• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.245-245
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• 2010

최근에 반도체 소자 및 마이크로머신, 바이오센서 등에 사용되는 미세 부품에 대한 연구 개발이 활발히 진행되고 있다. 미세 부품을 제작하기 위한 MEMS 공정은 대표적으로 화학용액을 이용한 습식식각, 플라즈마를 이용한 건식식각 등이 주를 이룬다. Micro blaster는 경도가 강하고 화학적 내성을 가지며 용융점이 높아 반도체 MEMS 공정에 어려움이 있는 기판을 다양한 형태로 식각 할 수 있는 기계적인 식각 공정 기술이라 할 수 있다. Micro blaster의 식각 공정은 고속의 날카로운 입자가 공작물을 타격할 때 입자의 아래에는 고압축응력이 발생하게 되고, 이 고압축 응력에 의하여 소성변형과 탄성변형이 발생된다. 이러한 변형이 발전되어 재료의 파괴 초기값보다 크게 되면 크랙이 발생되고, 점점 더 발전하게 되면 재료의 제거가 일어나는 단계로 이루어진다. 본 연구에서는 micro blaster 장비를 반도체 MEMS 공정에 적용하기 위한 식각 특성에 관하여 확인하였다. Micro blaster 장비와 식각에 사용한 파우더는 COMCO INC. 제품을 사용하였다. Micro blaster를 $Al_2O_3$ 파우더의 입자 크기, 분사 압력, 기판의 종류, 노즐과 기판과의 간격, 반복 횟수, 노즐 이동 속도 등의 공정 조건에 따른 식각 특성에 관하여 분석하였다. 특히 실제 반도체 MEMS 공정에 적용 가능한지 여부를 확인하기 위하여 바이오 PCR-chip을 제작하였다. 먼저 glass 기판과 Si wafer 기판에서의 식각률을 비교 분석하였고, 이 식각률을 바탕으로 바이오 PCR-chip에 사용하게 될 미세 홀과 미세 채널, 그리고 미세 챔버를 형성 하였다. 패턴을 형성하기 위하여 TOK Ordyl 사의 DFR(dry film photoresist:BF-410)을 passivation 막으로 사용하였다. Micro blaster에 사용되는 파우더의 직경이 수${\mu}m$ 이상이기 때문에 $10\;{\mu}m$ 이하의 미세 채널과 미세홀을 형성하기 어려웠지만 현재 반도체 MEMS 공정 기술로 제작 연구되어지고 있는 바이오 PCR-chip을 직접 제작하여 micro blaster를 이용한 반도체 MEMS 공정 기술에 적용 가능함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.293-293
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• 2010

최근 태양전지 연구에서 저가격화를 실현하는 방법 중 하나로 폐 실리콘 웨이퍼를 재생하는 방법에 관하여 많은 연구가 진행되고 있다. 그러나 기존 웨이퍼 재생공정은 높은 재처리 비용과 복잡한 공정등의 많은 단점을 가지고 있다. 챔버 내에 압축된 공기나 가스에 의해 가속된 미세 파우더들이 재료와 충돌하면서 식각하는 기계적 건식 식각 공정 기술이라고 할 수 있는 micro blaster 공정을 이용하면 기존 재생공정보다 낮은 재처리 비용과 간단한 공정으로 재생웨이퍼를 제작할 수 있다. 하지만 이러한 micro blaster 공정은 식각 후 표면에 많은 particle과 crack을 형성시켜 태양전지용으로 사용하기에 단점을 가진다. 본 연구에서는 이러한 micro blaster를 이용한 태양전지용 재생 웨이퍼를 제작하기 위해 폐 실리콘 웨이퍼의 표면 물질을 식각하고, 식각 후 충돌에 의해 발생된 표면의 particle과 crack을 DRE(Damage Remove Etching)공정으로 제거하는 연구를 진행 하였다. 먼저 폐 실리콘 웨이퍼와 같은 표면을 형성하기 위하여 시편 표면에 각각 Al($2000{\AA}$), $Si_3N_4(3000{\AA})$, $SiO_2(1{\mu}m)$, AZ1512($1{\mu}m$)을 형성하고 micro blaster의 파우더 크기, 압력, 스캔 속도 등의 공정 조건에 따라 폐 실리콘 웨이퍼 표면 물질을 식각하였다. 식각 후 폐 실리콘 웨이퍼의 식각된 깊이와 표면 물질 잔량을 측정하고, 폐 실리콘 웨이퍼의 표면에 particle과 crack, 요철이 형성되어 있는지를 확인하였다. 그 결과 폐 실리콘 웨이퍼에 형성된 물질의 두께 이상으로 식각되었으며, 표면 물질의 잔량이 남아 있지 않았고, 표면에 많은 particle과 crack, 요철이 형성되었다. 표면에 형성된 요철은 유지하면서 많은 particle과 crack을 제거하기 위하여 micro blaster공정 후 DRE 공정으로 표면 개선이 필요하였다. 이때 남겨진 요철은 입사광량을 증가시키고, 표면 반사율을 감소시켜 태양전지내의 흡수하는 빛의 양을 증가시키는 태양전지 texturing 공정 효과로 작용하게 된다. 표면에 남은 particle과 crack을 완전히 제거하면서 요철은 유지할 수 있게 HNA 용액의 농도와 시간에 따른 식각 정도를 측정하였다. DRE 공정 후 표면 particle과 crack이 완전히 제거되어 표면이 개선됨을 확인하였다. Micro blaster를 이용하여 폐 실리콘 웨이퍼의 표면을 식각하고, DRE공정으로 표면을 개선함으로써 태양전지용 기판으로의 재생 가능성을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.286-286
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• 2010

최근에 환경 오염과 화석 에너지의 고갈 문제를 해결하기 위하여 태양광을 전기 에너지로 변환하는 태양전지 연구에서 가장 이슈가 되는 부분은 저가격화와 고효율이다. 상용화 되어 있는 대부분의 태양전지는 단결정 실리콘 웨이퍼와 다결정 실리콘 웨이퍼를 사용한다. 실리콘 웨이퍼의 원자재 가격을 낮추는 방법에는 한계가 있기 때문에 태양전지 제작 공정에서 공정 단가를 낮추는 방법이 많이 연구되고 있고, 실리콘 웨이퍼가 가지는 재료의 특성상 화합물을 이용한 태양전지 보다 낮은 효율을 가질 수밖에 없기 때문에 반도체 소자 공정을 응용하여 실리콘 웨이퍼 기판에서 고효율을 얻는 방법으로 연구가 진행 되고 있다. 본 연구에서는 마이크로 블라스터를 이용하여 태양전지 cell 상부에 AG(anti-glare)를 가지는 유리 기판을 형성하여 낮은 단가로 태양전지 cell의 효율을 향상시키기 위한 연구를 진행 하였다. 태양전지 cell 상부에 AG를 가지는 유리 기판을 형성하게 되면 태양의 위도가 낮아 표면에서 대부분 반사되는 태양광을 태양전지 cell에서 광기전력효과가 일어나게 하여 효율을 향상시킨다. 이때 사용한 micro blaster 공정은 고속의 입자가 재료를 타격할 때 입자의 아래에는 고압축응력이 발생하게 되고, 이 고압 축응력에 의하여 소성변형과 탄성변형이 발생된다. 이러한 변형이 발전되어 재료의 파괴 초기값보다 크게 되면 크랙이 발생되고, 점점 더 발전하게 되면 재료의 제거가 일어나는 단계로 이루어지는 기계적 건식 식각 공정 기술이라 할 수 있다. 먼저 유리 기판에 마이크로 블라스터 장비를 이용하여 AG를 형성한다. AG는 $Al_2O_3$ 파우더의 입자 크기, 분사 압력, 노즐과 기판과의 간격, 반복 횟수, 노즐 이동 속도 등의 공정 조건에 따른 유리 기판 표면에서의 광학적 특성 및 구조적 특성에 관하여 분석하였다. 일반적인 태양전지 cell 제작 공정에 따라 cell을 제작 한후 AG 유리 기판을 상부에 형성시키고 솔라시뮬레이터를 이용하여 효율을 측정하였다. 이때 솔라시뮬레이터의 광원이 고정되어 있기 때문에 태양전지 cell에 기울기를 주어 태양의 위도 변화에 대해 간접적으로 측정하였다. AG 유리 기판이 태양전지 cell 상부에 형성 되었을 때와 없을 때를 각각 비교하여 AG 유리 기판이 형성된 태양전지 cell에서의 효율 향상을 확인하였다.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Journal of Convergence for Information Technology
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• v.9 no.12
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• pp.147-156
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• 2019

Numerical study was performed to investigate the convective heat transfer of Al₂O₃/water nanofluid flowing through the concentric double pipe counterflow heat exchangers. Hot fluid flowing through the inner pipe transfers its heat to cooling fluid flowing in the outer pipe. Effects of important parameters such as hot and cold volume flow rates, fluid type in the outer and inner pipes, and nanoparticles concentration on the heat transfer and flow characteristics are investigated. The results indicated that the heat transfer performance increases with increasing the hot and cold volume flow rates, as well as the particle concentrations. When both outer and inner pipes are nanofluids with 8% nanoparticle volume concentration, nanofluids showed up to 17% better heat transfer rate than basic fluids. Also, the average heat transfer coefficient of the base fluid for annulus-side improved by 31%. Approximately 20% enhancement in the heat exchanger effectiveness can be achieved with the addition of 8% alumina particles in base fluid. But, addition of nanoparticles to the base fluid enhanced friction factor by about 196%.

• Composites Research
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• v.20 no.5
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• pp.20-25
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• 2007

Cyclic heating method is useful method for measuring the thermal diffusivity of porous materials. The main object of this paper is to develop and verify the thermal diffusivity measuring system of porous materials under vacuum condition. To verify this method, thermal diffusivities of the alumina ($Al_2O_3$) specimen and polystyrene foam were measured. Thermal diffusivities of these specimens were agreed with reference values. Thermal diffusivities of carbon/epoxy and porous insulation material were measured at atmospheric room temperature condition and vacuum condition respectively. Thermal diffusivities of carbon/epoxy and porous insulation material under vacuum are reduced by 66.4% and 64.9% compared to the thermal diffusivities under the atmospheric condition. These differences are considered the effect of the porous insulation material with an air.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.32 no.6
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• pp.514-523
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• 2006

The purpose of the present study was to evaluate the effects of several implant surface treatments to the bone formation, by placing Machined implants, 75${\mu}m$ Calcium phosphate-blasted implants and $Al_2O_3$-blasted and acid-etched implants in rabbit tibia through histomorphometric study. Two animals of each group were sacrificed at 2, 4, 8 weeks. The specimens containing the implants were dehydrated and embedded into hard methylmethacrylate plastic. Thereafter, the sections were ground to 50${\mu}m$. The specimens were stained with Villanueva bone stain for a light microscopic study. The results were as follows; 1. When the surface roughness of three different implants was measured by Surfcorder, the Ra of the Machined group, the RBM group and the SLA group was 0.16${\mu}m$, 0.44${\mu}m$, and 1.08${\mu}m$. 2. When examining the surfaces of the implants in the scanning microscope, Machined implant has the smooth surface with a few scratches, RBM implant has the rough surface with curled ridges and valleys, and SLA implant has the rough surface structures such as sharp protruding parts and micropits measuring 1-2${\mu}m$ in diameter. 3. After 2 weeks of implantation, the percentage of bone-to-implant contact of the Machined group, the RBM group and the SLA group was 26.86%, 35.40% and 45.99%. However, its differences between each group decreased during the healing periods. 4. After 2 weeks of implantation, the percentage of bone area inside the threads of the Machined group, the RBM group and the SLA group were 21.55%, 30.43% and 41.18%. However, its difference of bone area between machined group and surface treatment groups was maintained but the difference within the surface treatment groups decreased during the healing periods. In summary, the amount of bone formation in RBM and SLA group was greater than Machined group in early healing stage. These results suggest that RBM and SLA implants can reduce the healing period for osseointegration and may be suitable for early function.

• Journal of Dental Rehabilitation and Applied Science
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• v.30 no.2
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• pp.131-137
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• 2014

Purpose: This study examined the efficiency and wear of periodontal instrument sharpening using aluminum oxide stones with different levels of roughness. Materials and Methods: Thirty new No. 9-10 Gracey curets were used in this study. All curets had become dull after scaling and root planing. After similar blunting, the instruments were divided randomly into three groups (240, 600, 800 grit) containing 10 curets each. The stones were applied correctly to the lateral surface of each curet to maintain the $70-80^{\circ}$ angle. After resharpening, sharpness of the curets was examined by an optical microscope. After 20, 40, 60, and 80 strokes, the wear was measured at 1 mm and 2 mm from the tip of the cutting edge using a digital caliper. The data was analyzed statistically using analysis of variance (ANOVA) with repeated measures, 2-way ANOVA, and a Fisher's exact test. Results: The degree of sharpness increased significantly (P < 0.001) as the number of sharpening strokes grew for all stones. A comparison of the degree of sharpness on the same number of strokes showed that the 240 grit group significantly excelled the other groups on 5 and 10 strokes, respectively (P < 0.001). The mean wear showed no statistically significant difference among the groups (P > 0.05). Conclusion: The efficiency of Gracey curet resharpening was enhanced with more coarse stones, though we should consider the wear of the instrument during resharpening.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.251-256
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• 2007

The crystal structure of fully dehydrated partially Cs+-exchanged zeolite X, [Cs52Na40Si100Al92O384], a = 24.9765(10) A, has been determined by single-crystal X-ray diffraction techniques in the cubic space group Fd3 at 21 °C. The crystal was prepared by flow method for 5 days using exchange solution in which mole ratio of CsOH and CsNO3 was 1 : 1 with total concentration of 0.05 M. The crystal was then dehydrated at 400 °C and 2 × 10-6 Torr for 2 days. The structure was refined to the final error indices, R1 = 0.051 and wR2 (based on F2) = 0.094 with 247 reflections for which Fo > 4σ (Fo). In this structure, about fifty-two Cs+ ions per unit cell are located at six different crystallographic sites with special selectivity; about one Cs+ ion is located at site I, at the centers of double oxygen-rings (D6Rs), two Cs+ ions are located at site I', and six Cs+ ions are found at site II'. This is contrary to common view that Cs+ ions cannot pass sodalite cavities nor D6Rs because six-ring entrances are too small. Ring-opening by the formation of ?OH groups and ring-flexing make Cs+ ions at sites I, I', and II' enter six-oxygen rings. The defects of zeolite frameworks also give enough mobility to Cs+ ions to enter sodalite cavities and D6Rs. Another six Cs+ ions are found at site II, thirty-six are located at site III, and one is located at site III' in the supercage, respectively. Forty Na+ ions per unit cell are located at two different crystallographic sites; about fourteen are located at site I, the centers of D6Rs and twenty-six are also located at site II in the supercage. Cs+ ions and Na+ ions at site II are recessed ca. 0.34(1) A and 1.91(1) A into the supercage, respectively. In this work, the highest exchange level of Cs+ ions per unit cell was achieved in zeolite X by conventional aqueous solution methods and it was also shown that Cs+ ion could pass through the sixoxygen rings.

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.2
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• pp.157-170
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• 2001

The bond strength is the most important factor in establishing long-term success of resin-retained fixed prostheses. So, various surface treatment methods have been introduced to improve the bond strength of metal surface and bonding resin till now This study was performed to compare the effect of silicoating with that of metal primer and analyze the correlation between treatment time of sandblasting and the bond strength, so that meant to find more effective surface treatment method that could enhance the bond strength of resin-retained fixed prostheses. The surfaces of all specimens made of $Verabond^{(R)}$ alloys were air abraded with $250{\mu}m\;Al_2O_3$ according to treatment time of sandblasting and they were subdivided to be treated with only sandblasting(S group), silicoating following sandblasting(SS group) and metal primer application after sandblasting(SM group). Then pairs of metal specimens (${\phi}10mm{\times}h\;2mm,\;{\phi}6{\times}h\;2mm$) were bonded with Super bond $C&B^{(R)}$. The specimens were stored in $38^{\circ}C$ water for 48 hours and shear bond strength was measured using the universal testing machine. The results were as follows, 1. In the comparison of shear bond strength according to treatment time of sandblasting, bond strength was increased in the order of 0', 15', 30', 45', 60' group. 0' group had significantly lower value than any other, while 0', 15' group were significantly different with 30', 45', 60' group(p<0.05). 2. In the comparison of shear bond strength according surface treatment methods, bond strength was increased in the order of S group. SS group and SM group. S group was significantly different with SS group and SM group(p<0.05). 3. Observing the mode of bond failure. 0', 15' group showed only adhesive failure, and 30', 45', 60' group did mostly adhesive & cohesive failure in S group. In SS group and SM group, all other groups except 0', 15' group showed mostly cohesive failure. From the above results, it is considered that sandblasting should be treated for more than 30 seconds, and metal primer be more effective and available clinically than silicoater system which is complicate, technique-sensitive and time-consuming method, when nonprecious metal surface is planning be treated with in order enhance the bond strength of resin-retained fixed prostheses.