• Title/Summary/Keyword: $ReO_4^{-}$

Search Result 352, Processing Time 0.024 seconds

Photoluminescence Properties of CaAl2O4:RE3+(RE = Tb, Dy) Phosphors (CaAl2O4:RE3+(RE = Tb, Dy) 형광체의 발광 특성)

  • Cho, Shinho
    • Korean Journal of Materials Research
    • /
    • v.26 no.3
    • /
    • pp.143-148
    • /
    • 2016
  • $CaAl_2O_4:RE^{3+}$(RE = Tb or Dy) phosphor powders were synthesized with different contents of activator ions $Tb^{3+}$ and $Dy^{3+}$ by using the solid-state reaction method. The effects of the content of activator ions on the crystal structure, morphology, and emission and excitation properties of the resulting phosphor particles were investigated. XRD patterns showed that all the synthesized phosphors had a monoclinic system with a main (220) diffraction peak, irrespective of the content and type of $Tb^{3+}$ and $Dy^{3+}$ ions. For the $Tb^{3+}$-doped $CaAl_2O_4$ phosphor powders, the excitation spectra consisted of one broad band centered at 271 nm in the range of 220-320 nm and several weak peaks; the main emission band showed a strong green band at 552 nm that originated from the $^5D_4{\rightarrow}^7F_5$ transition of $Tb^{3+}$ ions. For the $Dy^{3+}$-doped $CaAl_2O_4$ phosphor, the emission spectra under ultraviolet excitation at 298 nm exhibited one strong yellow band centered at 581 nm and two weak bands at 488 and 672 nm. Concentration-dependent quenching was observed at 0.05 mol of $Tb^{3+}$ and $Dy^{3+}$ contents in the $CaAl_2O_4$ host lattice.

Improved Uniformity of Resistive Switching Characteristics in Ag/HfO2/Pt ReRAM Device by Microwave Irradiation Treatment (Microwave Irradiation 처리를 통한 Ag/HfO2/Pt ReRAM에서의 메모리 신뢰성 향상에 대한 연구)

  • Kim, Jang-Han;Nam, Ki-Hyun;Chung, Hong-Bay
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.27 no.2
    • /
    • pp.81-84
    • /
    • 2014
  • The bipolar resistive switching characteristics of resistive random access memory (ReRAM) based on $HfO_2$ thin films have been demonstrated by using Ag/$HfO_2$/Pt structured ReRAM device. MIcrowave irradiation (MWI) treatment at low temperature was employed in device fabrication with $HfO_2$ thin films as a transition layer. Compared to the as-deposited Ag/$HfO_2$/Pt device, highly improved uniformity characteristics of resistance values and operating voltages were obtained from the MWI treatment Ag/$HfO_2$/Pt ReRAM device. In addition, a stable DC endurance (> 100 cycles) and a high data retention (> $10^4$ sec) were achieved.

High Temperature Oxidation of NiCoCrAlY-(Ta, Re, Ir) Coatings for Gas Turbines (가스터빈 엔진부품용 NiCoCrAlY-(Ta, Re, Ir) 코팅의 고온산화특성)

  • Choi, J.H.;Lee, D.B.
    • Journal of the Korean institute of surface engineering
    • /
    • v.39 no.3
    • /
    • pp.129-136
    • /
    • 2006
  • The high velocity oxy-fuel sprayed coatings of 38Ni-23Co-20Cr-11Al-3Y-5Ta, 25Ni-34Co-20Cr-11Al-3Y-2Re and 32Ni-34.5Co-22Cr-11Al-0.5Ir (in wt%) were oxidized at 1000 and $1100^{\circ}C$ in air in order to find the alloying effect of Ta, Re and Ir on the oxidation properties of the NiCoCrAlY-base coatings. The primary phase of the coatings was $Ni_3Al$. The oxides formed on the coatings consisted primarily of ${\alpha}-Al_2O_3$, together with some $CoCr_2O_4,\;CoAl_2O_4$, and $Al_5Y_3O_{12}$. Tantalum oxidized to $Ta_2O_5$ and $Ta_2O_{22}$. However, no oxides of Re and Ir were detected by XRD owing to their thermodynamic inertness and/or their small amount.

Reduce of Etching Damage of PZT Thin Firms with Addition of Ar and O2 in Cl2/CF4 Plasma (Cl2/CF4 플라즈마에 Ar, O2 첨가에 따른 PZT 박막의 식각 손상 개선 효과)

  • 강명구;김경태;김창일
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.15 no.4
    • /
    • pp.319-324
    • /
    • 2002
  • In this study, the reduce of plasma etching damage in PZT thin film with addictive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of $Cl_2/CF_4$ with addition of Ar and $O_2$ with inductively coupled plasma. The etch rates of PZT thin films were 1450 ${\AA}/min$ at 30% additive Ar and 1100 ${\AA}/min$ at 10% auditive $O_2$ into $Cl_2/CF_4$ gas mixing ratio of 8/2. In order to reduce plasma damage of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures at $O_2$ atmosphere. From the hysteresis curries, the ferroelectric properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed PZT films is consistent wish the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x ray photoelectron spectroscopy (XPS) analysis, the intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of $Ti_xO_y$ is recovered by $O_2$ recombination during rapid thermal annealing process.

The Piezoelectrc properties of (Na,K)$NbO_3$-system Pb-free Piezoelectric Ceramics with $Bi_2O_3$ Addition ($Bi_2O_3$ 첨가에 따른 (Na,K,Li)$NbO_3$계 무연 압전 세라믹스의 압전특성)

  • Ryu, Sung-Lim;Lee, Ho-Il;Bae, Se-Hwan;Kim, Ju-Hyun;Kim, Yong-Ju;Seo, Sang-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2005.11a
    • /
    • pp.216-217
    • /
    • 2005
  • In this paper, in order to develop Pb-free piezoelectric ceramics, $(Li_{0.05}Na_{0.57}K_{0.38})NbO_3$ ceramic was fabricated with the variation of $Bi_2O_3$ addition. Piezoelectric properties of the ceramic were varied with the amount of $Bi_2O_3$ addition and showed the maximum kp value at.0.2 wt% $Bi_2O_3$ addition. Qm of $Bi_2O_3$ added ceramics showed lower values than the non-added ceramics, however, the kp was increased by the addition of $Bi_2O_3$ up to 0.2 wt%. At the sintering temperature of 1110$^{\circ}C$ and the calcination temperature of 850$^{\circ}C$, the optimal values of density=4.52g/$cm^3$, kp=0.47, $\varepsilon_r$=400 were obtained.

  • PDF

Effect of Sintering Temperature on the Properties of $CaSiO_4:RE^{3+}$(RE=Eu, Sm, Tb, Dy, Ce) Phosphors

  • Go, Bong-Jin;Jo, Min-Jeong;Jo, Sin-Ho
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.08a
    • /
    • pp.173-173
    • /
    • 2013
  • 최근에 고효율의 형광체를 개발하고자 무기물 모체에 주입된 희토류 이온의 발광에 대한 연구가 급부상하고 있다. 형광체는 고휘도, 넓은 시청 각도와 저 비용으로 인하여 대형 평판 디스플레이 분야로 그 응용성을 확장하는 플라즈마 디스플레이 패널 제작에 있어서 매우 중요한 물질이다. 현재 적색 형광체로 널리 사용되고 있는 발광 물질은 YBO3:Eu3+ 혹은 (Y,Gd)BO3:Eu3+ 형광체이지만, Eu3+ 이온이 중심대칭의 자리에 위치하기 때문에, Eu3+ 이온의 5D07F1 전이에 의한 주황색의 발광 세기가 5D07F2 전이에 의한 적색의 세기보다 강하여 고품질의 색상을 구현하는데 상당한 어려움이 있다. 이러한 문제점을 해결하기 위하여 새로운 모체 격자를 갖는 적색, 녹색, 청색 형광체 개발에 많은 노력이 집중되고 있다. 본 연구에서는 형광체 합성시 중요한 변수의 하나인 소결 온도가 새로운 다양한 색을 방출하는 형광체 분말 CaSiO4:RE3+ (RE=Eu, Sm, Tb, Dy, Ce)의 특성에 미치는 영향을 조사하였다. CaSiO4:RE3+ (RE=Eu, Sm, Tb, Dy, Ce) 형광체 분말 시료는 초기 물질 CaO (99.99%), SiO2 (99.99%), Eu2O3 (99.99%), Sm2O3 (99.9%), Tb4O7 (99.9%), Dy2O3 (99.9%), CeO2 (99.9%)을 화학적량으로 준비하였다. 볼밀, 건조 작업을 한 후에, 시료를 막자사발에 넣고 분쇄하여 3시간의 하소 공정과 5시간의 소결 공정을 수행하였다. 이때 소결 온도를 변수로 선택하여 각각 $800^{\circ}C$, $900^{\circ}C$, $1,000^{\circ}C$, $1,100^{\circ}C$에서 소결 작업을 수행하여 합성 분말의 구조, 표면, 광학적 특성을 측정하여 소결 온도가 미치는 영향을 조사하였다. Eu3+가 도핑된 CaSiO4 형광체 분말의 경우에, 발광 스펙트럼은 597, 618, 655, 707 nm에서 관측되었으며, 소결 온도가 $800^{\circ}C$에서 $1,100^{\circ}C$로 증가함에 따라 모든 발광 스펙트럼의 세기는 순차적으로 증가함을 나타내었다. Tb3+가 도핑된 CaSiO4 형광체 분말의 경우에 관측된 발광 스펙트럼은 주 피크인 549 nm를 중심으로 하여 세기가 상대적으로 작은 493, 592, 626 nm의 피크들이 관측되었으며, 소결 온도가 증가함에 따라 전반적으로 발광 세기들이 증가하는 경향을 나타내었다. Sm3+가 도핑된 CaSiO4 형광체의 경우에, 발광 스펙트럼은 전형적인 Sm3+이온에 의한 전이 신호들이 605, 570, 653 nm에서 나타났다. 발광 스펙트럼의 세기는 소결 온도에 비례하여 증가하였다. Ce3+가 도핑된 경우에 발광 스펙트럼은 소결 온도에 관계없이 401 nm에서 관측되었으며, 소결 온도에 따라 발광 세기의 변화가 나타났다. 이 실험 결과로 부터, 합성시 적절한 소결 온도의 선택이 고발광 효율의 형광체를 제작하는데 있어서 매우 중요한 요소가 됨을 확인할 수 있었다.

  • PDF

Reduce of Etching Damage of PZT Thin Films in $Cl_2/CF_4$ Plasma with addition of Ar and $O_2$ ($Cl_2/CF_4$ 플라즈마 Ar, $O_2$ 첨가에 따른 PZT 막막의 식각 손상 효과)

  • Kang, Myoung-Gu;Kim, Kyoung-Tae;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2001.11b
    • /
    • pp.21-25
    • /
    • 2001
  • In this study, recovery of plasma etching· damage in PZT thin film with additive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of $Cl_2/CF_4$ with addition of Ar and $O_2$ with inductively induced plasma. The etch rates of PZT thin films were 1450 $\AA$/min at 30% additive Ar into $(Cl_2(80%)+CF_4 (20%))$ and 1100 $\AA$/min at 10% additive $O_2$ into $C(Cl_2(80%)+CF_4(20%))$. In order to recovery properties of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures in at $O_2$ atmosphere. From the hysteresis curves, ferroelectrical properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed sample is consistent with the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x-ray photoelectron spectroscopy (XPS) analysis, intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of $Ti_xO_y$ is recovered by $O_2$ recombination during rapid thermal annealing process.

  • PDF

Reduce of Etching Damage of PZT Thiin Films in $Cl_{2}/CF_{4}$ Plasma with addition of Ar and $O_2$ ($Cl_{2}/CF_{4}$ 플라즈마에 Ar,$O_2$첨가에 따른 PZT 박막의 식각 손상 효과)

  • 강명구;김경태;김창일
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2001.11a
    • /
    • pp.21-25
    • /
    • 2001
  • In this study, recovery of plasma etching damage in PZT thin film with additive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of Cl$_2$/CF$_4$ with addition of Ar and $O_2$ with inductively induced plasma. The etch rates of PZT thin films were 1450$\AA$/min at 30% additive Ar into (Cl$_2$(80%)+CF$_4$ (20%)) and 1100$\AA$/min at 10% additive $O_2$ into C(Cl$_2$(80%)+CF$_4$ (20%)). In order to recovery properties of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures in at $O_2$ atmosphere. From the hysteresis curves, ferroelectrical properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed sample is consistent with the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x-ray photoelectron spectroscopy (XPS) analysis, intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of Ti$_{x}$O$_{y}$ is recovered by $O_2$ recombination during rapid thermal annealing process.s.s.

  • PDF

Effect of Carrier on Labeling and Biodistribution of Re-188-Hydroxyethylidene diphosphonate (담체가 Re-188-Hydroxyethylidene Diphosphonate의 표지와 생체내분포에 미치는 영향)

  • Chang, Young-Soo;Jeong, Jae-Min;Kim, Bo-Kwang;Cho, Jung-Hyuk;Lee, Dong-Soo;Chung, June-Key;Lee, Seung-Jin;Jin, Ren-Jie;Lee, Sang-Eun;Lee, Myung-Chul
    • The Korean Journal of Nuclear Medicine
    • /
    • v.34 no.4
    • /
    • pp.344-352
    • /
    • 2000
  • Purpose: Re-188-Hydroxyethylidene diphosphonate (HEDP) is a new cost-effective agent for systemic radioisotope therapy of metastatic bone pain. We investigated the influence of carrier for labeling and biodistribution of Re-188-HEDP using HEDP kit with or without carrier ($KReO_4$). Materials and Methods: The kits (HEDP 15 mg, gentisic acid 4 mg and $SnCl_2.2H_2O_2$ 4.5 mg) with or without carrier ($KReO_4$ 0.1 mg) were labeled with Re-188 solution, made available from an in-house generator by boiling for 15 min. We compared the labeling efficiency and stability of carrier-added and carrier-free preparations of Re-188-HEDP Biodistribution and imaging studies of each preparation were performed in ICR mice ($1.85{\sim}3.7MBq/0.1ml$) and SD rats ($74.1{\sim}85.2MBq/0.5ml$). Results: The carrier-added preparation showed high labeling efficiency (95% at pH 5) and high stability in serum (88%, 3 hr). However, the carrier-free preparation showed low labeling efficiency (59% at pH 5) and low stability (43%, 3 hr). The carrier-added preparation showed high uptake in bone and low uptake in stomach and kidneys. However, the carrier-free preparation showed lower uptake in bone and higher uptake in both stomach and kidneys, which is supposed to be due to released perrhenate. The carrier-added preparation also showed better images with higher skeletal accumulation, lower uptake in other organs and lower soft tissue uptake than the carrier-free preparation. Conclusion: The results of these studies clearly demonstrate that addition of carrier perrhenate is required for high labeling efficiency, stability, bone uptake and good image quality of Re-188-HEDP.

  • PDF