• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.1-5
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• 2012

Al doped ZnO (AZO) thin film was deposited by using Facing Target Sputtering (FTS) system. This work examined the properties of AZO thin film as a function of the substrate temperature. The sputtering targets were 4 inch diameter disks of AZO (ZnO : $Al_2O_3$ = 98 : 2 wt.% ). The properties of electrical, structural and optical were investigated by 4-point probe, Hall effect measurement, x-ray diffractometer (XRD), field-emitting scanning electron microscopy (FE-SEM), and UV/VIS spectrometer. The lowest resistivity of films was $5.67{\times}10^{-4}{\Omega}.cm$ and the average optical transmittance of the films was above 85% in the visible range.

• Journal of Integrative Natural Science
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• v.4 no.4
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• pp.294-297
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• 2011

Quality of PEDOT electrode thin film vapor phase-polymerized on 3-aminopropyltriethoxysilane (APS) self-assembled monolayer (SAM) is very crucial for making an ohmic contact between electrode and semiconductor layer of an organic transistor. In order to improve the quality of PEDOT film, the quality of APS-SAM laying underneath the film must be in the best condition. In this study, in order to improve the quality of APS-SAM, the monolayer was self-assembled on $SiO_2$ surface by a dip-coating method under strictly controlled relative humidity (< 18%RH). The quality of APS-SAM and PEDOT thin film were investigated with a contact angle analyzer, AFM, FE-SEM, and four-point probe. The investigation showed that a PEDOT film grown on the humidity-controlled SAM is very smooth and compact (sheet resistivity = 20.2 Ohm/sq) while a film grown under the uncontrolled condition is nearly amorphous and contains quite many pores (sheet resistivity = 200 Ohm/sq). Therefore, this study clearly proves that a highly improved quality of APSSAM can offer a highly conductive PEDOT electrode thin film on it.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.7
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• pp.575-580
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• 2007

A 16 Mb 1T1C FeRAM device was integrated with BLT capacitors. But a lot of cells were failed randomly during the measuring the bit-line signal distribution of each cell. The reason was revealed that the grain size and orientation of the BLT thin film were severely non-uniform. And the grain size and orientation were severely affected by the process conditions of post heat treatment, especially nucleation step. The optimized annealing temperature at the nucleation step was $560^{\circ}C$. The microstructure of the BLT thin film was also varied by the annealing time at the step. The longer process time showed the finer grain size. Therefore, the uniformity of the grain size and orientation could be improved by changing the process conditions of the nucleation step. The FeRAM device without random bit-fail cell was successfully fabricated with the optimized BLT capacitor and the sensing margin in bit-line signal distribution of it was about 340 mV.

• The Korean Journal of Ceramics
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• v.6 no.4
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• pp.348-353
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• 2000

The effects of MnO$_2$ and Fe$_2$O$_3$ on the piezoelectric properties of 0.05PMN-0.451PT-0.499PZ ceramics were investigated. The addition of MnO$_2$ increased mechanical quality factor (Q$_m$) but decreased the dielectric constant (K$^{T}_{33}$) and compliance (S$^{E}_{11}$) of the specimens. These results indicated that MnO$_2$ behaves as an acceptor in 0.05MN-0.451PT-0.499PZ ceramics. The electromecanical coupling coefficient (K$_P$) of 0.05PMN-0.451PT-0.499PZ ceramics slightly increased with the addition of MnO$_2$ however, the enhancement of $K_P$ was insignificant. A small amount of Fe$_2$O$_3$ was added to enhance the $K_P$ of the 0.05PMN-0.451PT-0.499PZ + 0.5 wt% MnO$_2$ ceramics. The addition of Fe$_2$O$_3$ largely increased $K_P$ through the increase of the K$^{T}_{33}$ and the polarization. The mechanical quality factor of the specimens decreased with the addition of Fe$_2$O$_3$however, the reduction was negligible.

• Journal of the Korean Magnetics Society
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• v.9 no.2
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• pp.91-97
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• 1999

YIG $(Y_3Fe_5O_{12})$ films with 4~80 ${\mu}{\textrm}{m}$ thickness were epitaxially grown on GGG $(Gd_3Ga_5O_{12})$ substrates by LPE (liquid phase epitaxy) techniques. Using various melts having different chemical composition the growth temperature was varied as a parameter. Growth rate, surface morphology, chemical composition, lattice constant, saturation magnetization, and magnetic resonance of the films were investigated. Lattice mismatch between the substrate and film Δa, saturation magnetization, and magnetic resonance line width ΔH increased, decreased, and increased, respectively, as undercooling temperature ΔT increased. The films grown by using the melt with larger R$_1$and smaller R$_3$had smaller ΔH. The major origin of the increase of ΔH was the increase of Δa. It is considered that the magnetic field in the film became locally inhomogeneous with the increase of Δa due to the increase of inhomogenity in stress distribution to the film depth direction. Therefore, in order to grow YIG films with small microwave loss it is necessary to grow films at small ΔT using the melt with large R$_1$and small R$_3$resulting in a small Δa.

• Journal of the Korean Ceramic Society
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• v.48 no.5
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• pp.479-484
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• 2011

In this paper, investigations of thick film $La_{0.75}Sr_{0.25}Ga_{0.8}Mg_{0.16}Fe_{0.04}O_{3-{\delta}}$ (LSGMF) cells fabricated via spin coating on either NiO-YSZ anode or $La_{0.7}Sr_{0.3}Ga_{0.6}Fe_{0.4}O_3$ (LSGF) cathode substrates are presented. A La-doped $CeO_2$ (LDC) layer is inserted between NiO-YSZ and LSGMF in order to prevent reactions from occurring during co-firing. For the LSGF cathode-supported cell, no interlayer was required because the components of the cathode are the same as those of LSGMF with the exception of Mg. An LSGMF electrolyte slurry was deposited homogeneously on the porous supports via spin coating. The current-voltage characteristics of the anode and cathode supported LSGMF cells at temperatures between $700^{\circ}C$ and $850^{\circ}C$ are described. The LSGF cathode supported cell demonstrates a theoretical OCV and a power density of ~420 mW $cm^2$ at $800^{\circ}C$, whereas the NiO-YSZ anode supported cell with the LDC interlayer demonstrates a maximum power density of ~350 mW $cm^2$ at $800^{\circ}C$, which decreased more rapidly than the cathode supported cell despite the presence of the LDC interlayer. Potential causes of the degradation at temperatures over $700^{\circ}C$ are also discussed.

• Bulletin of the Korean Chemical Society
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• v.20 no.11
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• pp.1313-1318
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• 1999

Lewis bases were employed to control the stoichiometry of ferrite film prepared by light enhanced plating (LEP) technique. When 2,2'-bipyridyl was used as a Lewis base, conversion electron Mosbauer spectroscopy (CEMS) and x-ray powder diffraction (XRD) experiments showed that the main component of the ferrite films was metal-deficient magnetite (Fe3(1-δ)O4). Nonstoichiometry and roughness of LEP films were increased by the addition of 2,2'-bipyridyl. Using ethylenediaminetetraacetate (EDTA) as a Lewis base, produced film that was a mixture of magnetite and Υ-FeO(OH). No low temperature transition (Verwey transition) of magnetite was detected in resistivity and ac-susceptibility measurements for the LEP films. Surface morphology of the LEP films was observed by atomic force microscopy (AFM). The size of dominant particles was about 0.2 μm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.192-193
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• 2006

A 16Mb ITIC FeRAM device was fabricated with BLT capacitors. The average value of the switchable 2 polarization obtained m the 32k-array (unit capacitor size: 068 ${mu}m^2$) capacitors was about 16 ${\mu}C/cm^2$ at 3V and the uniformity within an 8-inch wafer was about 2.8%. But a lot of cells were failed randomly during the measuring the bit-line signal of each cell. It was revealed that the Grain size and orientation of the BLT thin film were severely non-uniform. Therefore, the uniformity of the grain size and orientation was improved by changing the process conditions of post heat treatment. The temperature of nucleation step was the very effective on varying the microstructure of the BLT thin film. The optimized temperature of the nucleation step was $560^{\circ}C$.

• Journal of the Korean Magnetics Society
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• v.17 no.4
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• pp.156-161
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• 2007

To develop array magnetic sensors, specular-type giant magnetoresistive- spin valve (GMR-SV) film of Glass/Ta(5)MiFe(7)/IrMn(10)NiFe(5)/$O_2$/CoFe(5)/Cu(2.6)/CoFe(5)/$O_2$/NiFe(7)/Ta(5)(nm) was deposited by using a high-vacuum sputtering system. One of 15 way sensors in the area of $8{\times}8mm^2$ was Patterned a size of $20{\times}80{\mu}m^2$ in multilayer sample by Photo-lithography. All of 15 sensors with Cu electrodes were measured a uniform magnetic properties by 2-probe method. The highest magnetic sensitivity of MR and output voltage measured nearby an external magnetic field of 5 Oe were MS = 0.5%/Oe and ${\triangle}$V= 3.0 mV, respectively. An easy-axis of top-free layers of $CoFe/O_2/NiFe$ with shape anisotropy was perpendicular to one of bottom-pinned layers $IrMn/NiFe/O_2/CoFe$. When the sensing current increased from 1 mA to 10 mA, the output working voltage uniformly increased and the magnetic sensitivity was almost stable to use the nano-magnetic devices with good sensitive properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.299-304
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• 2004

In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of 100$0^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using SF$_{6}$/O$_2$ and CF$_4$/O$_2$ gas mixture. Etch rate has been investigated as a function of oxygen concentration in the gas mixture, rf power, working pressure and gas flow rate. Etch rate was measured by surface profiler and FE-SEM. SF$_{6}$/O$_2$ gas mixture showed higher etch rate than CF$_4$/O$_2$ gas mixture. Maximum etch rate appeared at RF Power of 450W. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40％, and the superior anisotropic cross section was observe