• Journal of the Semiconductor & Display Technology
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• v.2 no.2
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• pp.5-8
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• 2003

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and $SiO_2$ by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and NH$_3$ as precursors. The TaN films were deposited at $250^{\circ}C$ by both method. The growth rates of TaN films were 0.8${\AA}$/cycle for PAALD and 0.75${\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w -1.8:0.12 mm but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was 11g/cmand one for thermal ALD TaN was 8.3g/$cm^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200 nm)/TaN(10 nm)/$SiO_2$(85 nm)/ Si structure was shown at temperature above $700^{\circ}C$ by XRD, Cu etch pit analysis.

• Resources Recycling
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• v.12 no.2
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• pp.54-61
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• 2003

In this paper a system of plasma ignition(SPI) which is applied for the ignition and stabilization of coal-dust fuel burning for decreasing fuel black oil consumption is described. The advantages of SPI are demonstrated, and the positive results of SPI which is operated at the thermal-clamping boilers installed in production and heating plants are described. The similar system was tested in demonstration and industrial installations to confirm the results. The improvement of economical, operating and ecological performances of the boiler are shown.

• 한국연소학회:학술대회논문집
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• 2014.11a
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• pp.195-198
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• 2014

$Fuel/N_2$ and fuel/air mixtures were treated with non-thermal DBD plasma and the changes in characteristics of laminar diffusion flame have been observed. Flame of $Fuel/N_2$ mixture generated more soot under plasma condition while less amount of soot was formed from fuel/air mixture flame. Luminescence spectrum and gas chromatography results confirmed that plasma energy converts a fraction of fuel molecules into radicals, which then form $C_2$, $C_3$, $C_4$ and higher hydrocarbon under no oxygen condition or turn into CO, $CO_2$ and $H_2O$ when oxygen is present.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.326-329
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• 2002

In this paper, we investigated a feasibility of cerium oxide(CeO$_2$) films as a buffer layer of MFIS(metal ferroelectric insulator semiconductor) type capacitor. CeO$_2$ layer were Prepared by two step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By app1ying an ultra thin Ce metal seed layer and N$_2$ Plasma treatment, dielectric and interface properties were improved. It means that unwanted SiO$_2$ layer generation was successfully suppressed at the interface between He buffer layer and Si substrate. The lowest lattice mismatch of CeO$_2$ film was as low as 1.76% and average surface roughness was less than 0.7 m. The Al/CeO$_2$/Si structure shows breakdown electric field of 1.2 MV/cm, dielectric constant of more than 15.1 and interface state densities as low as 1.84${\times}$10$\^$11/ cm$\^$-1/eV$\^$-1/. After N$_2$ plasma treatment, the leakage current was reduced with about 2-order.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.12
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• pp.68-74
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• 1998

Improved performance and suppressed short-channel effects of polysilicon thin film transistors (poly-Si TFTs) with very thin electron cyclotron resonance (ECR) $N_2$O-plasma gate oxide have been investigated. Poly-Si TFTs with ECR $N_2$O-plasma oxide ($N_2$O-TFTs) show better performance as well as suppressed short-channel effects than those with conventional thermal oxide. The fabricated $N_2$O-TFTs do not show threshold voltage reduction until the gate length is reduced to 3 ${\mu}{\textrm}{m}$ for n-channel and 1 ${\mu}{\textrm}{m}$ for p-channel, respectively. The improvements are due to the smooth interface, passivation effects, and strong Si ≡ N bonds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.215-219
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• 2004

This paper is investigated about the effect of carrier gas and humidity for generating hydrogen gas. In the experimental result of generating hydrogen gas by non-thermal plasma reactor, the rate of generating hydrogen gas is different with what kind of carrier gas is. We used two types of carrier gas, such as $N_2$ and He. $N_2$ as carrier gas is more efficient to generate hydrogen gas than He because $N_2$ is reacted with $O_2$, which is made from water dissociation. In comparison with no humidity and humidity 45[%], the generation of hydrogen gas is decreased with increasing the humidity. That is the result that the energy for water dissociation is reduced on water surface because a part of plasma energy is absorbed at the small particle produced from humidifier.

• Journal of dental hygiene science
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• v.14 no.1
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• pp.1-6
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• 2014

The purpose of this study was to investigate the killing effect of Candida albicans on hairless mouse-2 (HRM-2) mouse tissues. We tested the effectiveness of a non-thermal atmospheric pressure plasma in killing C. albicans strains. The viability of C. albicans was determined by counting the colony forming units (CFU), after non-thermal atmospheric pressure plasma treatment. When non-thermal atmospheric pressure plasma was repeatedly treated on mouse skin which inoculated with C. albicans. The C. albicans cells were planted on skin tissue, and then the infected mouse tissue was exposed to non-thermal atmospheric pressure plasma for 0 sec, 60 sec, 180 sec and 300 sec. The death rate of C. albicans was increased in dependent with treatment times. The three times of non-thermal atmospheric pressure plasma at the interval of 10 minutes significantly showed the 6 log CFU/ml reduction of death rate on HRM-2 mouse tissues. Thus, non-thermal atmospheric pressure plasma could be used for the disinfection of C. albicans on oral surface.

• Composites Research
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• v.36 no.2
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• pp.101-107
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• 2023

In this study, aluminum nitride (AlN) reinforced aluminum (Al) matrix composites are fabricated via plasma arc melting under a nitrogen atmosphere. Within a minute of the chemical reaction between Al and N, dispersed AlN with the shape of transient and lamellar layers is in situ formed in the Al matrix. The composite contains 10 vol.% AlN reinforcements with low thermal resistance and strong bonding at the interfaces, which leads to the unique combination of thermal expansivity and conductivity in the resulting composites. The coefficient of thermal expansion of the composite can be further reduced when Si was alloyed into the Al matrix, which proposes the potential of the in situ Al matrix composites for thermal management applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.912-916
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• 2002

In this paper, the $CF_4$ decomposition rate and by-product were investigated for a simulated two plasma reactors which are metal particle reactor and spiral wire reactor as function of mixed gases. The $CF_4$ decomposition rate by plasma reactor with metal particle electrode had a gain of 20~25[%] over that by plasma reactor with spiral wire electrode. The $CF_4$ decomposition efficiency increases with increasing applied voltage up to the critical voltage for spark formation. The $CF_4$ decomposition efficiency of metal particle reactor was about 80[%] at AC 24[kV]. The $CF_4$ decomposition rate used $Ar-N_2$ as base gas was the highest among three base gases of $N_2$, $Ar-N_2$, air. The by-products of the $N_2$, $Ar-N_2$ base as were similar, but in case of air base they were different.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.14-19
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• 2002

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and SiO2 by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and $NH_3$ as precursors. The TaN films were deposited on $250^{\circ}$C by both method. The growth rates of TaN films were $0.8{\AA}$/cycle for PAALD and $0.75{\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w - $1.8 : 0.12 \mu\textrm{m}$ but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was $11g/\textrm{cm}^3$ and one for thermal ALD TaN was $8.3g/\textrm{cm}^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200nm)/TaN(l0nm)/$SiO_2(85nm)$/Si structure was shown at temperature above $700^{\circ}$C by XRD, Cu etch pit analysis.