• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.125-128
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• 2023

Recently, as the process of the MOS device becomes more detailed, and the degree of integration thereof increases, many problems such as leakage current due to an increase in electron tunneling due to the thickness of SiO₂ used as a gate oxide have occurred. In order to overcome the limitation of SiO₂, many studies have been conducted on HfO₂ that has a thermodynamic stability with silicon during processing, has a higher dielectric constant than SiO₂, and has an appropriate band gap. In this study, HfO₂, which is attracting attention in various fields, was doped with Al and the change in properties according to its concentration was studied. Al-doped HfO₂ thin film was deposited using Plasma Enhanced Atomic Layer Deposition (PEALD), and the structural and electrical characteristics of the fabricated MIM device were evaluated. The results of this study are expected to make an essential cornerstone in the future field of next-generation semiconductor device materials.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1260-1261
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• 2008

Aluminium doped zinc oxide (ZnO:Al) thin film has emerged as one of the most promising transparent conducting electrode in flat panel displays(FPD) and in photovoltaic devices since it is inexpensive, mechanically stable, and highly resistant to deoxidation. In this paper ZnO:Al thin film was deposited on the polyethylene terephthalate(PET) substrate by the capacitively coupled r.f. magnetron sputtering method. Wide ranges of bias voltage, -30V${\sim}$45V, was applied to the growing films as an additional energy instead of substrate heating, and the effect of positive and negative bias on the film structure and electrical properties of ZnO:Al films was studied and discussed. The results showed that a bias applied to the substrate during sputtering contributed to the improvement of electrical properties of the film by attracting ions and electrons in the plasma to bombard the growing films. These bombardments provided additional energy to the growing ZnO film on the substrate, resulting in significant variations in film structure and electrical properties. The film deposited on the PET substrate at r. f. discharge power of 200 W showed the minimum resistivity of about $2.4{\times}10^{-3}{\Omega}-cm$ and a transmittance of about 87%.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.431-431
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• 2013

Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

• Solar Energy
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• v.6 no.2
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• pp.70-75
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• 1986

The fabrication procedure and characteristics of $Ta_2O_5/Al/SiO_2/p-Si$ MIS solar cells forming a fine grating pattern of aluminum evaporated on to p-type silicon crystal are discribed. The proper temperature for oxide growing of these cells was found to be about $450^{\circ}C$ for 20 minutes with oxygen flow. The conversion efficiency increased about 3% after $750{\AA}$ thickness of tantalium silica film spin on anti-reflective coating. The best results showed that $V_{oc}=0.545V,\;J_{sc}=34mA$ and F.F = 0.65, which represent that the conversion efficiency is 12%.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.411.1-411.1
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• 2016

In this study, we examined the effects of boron doping on the dielectric reliability of solution processed aluminum oxide ($Al_2O_3$). When boron is doped in aluminum oxide, the hysteresis reliability is improved from 0.5 to 0.4 V in comparison with the undoped aluminum oxide. And the accumulation capacitance is increased when boron was doped, which implying the reduction of the thickness of dielectric film. The improved dielectric reliability of boron-doped aluminum oxide is originated from the small ionic radius of boron ion and the stronger bonding strength between boron and oxygen ions than that of between aluminum and oxygen ions. Strong boron-oxygen ion bonding in aluminum oxide results dielectric film denser and thinner. The leakage current of aluminum oxide also reduced when boron was doped in aluminum oxide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.188-193
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• 1997

ZnO thin film had been deposited on the glass 7r sputtering method, and investigated by electrical and structural properties. When the rf power was 188W and sputtering pressure was 1$\times$10$^{-3}$ Torr at room temperature, Al-doped ZnO thin film had the lowest resistivity(1$\times$10$^{-4}$ $\Omega$.cm), and then carrier concentration and Hall mobility were 6.27$\times$10$^{20}$ cm$^{-3}$ and 22.04$\textrm{cm}^2$/V.s, respectively. And undoped ZnO thin film had about 10$^{14}$ $\Omega$.cm resistivity when oxygen content was 10% or more at room temperature. The surface morphology of ZnO thin film observed by SEM was overall uniform when oxygen content was 50% below and sputtering pressure was 1.0$\times$10$^{-1}$ Torr.

• Journal of the Korean institute of surface engineering
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• v.41 no.4
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• pp.142-146
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• 2008

Trivalent ions(Ga, Al, In) doped ZnO films were deposited by DC magnetron sputtering on non-alkali glass substrate at substrate temperature of $300^{\circ}C$. We used the different three types of high density($95%{\sim}$) ceramic sintered disks(doped with $Ga_2O_3$; 6.65 wt%, $Al_2O_3$; 3.0 wt%, $In_2O_3$; 9.54 wt%). This study examined the effect of different dopants(Ga, Al, In) on the electrical, structural, and optical properties of the films. The lowest resistivity of $5.14{\times}10^{-4}{\Omega}cm$ and the highest optical band gap of 3.74 eV were obtained by Ga doped ZnO(GZO) film. All the films had a preferred orientation along the(002) direction, indicating that the growth orientation has a c-axis perpendicular to the substrate surface. The average transmittance of the films was more than 85% in the visible range.

• Transactions of the Korean hydrogen and new energy society
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• v.22 no.3
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• pp.319-325
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• 2011

The electrical properties of sputtered GDC thin films on $Al_2O_3$ substrates was studied. The electrical properties of the films were measured to evaluate the ion conductivity of GDC thin films for co-planar SOFC electrolytes. The impedance of the GDC thin films on $Al_2O_3$ substrates was affected by the film thickness and the impedance of thin film exhibited higher value than thick films. Similarly, the conductivity of the thick film showed much higher value than thin films. It indicated that the film thickness is the main factor affecting the conductivity and impedance of the GDC electrolyte for the co-planar SOFC.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.276-277
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• 2006

In order to accelerate the sintering of Al-Bronze powder covered with passive oxide film, we focused on the way to add Al-Ca fluoride consisting of $AlF_3$ and $CaF_2$, examined the effect of the $CaF_2$ mixing rate in Al-Ca fluoride, the amount of the added Al-Ca fluoride and the sintering temperature on sintering properties of Al-Bronze powder and considered the mechanism of the sintering acceleration. Al-Bronze powder was sintered most effectively by adding Al-Ca fluoride with the $CaF_2$ mixing rate of 20mass%. If the amount of added fluoride was over 0.05mass% and the sintering temperature was over 1123K, the sintering acceleration of the Al-Bronze powder appears. Regarding the mechanism of the sintering acceleration, it was presumed that $Al_2O_3$ film on the surface of the Al-Bronze particles was removed in the process of the formation of gaseous AlOF by the reaction with $AlF_3$, and the reaction was accelerated further by the presence of the liquid phase which is formed in Al-Ca fluoride.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.77-81
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• 2010

The AZO thin films were deposited on the corning 1737 glass plate by the RF magnetron sputtering and effects of working pressure and oxygen contents on the electrical properties were investigated. XRD spectra showed a preferred orientation along the c-axis and a minimum FWHM for the 70mTorr. From the surface analysis (AFM), the number of crystal grain of AZO thin film increased as working pressure increased. The film deposited with 70mTorr of working pressure showed n-type semiconductor characteristic having suitable resistivity $-1.59{\times}10^{-2}{\Omega}cm$, carrier concentration $-10.1{\times}10^{19}cm^{-3}$, and mobility $-4.35cm^2V^{-1}s^{-1}$ while other films by 7 mTorr, 20 mTorr of working pressure closed to metallic films. The films including the oxygen represent stoichiometric composition similar to the oxide. The transmittance of the film was over 85% in the visible light range regardless of the changes in working pressure and oxygen contents.