 추출하고, sub-threshold 지역에서 활성화 에너지의 변화량이 $SiO_2$, SiNX 각각 0.37 eV/V, 0.24 eV/V로 차이를 통해 $SiN_x$ 게이트 절연체를 가진 ITZO 산화물 반도체 트랜지스터의 이동도와 문턱 전압의 변화가 더 컸음을 확인하였다.

• 한국세라믹학회지
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• 제16권4호
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• pp.206-212
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• 1979

The phase relations and microstructure appeared at 1700℃ in a system of Si3N4-Al2O3-SiO2 were studied. The samples were pressurelessly sintered at 1700℃ for 1hr and reheated at 1600℃ for 1hr under nitrogen atmosphere. The compounds formed were identified by X-ray diffraction method and the microstrues were observed by SEM. The stable phases appeared in this system were X-phase, Si2ON2, β'-Si3N4 and Mullite. From the results of those experiments, it was concluded that the X-phase has very close composition to that proposed by G, K. Layden, Si3Al6O12N2. SEM photographs showed that Si2ON2 was a plate phase and X-phase was a rectagular plate phase.

• 한국세라믹학회지
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• 제44권4호
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• pp.219-223
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• 2007

The ionic conductivity of $Li_2O-ZrO_2-SiO_2$ glasses has been designed and analyzed on the basis of a mixture design experiment with constraints. Fitted models for the activation energy and the ionic conductivity are as follows: $Q(kJ/moi)=54.8565x_1+144.825x_2+133.846x_3-170.908x_1x_3-334.338x_2x_3$ $log{\sigma}(300K)=-5.00245x_1-1.17876x_2-15.5173x_3+17.4522x_1x_3$. The electrical properties are very sensitive to the ratio of $Li_2O/SiO_2$. The effect of $ZrO_2$ is less than that of this ratio but $ZrO_2$ component attributes to the reduction of the activation energy. The optimal composition for best ionic conduction based on these fitted models is $55Li_2O{\cdot}10ZrO_2{\cdot}35SiO_2$. Its activation energy and ionic conductivity at 300 K are 46.98 kJ/mol and $1.08{\times}10^{-5}{\Omega}^{-1}{\cdot}cm^{-1}$, respectively.

• 청정기술
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• 제22권4호
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• pp.308-315
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• 2016

수명특성이 우수한 실리콘 음극재를 제조하기 위해 졸겔법을 통해 $SiO_x/ZnO$ 복합체를 제조하였고, 제조된 복합체는 PVC를 탄소 전구체로 하여 탄소를 피복하였다. 복합체에 포함된 ZnO를 HCl로 제거하여 내부에 빈 공간을 만들어 충 방전에 따른 실리콘의 부피변화를 완화할 수 있게 하였다. 합성된 복합체의 결정구조와 형상을 파악하기 위해 XRD, SEM, TEM 분석을 실시하였다. 탄소 피복된 복합체에 포함된 탄소함량을 TGA를 통해 알아보았으며, 복합체의 기공구조를 확인하기 위해 BET 비표면적 분석과 BJH 기공분포를 확인하였다. 탄소의 추가로 향상된 전기전도성을 측정하였으며, 전기화학적 특성은 AC 임피던스 측정과 충 방전 및 수명특성을 확인하였다. $SiO_x/ZnO$시료에 탄소를 피복할 경우에 전기전도도가 증가하였으며, 방전용량도 증가하였다. 염산으로 ZnO를 제거한 시료의 경우에 표면적은 증가하였으나, 전지의 방전용량은 오히려 감소하였다. 탄소를 피복하지 않은 $SiO_x/ZnO$ 시료의 경우에 방전용량이 매우 낮았으며, 탄소를 피복한 후의 시료는 높은 충방전용량을 나타내었다. 수명특성의 경우, $C-SiO_x/ZnO$ 복합체(Zn : Si : C = 1 : 1 : 8)가 0.2 C의 전류량에서 50 사이클에서 $815mAh\;g^{-1}$의 용량으로 기존 흑연계 음극재보다 높은 용량을 나타내었다.

• 한국전기전자재료학회논문지
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• 제22권5호
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• pp.415-418
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• 2009

$Zn_{2}SiO_{4}$:Mn green phosphors doped with Mg for PDP were synthesized by solid state reaction method. $Zn_{2}SiO_{4}$:Mn, Mg phosphors with increasing Mg concentration were changed from Rhombohedral to Orthorhombic structure. Photoluminescence intensity of $Zn_{2}SiO_{4}$:Mn phosphors doped with Mg 0.5 mol was definitely higher than that of Mg non-doped sample. The enhanced luminescence with doping Mg in the $Zn_{2}SiO_{4}$:Mn phosphors was interpreted by the increase of energy transfer from host to Mn ions with substitution Mg for Zn in the $Zn_{2}SiO_{4}$:Mn host.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.449-452
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• 1998

We have studied the oxidatio nrte of $Si_{1-x}Ge_{x}$ epitaxial layer grown by MBE(molecular beam epitaxy). Oxidation were performed at 700.deg. C, 800.deg. C, 900.deg. C, and 1000.deg. C. After the oxidation, the results of AES(auger electron spectroscopy) showed that Ge was completely rejected out of the oxide and pile up at $SiO_{2}/$Si_{1-x}Ge_{x}$ interface. It is shown that the presence of Ge at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface changes the dry oxidation rate. The dry oxidation rate was equal to that of pure Si regardless of Ge mole fraction at 700.deg. C and 800.deg.C, while it was decreased at both 900.deg. C and 1000.deg.C as the Ge mole fraction was increased. The ry oxidation rates were reduced for heavy Ge concentration, and large oxidation time. In the parabolic growth region of $Si_{1-x}Ge_{x}$ oxidation, The parabolic rate constant are decreased due to the presence of Ge-rich layer. After the longer oxidation at the 1000.deg.C, AES showed that Ge peak distribution at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface reduced by interdiffusion of silicon and germanium.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.163.2-163.2
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• 2014

We report catalytic decomposition of few-layer graphene on an $Au/SiO_x/Si$ surface wherein oxygen is supplied by dissociation of the native $SiO_x$ layer at a relatively low temperature of $400^{\circ}C$. The detailed chemical evolution of the graphene covered $SiO_x/Si$ surface with and without gold during the catalytic process is investigated using a spatially resolved photoelectron emission method. The oxygen atoms from the native $SiO_x$ layer activate the gold-mediated catalytic decomposition of the entire graphene layer, resulting in the formation of direct contact between the Au and the Si substrate. The notably low contact resistivity found in this system suggests that the catalytic depletion of a $SiO_x$ layer could realize a new way to micromanufacture high-quality electrical contact.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.392-393
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• 2007

PDP용 녹색 $Zn_2SiO_4$:Mn 형광체의 발광특성과 결정성을 향상시키기 위해 co-dopant로 Mg를 첨가한 $(Zn_{1-x}Mg_x)_2SiO_4$:Mn 형광체를 합성하였다. 합성된 형광체의 발광특성을 PL로 조사한 결과, $Zn_2SiO_4$:Mn 형광체는 Mg의 농도에 관계없이 530nm에서 녹색 발광을 하였고, Mg의 농도가 0.5 mol%일 때 가장 높은 발광세기가 나타났다. 이것은 Zn과 이온반경이 비슷한 Mg가 치환되어 모체에서의 Mn으로의 에너지 전이가 증가하여 발광세기가 증가한 것으로 생각된다.