• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.137-138
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• 2011

구리 이온은 -0.40V (vs. SCE)에서 전기화학적 환원이 일어나는 반면, 니켈 이온은 -1.19V (vs. SCE)에서 전착이 발생한다. 따라서, 단일 도금욕조 내에서 Ni-Cu 합금도금층을 제조하기 위해서는 두 금속 이온종 간의 전위차를 줄여주어야 하는데, 이를 위해 본 연구에서는 $Na_3C_6H_5O_7{\cdot}2H_2O$를 착화제로 사용하였다. 다양한 Ni-Cu 합금 도금층의 조성을 얻기 위하여 기본 도금욕 내 황산니켈과 황산구리의 비율을 10:1로 설정하였다. 도금 공정 조건에 따른 합금 도금층 조성 변화를 관찰하기 위하여 도금액 pH와 교반 속도에 따른 도금층 조성 변화를 분석하였으며, 도금액의 UV-VIS과 도금층의 XRD 와 SEM 측정을 통하여 도금욕과 도금층 간의 상관 관계를 유추하였다. 본 도금액에 사용된 $Na_3C_6H_5O_7{\cdot}2H_2O$ 착화제의 효과는 pH3에서 가장 현저하였으며, pH 변화 및 교반 속도 변화를 이용하여 다양한 합금 조성을 얻을 수 있었다.

• Journal of the Korean Applied Science and Technology
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• v.33 no.3
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• pp.441-448
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• 2016

Heavy metal removal study is conducted from synthetic waste water by reduction and oxidation(redox) reaction of Cu-Zn metal alloy and adsorption reaction of aluminium silicate. Heavy metal whose ionization tendency is smaller than zinc are reducted in an aqueous solution, and the concentration of ionized zinc is reduced by adsorption reaction. The average diameter of metal alloy micro fiber is about $200{\mu}m$, and the surface area is wide enough to get equilibrium in a single cycle treatment. A single cycle treatment of redox reaction of Cu-Zn metal alloy, could remove 100.0 % of Cr(III), 98.0 % of Hg, 92.0 % of Sn and 91.4 % of Cu respectively. An ionization tendency of chromium is very close to zinc, but removal efficiency of chromium by redox reaction is significant. This result shows that trivalent chromium ion is expected to generate hydroxide precipitation with $OH^-$ ion generated by redox reaction. Zinc ion generated by redox reaction is readily removed by adsorption reaction of aluminium silicate in a single cycle treatment. Other heavy metal components which are not perfectly removed by redox reaction also showed very high removal efficiency of 98.0 % or more by adsorption reaction. Aluminium ion is not increased by adsorption reaction of aluminium silicate. That means heavy metal ion removal mechanism by adsorption reaction is turned out to be not an ion exchange reaction, but an adsorption reaction.

• KSBB Journal
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• v.16 no.1
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• pp.54-60
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• 2001

The activity of microorganisms is an important factor that determines the efficiency of the bacterial recovery of precious metals from low-grade ore. Metal-leaching microorganisms must have a tolerance, within the concentration levels encountered to leached metals. In this study, the tolerance levels of Thiobacillus ferroxidans to the single and mixed metal ions systems, composed of $Zn^{2+}$, $Cu^{2+}$, $Ni^{2+}$, and $Cd^{2+}$ were investigated. When single metal ions of $Zn^{2+}$ (10~60 g/L), $Cu^{2+}$ (1~6 g/L), $Ni^{2+}$ (1~6 g/L), or $Cd^{2+}$ (1~6 g/L) were added to the growth medium of T. ferrooxidans, the iron oxidation rate of this bacterium was not significantly inhibited. The maximum inhibition percentage observed on the iron oxidation rate of T. ferrooxidans was approximately 50% in the medium supplemented with two or three mixed metal ions of $Cu^{2+}$, $Ni^{2+}$, and $Cd^{2+}$. However, when $Zn^{2+}$ was also added to the medium with the other metal ions, the inhibitory effect on the iron oxidation activity of T. ferroxidans was remarkably increased.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.49-54
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• 2022

The copper plating process used to fabricate the submicron damascene pattern of Cu wiring for Si wafer was applied to the plating of a PCB pattern of several tens of microns in size using the same organic additives and current density conditions. In this case, the non-uniformity of the plating thickness inside the pattern was observed. In order to quantitatively analyze the cause, a numerical calculation considering the solution flow and electric field was carried out. The calculation confirmed that the depletion of Cu²⁺ ions in the solution occurred relatively earlier at the bottom corner than the upper part of the pattern due to the plating of the sidewall and the bottom at the corner of the pattern bottom. The diffusion coefficient of Cu²⁺ ions is 2.65 10^-10 m²/s, which means that Cu²⁺ ions move at 16.3 ㎛ per second on average. In the cases of small damascene patterns, the velocity of Cu²⁺ ions is high enough to supply sufficient ions to the inside of the patterns, while sufficient time is required to replenish the exhausted copper ions in the case of a PCB pattern having a size of several tens of microns. Therefore, it is found that the thickness uniformity can be improved by reducing the current density to supply sufficient copper ions to the target area.

• The Korean Journal of Food And Nutrition
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• v.17 no.3
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• pp.294-301
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• 2004

Effects of superoxide dismutase(SOD), catalase(CAT), and such other proteins as bovine serum albumin(BSA), ovalbumin, lysozyme, and v-globulin on the autoxidation rates of L-ascorbic acid(AsA) in the absence of heavy metal ions and in the presence of Fe(III) or Cu(II) ions in water were examined. AsA was dissolved in a ultra-refined water at a concentration of 50 ${\mu}$M and 5 ${\mu}$M Fe(III) or 0.1 ${\mu}$M Cu(II) were added, and a oxygen gas was bubbled through the solution at a flow rate of 200 ml/min at 35$^{\circ}C$. The amount of remaining AsA in the reaction mixture was determined by using a UV spectrophotometer(at 265 nm). It was found that the Cu(II) at a concentration of 0.1 ${\mu}$M had a more accelerated for the autoxidation of AsA than Fe(III) at 5 ${\mu}$M. Moreover, it was confirmed that the ratio of remaining AsA was significantly larger in the presence of SOD, CAT, BSA, ovalbumin, lysozyme, and v-globulin than in the absence of proteins. The stabilization of AsA by various proteins were confirmed during the autoxidation of AsA in the presence of Fe(III) or Cu(II) in water. It was suggested that the non-enzymatic effects of SOD, CAT and some other proteins might be involves in the stabilization of AsA.

• Resources Recycling
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• v.17 no.5
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• pp.60-65
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• 2008

A study on the removal of silver(Ag) in copper electrolyte was carried out to produce high purity copper by using various method such as ion exchange resin, activated carbon adsorption, copper cementation with powder and wire, CuS precipitation. Parameters, such as reaction time, reaction temperature, addition amount etc. were investigated to determine the effective condition of silver removal. CuS precipitation and ion exchange using Lewatit TP214 was found to be effective. Especially, silver content in copper electrolyte was reduced from 10 ppm to less than 0.1 ppm by ion exchange with Lewatit TP214.

• Korean Journal of Agricultural Science
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• v.9 no.2
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• pp.584-590
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• 1982

Copolymerization of the 4-vinylpyridine with vinylacetate and divinylbenzene initiated by azobis-isobutyronitrile was carried out in DMF in presence $BaCl_2$ at $98^{\circ}C$. Ion exchange res in, poly 4-vinylpyridine-vinylsulfonic acid-divinylbenzene was prepared by sulfonation of 4-vinylpyridine-vinylacetatp-divinylbenzene with concentrated sulfuric acid. The compositions of each synthetic resin were identified by means of ir adsorption spectroscopy. Anion and cation capacities of 4-vinylpyridine-vinylsulfonic acid-divinylbenzene ion exchanger were 2.5meq/g and 4.8meq/g, respectively. Adsorption of Cd(II) and Cu(II) ions have showed larger quantity in alkalie media. A study also was made of the influence of alcohol on the distribution coefficient of Cd(II) and Cu(II) ions between the synthetic ion exchanger, and solution containing hydrochloric acid, various alcohols and water. The distribution coefficients of metal ions decrease generally as the number of branches of carbon in the molecule of butyl alcohol increase. (t-BuOH

• Journal of the Korean Vacuum Society
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• v.14 no.1
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• pp.17-23
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• 2005

Glow discharge mass spectrometry(GDMS) was used to determine the impurity concentrations of the deposited Cu films and the 6N Cu target. Cu films were deposited on Si (100) substrates at zero substrate bias voltage and a substrate bias voltage of -50 V using a non-mass separated ion beam deposition method. Since do GDMS has a little difficulty to apply to thin films because of the accompanying non-conducting substrate, we have used an aluminum foil to cover the edge of the Cu film in order to make an electrical contact of the Cu film deposited on the non-conducting substrate. As a result, the Cu film deposited at the substrate bias voltage of -50 V showed lower impurity contents than the Cu film deposited without the substrate bias voltage although both the Cu films were contaminated during the deposition. It was found that the concentration change of each impurity in the Cu films by applying the negative substrate bias voltage is related to the difference in their ionization potentials. The purification effect by applying the negative substrate bias voltage might result from the following reasons: 1) Penning ionization and an ionization mechanism proposed in the present study, 2) difference in the kinetic energy of accelerated Cu+ ions toward the substrate with/without the negative substrate bias voltage.

• Electrical & Electronic Materials
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• v.1 no.2
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• pp.126-135
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• 1988

Acrylonitrile-Acrylic acid 공중합체와 이를 amidation시킬 공중합체에 구리착물을 형성시켜 IR spectrum분석, 점도측정, 전자현미경관찰, 열분석, 전기전도성등을 검토하였다. AN-AA 공중합체-Cu(II)와 아미드화 AN-AA 공중합체-Cu(II)착물은 pH9의 범위에서 가장 안정한 값을 가지며 착물이 형성되거나 Cu$_{x}$S가 도입된 공중합체는 그 구조가 ompact해짐을 알 수 있었다. 공중합체에 Cu(II)착물이 형성되면 열안정성이 감소되며 Cu(II)착물은 아세톤 용액에서 요오드로 dope 될 때 저항값이 $10^{5}$-$10^{6}$.OMEGA..cm를 나타냈다. 저항값은 CuCl$_{2}$와 I$_{2}$의 양에 영향을 받으며 20wt% 이상의 CuCl$_{2}$와 1.0wt% I$_{2}$로 처리하였을 때 반도체영역의 저항값을 보였다. 또 Cu$_{x}$S를 도입할 경우 CuSO$_{4}$의 농도가 30g/l로, 3시간 반응시켰을 때 가장 만족스러운 전도도값을 나타냈다. 공중합체-Cu(II)보다 구리이온을 도입한 Cu$_{x}$S공중합체의 전도도값이 $10^{4}$정도로서 공중합체-Cu(II)보다 높은 전도성을 나타냈다.다.

• Applied Chemistry for Engineering
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• v.10 no.1
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• pp.166-172
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• 1999

Fixed-bed adsorption of metal ions on chitosan bead was studied to remove heavy metal ions in waste water. Chitin was extracted from carb shell and chitosan was prepared by deacetylation of the chitin. The chitosan in bead was used as an adsorbent for heavy metal ions. Freundlich and Langmuir isotherm was determined from the experimental results of equilibrium adsorption for individual metal ion ($Cu^{2+}$, $Co^{2+}$, $Ni^{2+}$) on chitosan bead. Adsorption strength of metal ions decreased in the order of $Cu^{2+}$>$Co^{2+}$>$Ni^{2+}$ ion. Breakthrough curves of single and multicomponent adsorption for metal ions were obtained from the experimental results of fixed-bed adsorption. The breakthrough curves were analyzed by simulation with fixed-bed adsorption equation based on LDFA (linear driving force approximation) adopted LAS (ideal adsorbed solution) theory which can predict multi-component adsorption isotherm from individual adsorption isotherm. The behavior of fixed bed adsorption for single and multi-component system could be nicely simulated by the equation.