• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1331-1332
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• 2007

In the present works, we investigate the thermal characteristics on Ag/$As_{2}S_{3}$ and Ag/$As_{40}Ge_{10}Se_{15}S_{35}$ amorphous chalcogenide thin film structure for PMC (Programmable Metallization Cell).As the results of resistance change with the temperature on Ag/$As_{40}Ge_{10}Se_{15}S_{35}$ amorphous chalcogenide thin film, the resistance was abruptly dropped from the initial resistance of 1.32 M ${\Omega}$ to the saturated value of 800 ${\Omega}$ at $203^{\circ}C$. On the other hand, the resistance increased to 1.3 $M{\Omega}$ at $219^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.139-144
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• 2001

In this study, we have investigated the photoinduced birefringence of Ag plarized-photodoping in double-layer of Ag doped chalcognide thin films and dependence of polarization states in chalcogenide thin films. Also, we have investigated the polarization dependence of photoinduced birefringence and the anisotropy of absorption in an amorphous As$\sub$40/Ge$\sub$10/Se$\sub$15/S$\sub$35/ chalcogenide thin films using two 632.8nm He-Ne lasers, which have a smaller energy than the optical energy gap (E$\sub$OP/) of the film, i.e., an exposure of sub-bandgap light (hν$\sub$op/). The photoinduced phenomena of Ag polarized-photodooping increasing the linear dichroism(d), about 84% and birefringence(Δn), about 23%. It will offer lots of information for the photodoping mechanism and analysis of chalcogenide thin films.

• Proceedings of the Korea Crystallographic Association Conference
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• 2000.11a
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• pp.24-24
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• 2000

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.05a
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• pp.20-20
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• 2002

• Journal of the Korean Society of Marine Environment & Safety
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• v.18 no.2
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• pp.67-83
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• 2012

In order to evaluate die geochemical characteristics of sediment in a semi-enclosed bay used as shellfish and fish farming area, the concentrations of metallic(V, Cr, Mn, Fe, Co. Ni, Cu, Zn, Ag, Cd, Hg, Ph, As) and non-metallic(P, Se) elements and uranium were measured in the surface sediment samples collected from 19 stations of Gamak Bay in April 2010. Metal contamination status in the sediments were also evaluated using the sediment quality guidelines(SQGs) proposed by the National Oceanic and Atmospheric Administration(NOAA) and the enrichment factor(EF). The concentrations of elements in sediment were mainly controlled by quartz-dilution effect(V, Cr, Fe, Co and Ni), the dilution effect of organic matter(Cd and U), and metal redistribution by the decomposition of organic matter(Mn, Ag, As, and Se). The concentrations of metals, except As and Ni, in sediments from all sampling stations were lower than ERL values of NOAA. Conclusively, the surface sediment of Gamak Bay was slightly polluted with Ni, Ag, Cd, and Cd but was not polluted with other elements on the basis of EF results. Our results suggest that the surface sediment in Gamak Bay is not polluted by metallic elements.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.2
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• pp.293-298
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• 2001

EB-NMP free standing film is manufactured from NMP solution of polyaniline(emeraldine base EB). Also ES(emeraldine salt EB . HCl) film is manufactured by doping of EB-NMP film with 1 mole HCI aqueous solution. And EB-mixture films containing conductor(carbon black, graphite, Ag etc.) are prepared, In this study, electromagnetic interference shielding efficiency(EMI SE) of ES free standing film ($\sigma$=5 S/cm, t=0.14mm) is 23~25 dB in the frequency range of 10 MHz~1 GHz. ES-mixture(carbon black, graphite, Ag etc.) films, polyaniline film doped camphorsulfonic acid(CSA) show higher EMI SE(30~34 dB, 36~42 dB, 44~52 dB, 34~43 dB) property than that of ES free standing film, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.41-46
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• 2010

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.177-177
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• 2013

DC 마그네트론 스퍼터링을 이용하여 열처리 온도 변화에 따른 금속 박막의 물성 변화 및 특성 분석을 위해 유리기판 위에 박막의 두께 10 nm로 증착하여 열처리 공정을 진행하였다. 상온에서 Ag 박막의 비저항은 평균 $6.9{\times}10^{-6}{\Omega}.cm$로 Cu 박막의 $4.9{\times}10^{-5}{\Omega}.cm$보다 낮은 전기 전도성을 가지는 것을 확인 할 수 있었다. 또한 Ag 박막은 열처리 온도의 증가와 관계없이 전기전도성에 대한 큰 차이가 없으나 Cu 박막의 경우 열처리 온도 $150^{\circ}C$에서 $2.5{\times}10^{-4}{\Omega}.cm$로 비저항의 변화를 가졌다. 광학적 특성으로 Ag 박막은 58%에서 42%로 감소하는 반면 Cu 박막은 50%에서 75%이상의 광 투과도를 가지는 것을 확인 하였다.

• Bulletin of the Korean Chemical Society
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• v.14 no.1
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• pp.82-86
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• 1993

Two crystal structures of dehydrated $Ag_{3.3}Ca_{4.35}-A ({\alpha} = 12.256(2){\AA})$ and of its ethylene sorption complex (${\alpha} = 12.259(2){\AA}$) have been determined by single-crystal X-ray diffraction techniques in the cubic space group Pm3m at 21(l)$^{\circ}$C. Both crystals were dehydrated at 360$^{\circ}$C and $2{\times}10^{-6}$ Torr for 2 days and one crystal was treated with 200 Torr of ethylene at 24(2)$^{\circ}$C. The structures were refined to final error indices, $R_1$=O.065 and $R_2$ = 0.088 with 202 reflections and $R_1$=0.049 and $R_2$ = 0.044 with 259 reflections, respectively, for which I>3${\sigma}$(I). In these structures, all Ag$^+$ and Ca$^{2+}$ ions are located on two and three different threefold axes associated with 6-ring oxygens, respectively. In $Ag_{3.3}Ca_{4.35}-A{\cdot}6.65\;C_2H_4,\;3.3\;Ag^+\;and\;3.35\;Ca^{2+}$ ions are recessed 1.09 ${\AA}$ and 0.21 ${\AA}$, respectively, into the large cavity from the (111) plane at O(3). Each Ag$^+$ and Ca$^{2+}$ ion in the large cavity forms a complex with one $C_2H_4$$^{2+}$ ions and ethylene molecules are longer than those between Ag$^+$ ions and ethylene molecules.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.