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A Development of High-Durability Copper Foil Materials for Clock Spring Cable Using Grain Size Control Techniques

결정립 제어 기술을 이용한 클락스프링 케이블용 고내구 동박 소재 개발

  • Received : 2021.01.28
  • Accepted : 2021.08.23
  • Published : 2021.09.30

Abstract

Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

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References

  1. H.D. Merchant, M.G. Minor, S.J. Clouser, 1998, 18㎛ electrodeposited copper foil for flex fatigue applications, Circuit World 25, 28.
  2. IPC Standard, 1996, The institute for Interconnection and Packaging Electronics Circuit (IPC) Standard, TM-650.
  3. T. Hatano, Y. Kurosawa, J. Miyake, 2000, Effect of Material Processing on Fatigue of FPC Rolled Copper Foil, Journal of Electronic Materials, 29-5.
  4. Joseph R. Davis, 2001, Copper and Copper Alloys, 4, 36.