• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.27-31
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• 2006

We reported the grain growth of pentacone on $HfO_2$ film depending on OTS treatment. The hydrophilic $HfO_2$ thin film was changed into hydrophobic with less interface energy by OTS treatment. The grain size of pentacene on OTS/$HfO_2$ film was increased from 50 nm to 90 nm with the variation of surface energy and the structure was maintained 3-dimensional island structure. Pentacene on OTS/$HfO_2$ surface was directionally arrayed due to appearance of the only thin film phase without bulk phase by OTS treatment.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.141-141
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• 2012

X-선 반사율 측정법(XRR)은 비파괴적인 측정방법과 수 nm의 두께를 정밀하게 측정할 수 있는 장점으로 인하여 반도체 산업현장에서 많은 관심과 연구가 이루어지고 있다. 이러한 XRR은 두께 분석 측정의 정밀도를 향상시키고 부정확한 결과를 방지하기 위하여 측정기기를 검증하고 보정할 수 있는 두께 표준물질을 필요로 하고 있다. 본 연구에서는 XRR용 두께 표준물질을 이온빔 스퍼터링 증착방법을 이용하여 제작하였다. 두께 표준물질 제작에 있어 공기 중 노출에 의해 산화가 되지 않는 산화물 박막과 산화물 기판을 선택하였다. 후보물질은 glass, sapphire, quartz, SiO2기판과 HfO2, Ta2O5, Cr2O3 산화물 타켓을 이용하여 박막을 제작하였다. 제작된 후 보물질은 교정된 XRR을 통하여 박막의 두께, 계면 및 표면 거칠기, 밀도등 박막의 구조특성분석을 하였다. Glass, quartz의 경우 기판 표면 거칠기가 좋지 않아 제작된 샘플의 X-선 반사율 곡선이 급격히 떨어지면서 측정되는 각도의 영역이 작아졌다. Sapphire로 제작한 시편은 측정된 데이터와 simulation의 curve fitting이 양호하지 않았다. 이 중 SiO2기판을 사용하고 HfO2박막을 증착한 샘플이 다른 후보물질보다 XRR curve fitting 결과가 가장 양호하여 두께 표준물질로 응용하기에 적절하였다. 그리고 AFM (Atomic Force MicroScope)을 이용하여 기판의 거칠기 및 증착한 박막표면 거칠기 측정을 하였고, TEM (Transmission Electron Microscope)으로 두께 측정을 하여 XRR로 얻은 데이터와 비교하였다. 이러한 결과를 토대로 XRR용 두께 표준물질 제작할 수 있었고, 추후 불확도 평가 및 비교실험을 통하여 제작된 XRR용 두께 표준물질을 이용할 수 있을 것으로 기대된다.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.162-162
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• 2012

Sub 100 nm의 Complementary Metal-Oxide-Semiconductor (CMOS) 소자를 구동하기 위해서는 2.0 nm 이하의 $SiO_2$ oxide에 해당하는 전기적 특성이 요구된다. 그러나 2.0 nm 이하의 $SiO_2$에서는 누설 전류가 너무 크기 때문에 이를 대체하기 위해서 유전 상수 (dielectric permittivity)가 높은 $HfO_2$ (${\varepsilon}=25$), $Al_2O_3$, $HfO_2/Al_2O_3$ laminate 등의 high-k dielectric 물질들이 연구되고 있다[1]. High-k dielectric 물질의 전기적 특성은 박막 조성, 두께 및 전극과의 계면에 생성되는 계면 층이나 불순물(Impurity) 거동에 크게 의존하므로 High-k dielectric/전극(Metal or Si) 구조에서 조성 및 불순물의 거동에 대한 정확한 평가가 주요 쟁점으로 부각되고 있다. 이를 평가하기 위해 일반적으로 $Ar^+$ ion에 의한 depth profiling 분석이 진행되나 Oxygen 원자의 선택적 식각에 기인된 분석 깊이 분해능(Depth Resolution) 왜곡으로 계면 층의 형성이나 불순물의 거동을 정확하게 평가할 수 없다. 이러한 예로는 $Ta_2O_5$ 및 $SrBi_2Ta_2O_9$와 같은 다 성분 계 산화막에 $Ar^+$ ion 주사 시 발생하는 선택적인 식각(Preferential Sputtering) 때문에 박막의 실제 조성 및 거동을 평가하는 것은 어렵다고 보고된 바 있다[2,3]. 본 연구에서는 $90{\AA}$인 적층 $Hf_xO_y/Al_xO_y/Hf_xO_y$ 구조에서의 불순물 거동 분석 능력 확보 상 주요 인자인 깊이 분해능 개선을 Secondary Ion Mass Spectroscopy(SIMS)의 primary ion 종, impact energy 및 주사 각도를 변화시켜 ~1 nm 수준까지 구현하였다. 이러한 분석 깊이 분해능의 개선은 Low Impact Energy, 입사 이온의 glancing angle 및 Cluster ion 적용에 의존하며 이들 요인의 효과에 대해 비교/고찰하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.382-382
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• 2010

The etch characteristics of the $HfAlO_3$ thin films and selectivity of $HfAlO_3$ to $SiO_2$ in $Cl_2/BCl_3$/Ar plasma were investigated in this work. The maximum etch rate was 108.7 nm/min and selectivity of $HfAlO_3$ to $SiO_2$ was 1.11 at $Cl_2$(3sccm)/$BCl_3$(4sccm)/Ar(16sccm), RF power of 500 W, DC-bias voltage of - 100 V, process pressure of 1 Pa and substrate temperature of $40^{\circ}C$. As increasing RF power and DC-bias voltage, etch rates of the $HfAlO_3$ thin films increased. Whereas as decreasing of the process pressure, those of the $HfAlO_3$ thin films were increased. The chemical reaction on the surface of the etched the $HfAlO_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS).

• Journal of the Korean Magnetics Society
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• v.3 no.1
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• pp.23-28
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• 1993

Thin films of soft magnetic Fe-Hf-C alloys with nanoscale crystallites were investigated in this study. The films were fabricated by an RF diode magnetron sputtering apparatus and subsequently annealed in vacuum. The soft magnetic properties of the films were observed to differ depending on the different substrates such as Corning 7059, $CaTiO_3$ and $Al_2O_3-TiC$ with various underlayer(Cr, $SiO_2$) thickness. This results may be due to the interdiffusion between the substrate and the magnetic layer and/or between the underlayer and the magnetic layer, rather than the microstructural change such as grain size. The Fe-Hf-C films with high permeability up to 4000(at 1 MHz) and saturation magnetization up to 16 kG were obtained in the vicinity of phase boundary between the crystalline and amorphous state when the size of ${\alpha}-Fe$ grains is about 5 nm. And also the films were found to have thermal stability up to $600^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.821-825
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• 2013

Effect of multi-stacked layer (MSL), 0.1 mol (M) and 0.3 mol (M) hafnium oxide ($HfO_2$) alignment layers were fabricated via a solution-process for LCs orientation. The solutions were spin-coated and annealed in a furnace. MSL consists of three sub-layers using 0.1 M solution, mono-layer (ML) is composed of 0.3 M $HfO_2$ solution. Then ion-beam irradiation was treated with 1.8 keV for 2 min. $HfO_2$-based LC cells were investigated through photographs, pre-tilt angle using crystal rotation method, X-ray photoelectron spectroscopy (XPS) measurement, and surface roughness using atomic force microscopy(AFM) for their characteristic research. Good LC orientation characteristics were observed on MSL $HfO_2$ surface. The LC alignment mechanism on MSL $HfO_2$ and ML $HfO_2$ surfaces was attributed to van der Waals (VDW) interaction between the LC molecular and substrate surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.8-9
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• 2006

Hafnium oxide ($HfO_2$) thin films were deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$. Prior to the deposition of $HfO_2$ films, a thin Hf ($10\;{\AA}$) metal layer was deposited. Deposition temperature of $HfO_2$ thin film was $350^{\circ}C$ and its thickness was $150\;{\AA}$. Samples were then annealed using furnace heating to temperature ranges from 500 to $900^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Thermally evaporated $3000\;{\AA}$-thick AI was used as top electrode. In this work, We study the interface characterization of $HfO_2$/Hf/Si MOS capacitor depending on annealing temperature. Through AES(Auger Electron Spectroscopy), capacitance-voltage (C-V) and current-voltage (I-V) analysis, the role of Hf layer for the better $HfO_2$/Si interface property was investigated. We found that Hf meta1 layer in our structure effective1y suppressed the generation of interfacial $SiO_2$ layer between $HfO_2$ film and silicon substrate.

• Clean Technology
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• v.18 no.3
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• pp.280-286
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• 2012

The dry etching of sacrificial $SiO_2$ was performed in supercritical carbon dioxide. The etching of boron phosphor silica glass (BPSG), tetraethyl orthosilicate (TEOS), thermal $SiO_2$, and Si-nitride (SiN) was investigated by using a two chamber system with HF/py etchant and alcohol additives. The etch rate of sacrificial $SiO_2$ increased upon the addition of methanol. The etch selectivity of BPSG with respect to SiN was highest with IPA although the highest etch rate was resulted from methanol except BPSG. The etch rate increased with the temperature in HF/py/MeOH system. Especially the increase of the etch rate was much higher for BPSG with an increase in the reaction temperature. The etch residue was not reduced apparently upon the addition of alcohol cosolvents to HF/py. While the etch rate in HF/$H_2O$ was higher than HF/py/alcohol system, the rate decreased with the addition of alcohols to HF/$H_2O$. The cantilever beam structure of high aspect ratios was released by the dry ething in supercritical carbon dioxide without damage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.48-48
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• 2009

최근 빠른 동작속도와 고 집적도를 얻기 위해 metal oxide semiconductor field effect transistor (MOSFET) 의 크기는 계속 해서 줄어들고 있다. 동시에 게이트의 절연층도 얇아지게 된다. 절연층으로 사용되는 $SiO_2$ 의 두께가 2nm 이하로 얇아 지게 되면 터널링에 의해 누설 전류가 발생하게 된다. 이 문제를 해결하기 위해 $SiO_2$ 를 대체할 고유전체 물질의 연구가 활발하다. 고유전체 물질 중에는 $ZrO_2,\;Al_2O_3,\;HfO_2$ 등이 많이 연구 되어 왔다. 하지만 유전상수 이외에 band gap energy, thermodynamic stability, recrystallization temperature 등의 특성이 좋지 않아 대체 물질로 문제점이 있다. 이를 보안하기 위해 산화물을 합금과 결합시키면 서로의 장점들이 합쳐져 기준들을 만족하는 물질을 만들 수 있고 $HfAlO_3$가 그 중 하나이다. Al를 첨가하는 이유는 문턱전압을 낮추기 위해서다. $HfAlO_3$는 유전상수 18.2, band gap energy 6.5 eV, recrystallization temperature 800 $^{\circ}C$이고 열역학적 특성이 안정적이다. 게이트 절연층은 전극과 기판사이에 적층구조를 이루고 있어 이방성인 드라이 에칭이 필요하고 공정 중 마스크물질과의 선택비가 높아야한다. 본 연구는 $HfAlO_3$박막을 $BCl_3/Ar,\;N_2/BCl_3/Ar$ 유도결합 플라즈마를 이용해 식각했다. 베이스 조건은 RF Power 500 W, DC-bias -100 V, 공정압력 15 mTorr, 기판온도 40 $^{\circ}C$ 이다. 가스비율, RF Power, DC-bias, 공정 압력에 의한 마스크물질과 의 선택비를 알아보았다.