• Korean Journal of Materials Research
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• v.12 no.11
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• pp.845-849
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• 2002

Alloys of $Fe_3$Al, $Fe_3$Al-6Cr, $Fe_3$Al-4Cr-1Mo, $Ni_3$Al, and $Ni_3$Al-2.8Cr were oxidized at $1000^{\circ}C$ in air, and the oxide scales formed were studied using XRD. SEM, EPMA, and TEM. The oxide scales that formed on $Fe_3$Al-based alloys consisted primarily of $\alpha$-$Al_2$$O_3$ containing a small amount of dissolved Fe and Cr ions, whereas those that formed on $Ni_3$Al-based alloys consisted primarily of $\alpha$-$Al_2$$O_3$, together with a small amount of $NiAl_2$$O_4$, NiO and dissolved Cr ions. For the entire alloys tested, nonadherent oxide scales formed, and voids were inevitably existed at the scale-matrix interface.

• Korean Journal of Materials Research
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• v.12 no.8
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• pp.656-660
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• 2002

It was investigated that $Al_2$$O_3$/Cu nanocomposite powder could be optimally prepared by dispersion and reduction of Cu oxide, and suitably consolidated by employing pulse electric current sintering (PECS) process. $\alpha$-$Al_2$$O_3$ and CuO powders were used as elemental powders. In order to obtain $Al_2$O$_3$ embedded by finely and homogeneously dispersed CuO particles, the elemental powders were high energy ball milled at the rotating speed of 900 rpm, with the milling time varying up to 10 h. The milled powders were heat treated at $350^{\circ}C$ in H$_2$ atmosphere for 30 min to reduce CuO into Cu. The reduced powders were subsequently sintered by employing PECS process. The composites sintered at $1250^{\circ}C$ for 5 min showed the relative density of above 98%. The fracture toughness of the $Al_2$$O_3$/Cu nanocomposite was as high as 4.9MPa.$m^{1}$2//, being 1.3 times the value of pure $Al_2$$O_3$ sintered under the same condition.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.304.2-304.2
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• 2016

Hafnium oxide-aluminum oxide (HfO2-Al2O3) dielectric films have been fabricated by Pulsed Laser Deposition (PLD), and their properties are studied in comparison with HfO2 films. As a gate dielectric of the TFT, in spite of its high dielectric constant, HfO2 has a small energy band gap and microcrystalline structure with rough surface characteristics. When fabricated by the device, it has the drawback of generating a high leakage current. In this study, the HfAlO films was obtained by Pulsed Laser Deposition with HfO2-Al2O3 target(chemical composition of (HfO2)86wt%(Al2O3)14wt%). The characteristics of the thin Film have been investigated by x-ray diffraction (XRD), atomic force microscopy (AFM) and spectroscopic ellipsometer (SE) analyses. The X-ray diffraction studies confirmed that the HfAlO has amorphous structure. The RMS value can be compared to the surface roughness via AFM analysis, it showed HfAlO thin Film has more lower properties than HfO2. The energy band gap (Eg) deduced by spectroscopic ellipsometer was increased. HfAlO films was expected to improved the interface quality between channel and gate insulator. Apply to an oxide thin Film Transistors, HfAlO may help improve the properties of device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.6
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• pp.575-579
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• 2008

Al-doped p-type ZnO films were fabricated on n-Si (100) and homo-buffer layers in pure oxygen at $450^{\circ}C$ of by RF magnetron sputtering. Target was ZnO ceramic mixed with 2 wt% $Al_2O_3$. XRD spectra show that the Al-doped ZnO thin films have ZnO crystal structure and homo-buffer layers are beneficial to Al-doped ZnO films to grow along c-axis. Hall Effect experiments with Van der Pauw configuration show that p-type carrier concentrations are ranged from $1.66{\times}10^{16}$ to $4.04{\times}10^{18}\;cm^{-3}$, mobilities from 0.194 to $2.3\;cm^2V^{-1}s^{-1}$ and resistivities from 7.97 to $18.4\;{\Omega}cm$. p-type sample has density of $5.40\;cm^{-3}$ which is smaller than theoretically calculated value of $5.67\;cm^{-3}$. XPS spectra show that Ols has O-O and Zn-O structures and Al2p has only Al-O structure. P-ZnO:Al/n-ZnO:Al junctions were fabricated by magnetron sputtering. V-I curves show that the p-n junctions have rectifying characteristics.

• Korean Chemical Engineering Research
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• v.60 no.1
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• pp.159-168
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• 2022

Catalytic activity in ammonia decomposition reaction was studied on Mo-Al nitride obtained through temperature programmed nitridation of calcined Mo-Al mixed oxide prepared by varying the MoO₃ quantity in the range of 10-50 wt%. N₂ sorption analysis, X-ray diffraction analysis (XRD), X-ray photoelectron spectroscopy (XPS) and H₂-temperature programmed reduction (H₂-TPR), and transmission electron microscopy (TEM) to investigate the physicochemical properties of the prepared catalyst were performed. After calcination at 600 ℃, the XRD of Mo-Al oxide showed γ-Al₂O₃ and Al₂(MoO₄)₃ phases, and the nitride after nitridation showed an amorphous form. The specific surface area after nitridation by topotactic transformation of MoO₃ to nitride was increased due to the formation of Mo nitride, and the Mo nitride was observed to be supported on γ-Al₂O₃. As for the catalytic activity in the ammonia decomposition reaction, 40 wt% MoO₃ showed the best activity, and as the nitridation time increases, the activity increased, and thus the activation energy decreased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.10
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• pp.754-759
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• 2013

Aluminum oxide($Al_2O_3$) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surfaces. Since $Al_2O_3$ has fixed negative charge, it forms effective surface passivation by field effect passivation on the rear side in p-type silicon solar cell. However, $Al_2O_3$ layer formed by ALD process needs very long process time, which is not applicable in mass production of silicon solar cells. In this paper, plasma-assisted ALD(PA-ALD) was applied to form $Al_2O_3$ to reduce the process time. $Al_2O_3$ synthesized by ALD on c-Si (100) wafers contains a very thin interfacial $SiO_2$ layer, which was confirmed by FTIR and TEM. To improve passivation quality of $Al_2O_3$ layer, the deposition temperature was changed in range of $150{\sim}350^{\circ}C$, then the annealing temperature and time were varied. As a result, the silicon wafer with aluminum oxide film formed in $250^{\circ}C$, $400^{\circ}C$ and 10 min for the deposition temperature, the annealing temperature and time, respectively, showed the best lifetime of 1.6ms. We also observed blistering with nanometer size during firing of $Al_2O_3$ deposited on p-type silicon.

• Electrical & Electronic Materials
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• v.8 no.3
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• pp.306-315
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• 1995

본 논문에서는 $Al_{2}$ $O_{3}$박막을 GAIVBE(Gas Assisted Ionized Vapour Beam Epitaxy)기법에 의해 저온에서 300-1,400.angs.의 두께로 성장하여 그 조건을 제시하였다. 아울러 Al-Al$_{2}$ $O_{3}$-Si의 MOS구조를 제작하여 전기적 특성을 고찰하고 그 결과를 분석, 제시하므로써 GAIVBE기법에 의해 저온으로 형성된 $Al_{2}$ $O_{3}$막의 활용 가능성을 보고하였다. 한편, 본 연구에서 제작한 $Al_{2}$ $O_{3}$막의 저항율은 막의 두께 100-1,000.angs.인 시료제작에서 $10^{8}$ohm-cm 와 $10^{13}$ohm-cm로 측정되었고, 비유전율은 9.5-10.5, 절연파괴강도 6-7MV/cm(+바이어스)와 11-12MV/cm(-바이어스)이었다.

• Journal of the Korean Ceramic Society
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• v.24 no.4
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• pp.369-375
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• 1987

The effects of dopant Al2O3 and surface roughness on the photoelectrochemical conversion of TiO2 ceramic electrodes were investigated. The photocurrent increased with increasing the amount of dopant Al2O3 up to 0.1wt% and 0.05wt% in the specimens reduced at 700$^{\circ}C$ and 800$^{\circ}C$, respectively, and then decreased. However, the photoresponse appeared around 415 nm, which very closely corresponds to the energy band gap of TiO2(∼3.0eV), regardless of reduction temperature and the amount of Al2O3. And the photocurrent increased with increasing surface roughness in the undoped TiO2 ceramic electrode.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.11
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• pp.1108-1114
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• 2007

The low kinds of $Al_2O_3$ composite ceramics were prepared using a mixture of 85 wt.% $Al_2O_3$ (mean size $0.5\;{\mu}m$), 15 wt.% SiC Powder with $Y_2O_3$, as an additive powder (0, 1, 3 and 5 wt.%). The crack-healing strengths were studied as functions of crack-healing temperature and amount of $Y_2O_3$. The in-situ crack-healing behavior was observed at 1,573 K for 1 h in the air. The heat treated specimen with 3 wt.% of $Y_2O_3$ showed better crack-healing ability than specimen with 1 or 5 wt.% of $Y_2O_3$. In case of specimen with 3 wt.% of $Y_2O_3$, the bending strength of the crack-healed specimen at 1,473 K was recovered to the bending strength of smooth specimen treated at 1573 K. The heat-resistance limit temperature of $Al_2O_3$ composite ceramics was 1,073 K, 1,373 K, 873 K for the specimen with 1, 3, 5 wt.% of $Y_2O_3$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.14 no.1
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• pp.5-14
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• 1977

"Electrical Properties of Barium Titanates with Addition Sb2O3." PTC BaTiO3 in low resistance at room temperature was prepatred. Al2O3, SiO2 and TiO2 were doped with a view to improving reproduction. Sb2O3 was doped as impurity in order to control of resistivity of the specimens. The relations between the amount of Sb3O3 and electrical properties wereinvestigated. Of the compositions studied, additions of 3.75mole% Al2O3, 1.25mole% SiO2, 2.25mole% TiO2 and 0.16~0.25wt% Sb2O3 to BaTiC3 was low resistivity in 14-300 ohm-cm.00 ohm-cm.