• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.571-576
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• 2011

Activity carbon (AC), Cu and $Cu_2O$ modified $TiO_2$ composites (Cu/$Cu_2O$-AC/$TiO_2$) were prepared using a sol-gel method. The characteristics of the composites were evaluated using Brunauer-Emmett-Teller (BET) surface area measurements, X-ray diffraction (XRD), energy dispersive X-ray (EDX) analysis and scanning electron microscope (SEM) analysis. A methyl orange (MO) solution under visible light irradiation was used to determine the photocatalytic activity. The degradation of MO was determined using UV/Vis spectrophotometry. $Cu_2O$, Cu and the cooperative effect of the AC increased the photo-absorption effect, thus increasing in photocatalytic activity.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04a
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• pp.43-46
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• 2004

CuPc와 $C_{60}$을 이용하여 ITO/CuPc/Al의 CuPc 단층구조와 $ITO/CuPc/C_{60}/Al$의 이종접합 구조에서의 광기전 특성을 연구하였다. CuPc 단층구조에서는 CuPc층의 두께를 10nm에서 50nm로 가변하여 전압-전류 특성을 측정한 결과 40nm 부근에서 최적화된 전기적인 특성이 나타났으며, $CUPC/C_{60}$의 이종접합 구조에서는 CuPc와 $C_{60}$의 두께 비율을 1 : 1 (20nm : 20nm), 1 : 2 (20nm : 40nm), 1 : 3 (20nm : 60nm)으로 가변하여 측정한 결과, 1 : 2의 두께비에서 최적화된 특성을 얻었다. 광원은 500W Xe lamp(ORIEL 66021)를 이용하였으며, 광원의 세기는 보정된 radiometer/photometer (International Inc. IL14004)와 Si-photodiode로 측정하였다.

• YAKHAK HOEJI
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• v.9 no.1_2
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• pp.18-22
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• 1965

A new organic reagent, 1-isonicotinoyl-2-furfurylidene hydrazine was synthesized from isonicotinic acid hydrazide and furfural, gives precipitate with copper(II), mercury(II) and argent(I), whereas, it gives a water soluble yellow complex with iron(III). Copper complex of the reagent is soluble in EtOH MtOH, pyridine, dioxane and dimethylformamide with green yellow coloration. The complex has a maximum absorption at 385 m.$\mu$ and molar ratio of copper; reagent was estimated as 1:1 by continuous variation method, slop method and chelate titration method. Molar extinction coefficient (9600) and apparant formation constant of this complex was spectrophotometrically determined. K=1.7 * $10^{7}$ (Babko's method) K=2.1 * $10^{7}$ (Anderson's method). This reagent reacted with copper so sensitive that it would be available for determination of Cu (II).

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2005.11a
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• pp.87-88
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• 2005

Ultra-fine copper powders with particle size about 150 nm were synthesized from copper hydroxide slurry by wet method using hydrazine as reduction agent and several sur factants at below $80^{\circ}C$. The particle size distribution and dispersion of synthesized powders as function of temperature, feeding rate of reduction and especially, sur factants were character ized by XRD, BET, PSA and SEM by this process.

• Journal of the Korean Ceramic Society
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• v.30 no.11
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• pp.967-973
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• 1993

The effect on the hydration of cement was that Cu and Pb reacted with alkali to form soluble hydrates at theinitial stage and then there followed a slow reaction forming insoluble metal hydroxides. These hydroxides were deposited on the surface of cement particles providing a barrier against further hydration. But as a slow reaction continued, the insoluble layers were eventually destroyed and the hydration reaction resumed. Thereafter, another retardation occured by restricting the polymerization of silicates, shown by FT-IR spectroscopy analysis. In the case of Cr, as its reaction with cement caused H2O, the coordinator of Cr complex, to replace or polymerize with OH-, the formation of Cr complex promoted the leakage of OH- and increased the heat of dissolution. So the total heat evolution during hydration was larger than that in the case of Pb or Cu. The retarding effect of heavy metal ions was in the order Pb>Cu>Cr.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.59-63
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• 2003

The microstructural characteristics of $Al_2$$O_3$/Cu composites hot-pressed at different temperatures for atmosphere switching from $H_2$to Ar have been studied. When the composite atmosphere was switched at $1000^{\circ}C$ it led to more homogeneous microstructure than when the atmosphere was switched at $1450^{\circ}C$. The strong sensitivity of Cu to atmosphere, especially the oxygen content in the atmosphere, was found to be responsible for the observed change, based upon the interfacial phenomena related to the formation of $CuAlO_2$. The practical implication of these results is that an optimum processing condition for the design of homogeneous microstructure and stable properties can be established.

• Bulletin of the Korean Chemical Society
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• v.32 no.4
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• pp.1331-1335
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• 2011

We report the results of the characterization of Cu oxide thin films deposited by radio frequency (r.f.) magnetron sputtering at different annealing temperatures. The deposited Cu oxide thin films were investigated by scanning electron microscopy, spectroscopic ellipsometry, X-ray diffraction, atomic force microscopy, Xray photoelectron spectroscopy, and contact angle measurements. The thickness of the films was about 180 nm and the monoclinic CuO phase was detected. The $CuO_2$ and $Cu(OH)_2$ phases were grown as amorphous phase and the ratio of the three phases were independent on the annealing temperature. The surface of Cu oxide films changed from hydrophilic to hydrophobic as the annealing temperature increased. This phenomenon is due to the increase of the surface roughness. The direct optical band gap was also obtained and laid in the range between 2.36 and 3.06 eV.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• Bulletin of the Korean Chemical Society
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• v.23 no.12
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• pp.1765-1768
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• 2002

The isotherms of CO adsorption on the Cu/ZnO sample treated with with hydrogen and methanol are investigated. The heats of adsorption of CO on the Cu/ZnO treated with hydrogen at 723K for 3 h are in the range from 25.7 kJ/mol at $\theta=0.8$ to 59.8 at $\theta=0.1$, while those on the Cu/ZnO sample treated with methanol at 523 K for 3 h are in the range 30.3 kJ/mol at $\theta=0.8$ to 99.8kJ/mol at $\theta=0.1.$ The Cu/ZnO samples treated with hydrogen do. The heats of adsorption at q=0.1 increase with the methanol treatment time within 30 min and leveled off afterwards.