• 제목/요약/키워드: $SiO_2/Si$ interface

검색결과 593건 처리시간 0.039초

ZnO-SnO2 투명박막트랜지스터의 특성에 미치는 산소분압 및 후속열처리의 영향 (The Effects of Oxygen Partial Pressure and Post-annealing on the Properties of ZnO-SnO2 Thin Film Transistors)

  • 마대영
    • 한국전기전자재료학회논문지
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    • 제25권4호
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    • pp.304-308
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    • 2012
  • Transparent thin film transistors (TTFT) were fabricated using the rf magnetron sputtered ZnO-$SnO_2$ films as active layers. A ceramic target whose Zn atomic ratio to Sn is 2:1 was employed for the deposition of ZnO-$SnO_2$ films. To study the post-annealing effects on the properties of TTFT, ZnO-$SnO_2$ films were annealed at $200^{\circ}C$ or $400^{\circ}C$ for 5 min before In deposition for source and drain electrodes. Oxygen was added into chamber during sputtering to raise the resistivity of ZnO-$SnO_2$ films. The effects of oxygen addition on the properties of TTFT were also investigated. 100 nm $Si_3N_4$ film grown on 100 nm $SiO_2$ film was used as gate dielectrics. The mobility, $I_{on}/I_{off}$, interface state density etc. were obtained from the transfer characteristics of ZnO-$SnO_2$ TTFTs.

급속열처리산화법으로 형성시킨 $SiO_2$/나노결정 Si의 전기적 특성 연구 (Electrical properties of metal-oxide-semiconductor structures containing Si nanocrystals fabricated by rapid thermal oxidation process)

  • 김용;박경화;정태훈;박홍준;이재열;최원철;김은규
    • 한국진공학회지
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    • 제10권1호
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    • pp.44-50
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    • 2001
  • 전자빔증착법과 이온빔의 도움을 받는 전자빔 증착법(ion beam assisted electron beam deposition; IBAED)법으로 비정질 Si(-200nm) 박막을 p-Si 기판위에 성장하고 이 두 구조를 급속열처리산화(Rapid Thermal Oxidation; RTO)를 시킴으로서 $SiO_2$/나노결정 Si(nanocrystal Si)/p-Si구조를 형성하였다. 그 후 시료 위에 Au 막을 증착함으로서 최종적으로 나노결정이 함유된 MOS(metal-oxide-semiconductor)구조를 완성하였다. 이 MOS구조내의 나노결정 Si의 전하충전 특성을 바이어스 sweep 비율을 변화시키면서 Capacitance-Voltage(C-V) 특성을 측정하여 조사하였다. 전자빔증착시료의 경우에는 $\DeltaV_{FB}$(flatband voltage shift)가 1V 미만의 작은 C-V 이력곡선이 관측된 반면 IBAED 시료의 경우는 $\DeltaV_{FB}$가 22V(2V/s Voltage Sweep비율) 이상인 대단히 큰 C-V 이력곡선이 관측되었다. 전자빔증착중 Ar ion beam을 조사하면 표면 흡착원자이동이 활성화되고 따라서 비정질 Si내에 Si의 핵 생성율이 증가하여 후속 급속열처리산화공정중 이 높은 농도의 핵들이 나노결정 Si으로 자라나게 되고 이렇게 형성된 높은 농도의 나노결정의 전하 충전 및 방전현상이 큰 이력곡선을 나타내는 원인이라고 생각된다. 따라서 IBAED 방법이 고농도의 나노결정 Si을 형성시키는데 유용한 방법이라고 판단된다.

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Rear Surface Passivation with Al2O3 Layer by Reactive Magnetron Sputtering for High-Efficiency Silicon Solar Cell

  • Moon, Sun-Woo;Kim, Eun-Kyeom;Park, Won-Woong;Jeon, Jun-Hong;Choi, Jin-Young;Kim, Dong-Hwan;Han, Seung-Hee
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.211-211
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    • 2012
  • The electrical loss of the photo-generated carriers is dominated by the recombination at the metal- semiconductor interface. In order to enhance the performance of the solar cells, many studies have been performed on the surface treatment with passivation layer like SiN, SiO2, Al2O3, and a-Si:H. In this work, Al2O3 thin films were investigated to reduce recombination at surface. The Al2O3 thin films have two advantages, such as good passivation properties and back surface field (BSF) effect at rear surface. It is usually deposited by atomic layer deposition (ALD) technique. However, ALD process is a very expensive process and it has rather low deposition rate. In this study, the ICP-assisted reactive magnetron sputtering method was used to deposit Al2O3 thin films. For optimization of the properties of the Al2O3 thin film, various fabrication conditions were controlled, such as ICP RF power, substrate bias voltage and deposition temperature, and argon to oxygen ratio. Chemical states and atomic concentration ratio were analyzed by x-ray photoelectron spectroscopy (XPS). In order to investigate the electrical properties, Al/(Al2O3 or SiO2,/Al2O3)/Si (MIS) devices were fabricated and characterized using the C-V measurement technique (HP 4284A). The detailed characteristics of the Al2O3 passivation thin films manufactured by ICP-assisted reactive magnetron sputtering technique will be shown and discussed.

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$PbTiO_3$ 졸-겔 박막의 특성에 미치는 촉매의 영향 (Effects of Catalysts on Properties of Sol-Gel Derived $PbTiO_3$ Thin Film)

  • 김승현;김창은;정형진;오영제
    • 한국세라믹학회지
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    • 제33권7호
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    • pp.793-801
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    • 1996
  • Sol-gel법으로 제조한 $PbTiO_3$ 세라믹스 박막의 결정화거동, 미세구조 및 유전특성에 있어서 무촉매, 산성촉매 및 염기성촉매가 미치는 영향에 관하여 연구하였다. 열처리온도에 따른 페로브스카이트로의 상전이는 염기성 촉매를 첨가하였을 때가 가장 빨랐으며, 미세구조의 균일성 및 유전특성은 $HNO_3$ 산성촉매를 사용하였을 때가 가장 우수하였다. 그러나, 촉매에 관계없이 $Si_{(100)}$ \ $SiO_2$ \Pt 기판을 사용하였을 때에는 75$0^{\circ}C$ 이상의 고온에서 Pb의 휘발이 급격하게 일어나 제 2상의 생성 및 미세구조가 불균일하게 번화함으로써 물성저하를 피할 수 없었다.

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Effect of Annealed Oxides on the Formation of Inhibition Layer During Hot-Dip Galvanizing of 590Mpa Trip Steel

  • Kim, Seong-Hwan;Huh, Joo-Youl;Lee, Suk-Kyu;Park, Rho-Bum;Kim, Jong-Sang
    • Corrosion Science and Technology
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    • 제10권1호
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    • pp.6-12
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    • 2011
  • The selective surface oxidation of a transformation-induced-plasticity (TRIP) steel containing 1.6 wt.% Mn and 1.5 wt.% Si during annealing at $800^{\circ}C$ was investigated for its influence on the formation of an inhibition layer during hot-dip galvanizing. The selective oxidation of the alloying elements and the oxide morphology were significantly influenced by the annealing atmosphere. The pure $N_{2}$ atmosphere with a dew point $-40^{\circ}C$ promoted the selective oxidation of Mn as a crystalline $Mn_{2}SiO_{4}$ phase, whereas the $N_{2}$ + 10% $H_{2}$ atmosphere with the same dew point $-40^{\circ}C$ promoted the selective oxidation of Si as an amorphous Si-rich oxide phase. During hot-dip galvanizing, the $Mn_{2}SiO_{4}$ phase was reduced more readily by Al in the Zn bath than the Si-rich oxide phase. Consequently, the pure $N_{2}$ atmosphere resulted in a higher formation rate of $Fe_{2}Al_{5}$ particles at the Zn/steel interface and better galvanizability than the $N_{2}$ + 10% $H_{2}$ atmosphere.

Co/Ti(100)Si 이중층을 이용한 에피텍셜 Co 실리사이드의 형성 (Epitaxial Cobalt Silicide Formation using Co/Ti/(100) Si Structure)

  • 권영재;이종무;배대록;강호규
    • 한국재료학회지
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    • 제8권6호
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    • pp.484-492
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    • 1998
  • 단결정 Si기판위의 Co/Ti 이중층으로부터 형성된 Co 실리사이드의 에피텍셜 성장기구에 대하여 조사하였다. 실리사이드화 과정중 Ti원자들이 저온상의 CoSi결정구조의 tetrahedral site들을 미리 점유해 있음으로 인하여, $CoSi_{2}$ 결정구조로 바뀌는 과정에서 Si원자들이 나중에 제위치를 차지하기 어렵게 되는 효과 때문이다. 그리고 Ti중간층은 반응의 초기단계에 Co-Ti-O 삼원계 화합물을 형성하는데, 이 화합물은 실리사이드화 과정중 반응 제어층으로 작용하여 에피텍셜 실리사이드 형성에 중요한 역할을 한다. 최종 열처리 층구조 Ti oxide/Co-Ti-Si/epi/$Cosi_{2}$(100) Si 이었다.

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내부 광전자방출 분광법을 이용한 Pt/HfO2/p-Si Metal-Insulator-Semiconductor 커패시터의 쇼트키 배리어 분석 (Characterization of the Schottky Barrier Height of the Pt/HfO2/p-type Si MIS Capacitor by Internal Photoemission Spectroscopy)

  • 이상연;서형탁
    • 한국재료학회지
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    • 제27권1호
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    • pp.48-52
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    • 2017
  • In this study, we used I-V spectroscopy, photoconductivity (PC) yield and internal photoemission (IPE) yield using IPE spectroscopy to characterize the Schottky barrier heights (SBH) at insulator-semiconductor interfaces of Pt/$HfO_2$/p-type Si metal-insulator-semiconductor (MIS) capacitors. The leakage current characteristics of the MIS capacitor were analyzed according to the J-V and C-V curves. The leakage current behavior of the capacitors, which depends on the applied electric field, can be described using the Poole-Frenkel (P-F) emission, trap assisted tunneling (TAT), and direct tunneling (DT) models. The leakage current transport mechanism is controlled by the trap level energy depth of $HfO_2$. In order to further study the SBH and the electronic tunneling mechanism, the internal photoemission (IPE) yield was measured and analyzed. We obtained the SBH values of the Pt/$HfO_2$/p-type Si for use in Fowler plots in the square and cubic root IPE yield spectra curves. At the Pt/$HfO_2$/p-type Si interface, the SBH difference, which depends on the electrical potential, is related to (1) the work function (WF) difference and between the Pt and p-type Si and (2) the sub-gap defect state features (density and energy) in the given dielectric.

DLTS 법(法)에 의한 Laser CVD SiON 막(膜)-Si 계(系)의 계면(界面) 특성(特性) (Laser CVD SiON-Si interface investigation by DLTS)

  • 천영일;김상욱;이승환;박지순;박근영;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1991년도 추계학술대회 논문집 학회본부
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    • pp.237-240
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    • 1991
  • In this paper, silicon oxynitride(SiON) films were chemically deposited by 193 nm Excimer laser irradiated parallel to the substrate. the laser pulse energy was 80 mJ, repetetion rate was 80 Hz and the laser average power was 6.4 watt, the gas ratio of $N_2O/NH_3$ was 0.75, the substrate temperature was $300^{\circ}C$, and the chamber pressure was 2 torr. And then, the interface state density($N_{ss}$) was characterized by DLTS(Deep Level Transient Spectroscopy). In addition, the capture cross section($\sigma$) and activation energy(${\Delta}E$) was also obtained. The resulting Nss values were $5.5{\times}10^{10}-3.2{\times}10^{11}(eV^{-1}cm^{-2})$, $\sigma$ was $6.64{\times}10^{-20}-2.114{\times}10^{-17}(cm^2)$, the ${\Delta}E$ of two peaks were $8.93{\times}10^{-2}$(eV), 0.375(eV).

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